Semiconductor device and method of manufacturing the same, and electronic apparatus

1. A semiconductor device comprising:

a first semiconductor section (1) including a first wiring layer at one side thereof and (2) having a circuit region and a pixel region;

a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together with the respective first and second wiring layer sides of the first and second semiconductor sections facing each other;

an insulation layer and a planarizing layer on another side of the first semiconductor section in that order, the planarizing layer having a concavity in an outer surface thereof, the concavity being outside of the circuit and pixel regions; and

a conductive material extending from the concavity and through the first semiconductor section to the second wiring layer of the second semiconductor section and by means of which the first and second wiring layers are in electrical communication.

2. The semiconductor device of claim 1 wherein, the first semiconductor section and the second semiconductor section are secured by plasma bonding.

3. The semiconductor device of claim 1 wherein, the first semiconductor section and the second semiconductor section are secured by an adhesive.

4. The semiconductor device of claim 1 wherein, the circuit region is between the pixel region and the concavity.

5. The semiconductor device of claim 4 , wherein the conductive material is formed in the concavity in the planarizing layer.

6. The semiconductor device of claim 5 , further comprising a light shielding film over the first semiconductor section in the control region of the semiconductor device.

7. A method of manufacturing a semiconductor device including the steps of:

providing a first semiconductor section (1) including a first wiring layer at one side thereof and (2) having a circuit region and a pixel region;

providing a second semiconductor section including a second wiring layer at one side thereof;

bonding the first semiconductor section to the second semiconductor section with the respective first and second wiring layer sides of the first and second semiconductor sections facing each other;

forming an insulation layer and a planarizing layer on another side of the first semiconductor section in that order, the planarizing layer having a concavity in an outer surface thereof, the concavity being outside of the circuit and pixel regions; and

providing a conductive material extending from the concavity and through the first semiconductor section to the second wiring layer of the second semiconductor section so that the first and second wiring layers are in electrical communication.

8. The method of claim 7 wherein, the first semiconductor section and the second semiconductor section are secured by plasma bonding.

9. The method of claim 7 wherein, the first semiconductor section and the second semiconductor section are secured by an adhesive.

10. The method of claim 7 wherein, the circuit region is between the pixel region and the concavity in the planarizing layer.

11. The method of claim 10 , wherein the conductive material is formed in the concavity of the planarizing layer.

12. The method of claim 11 , further comprising the step of forming a light shielding film over the first semiconductor section in the control region of the semiconductor device.

13. A semiconductor device comprising:

a first semiconductor section (1) including a first wiring layer on one side and a device layer on the opposite side of the first wiring layer and (2) having a circuit region and a pixel region;

a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together with the respective first and second wiring layer sides of the first and second semiconductor sections facing each other;

an insulation layer and a planarizing layer on another side of the first semiconductor section in that order, the planarizing layer having a concavity in an outer surface thereof, the concavity being outside of the circuit and pixel regions;

a first conductive material which extends from the concavity and through the device layer of the first semiconductor section to a connection point in the first wiring layer of the first semiconductor section; and

a second conductive material which extends from the concavity and through the first semiconductor section to a connection point in the second wiring layer of the second semiconductor section, the first and second conductive materials being connected within the concavity such that the first and second wiring layers are in electrical communication.

14. The semiconductor device of claim 13 wherein, the first semiconductor section and the second semiconductor section are secured by plasma bonding.

15. The semiconductor device of claim 13 wherein, the first semiconductor section and the second semiconductor section are secured by an adhesive.

16. The semiconductor device of claim 13 wherein, the circuit region is between the pixel region and the concavity.

17. The semiconductor device of claim 16 , wherein the first and second conductive materials are formed in the concavity of the planarizing layer.

18. The semiconductor device of claim 17 , further comprising a light shielding film formed over the first semiconductor section in the circuit region of the semiconductor device.

19. A method of manufacturing a semiconductor device including the steps of:

providing a first semiconductor section (1) including a first wiring layer on one side and a device layer on the opposite side of the first wiring layer and (2) having a circuit region and a pixel region;

providing a second semiconductor section including a second wiring layer at one side thereof;

bonding the first semiconductor section to the second semiconductor section with the respective first and second wiring layer sides of the first and second semiconductor sections facing each other;

forming an insulation layer and a planarizing layer on another side of the first semiconductor section in that order, the planarizing layer having a concavity in an outer surface thereof, the concavity being outside of the circuit and pixel regions;

providing a first conductive material which extends from the concavity and through the device layer of the first semiconductor section to a connection point in the first wiring layer of the first semiconductor section; and

providing a second conductive material which extends from the concavity and through the first semiconductor section to a connection point in the second wiring layer of the second semiconductor section, the first and second conductive materials being connected within the concavity such that the first and second wiring layers are in electrical communication.

20. The method of claim 19 wherein, the first semiconductor section and the second semiconductor section are secured by plasma bonding.

21. The method of claim 19 wherein, the first semiconductor section and the second semiconductor section are secured by an adhesive.

22. The method of claim 19 wherein, the circuit region is between the pixel region and the concavity.

23. The method of claim 22 , wherein the first and second conductive materials are formed in the concavity.

24. The semiconductor device of claim 23 , further comprising a light shielding film formed over the first semiconductor section in the control region of the semiconductor device.

25. An electronic apparatus including:

an optical unit; and

an imaging unit including

(a) a first semiconductor section (1) including a first wiring layer and a device layer on the first wiring layer and (2) having a circuit region and a pixel region,

(b) a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together with the respective first and second wiring layer sides of the first and second semiconductor sections facing each other,

(c) an insulation layer and a planarizing layer on another side of the first semiconductor section in that order, the planarizing layer having a concavity in an outer surface thereof, the concavity being outside of the circuit and pixel regions,

(d) a first conductive material which extends from the concavity and through the device layer of the first semiconductor section to a connection point in the first wiring layer of the first semiconductor section, and

(e) a second conductive material which extends through the first semiconductor section to a connection point in the second wiring layer of the second semiconductor section, the first and second conductive materials being connected within the concavity such that the first and second wiring layers are in electrical communication.

26. The apparatus of claim 25 further comprising a shutter device between the optical unit and the imaging unit.

27. A semiconductor device comprising:

a first semiconductor section including a first wiring layer at one side thereof;

a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together with the respective first and second wiring layer sides of the first and second semiconductor sections facing each other;

a plurality of first conductive materials which extend through the device layer of the first semiconductor section to a connection point in the first wiring layer of the first semiconductor section, and

a plurality of second conductive materials which extend through the first semiconductor section to a connection point in the second wiring layer of the second semiconductor section,

wherein

the first and second conductive materials are arranged alternately in a first direction across the first semiconductor section, and

the first and second conductive materials are arranged alternately a second direction across the first semiconductor section, the first and second directions being orthogonal to each other.