Method of manufacturing an ultrasound imaging transducer acoustic stack with integral electrical connections

1. A method of fabricating an ultrasound transducer, the method comprising the steps of:

bonding a block of piezoelectric material having a conductive coating to a flex circuit having (a) a first conductive region disposed on an insulating substrate and (b) at least 20 conductive traces that are disposed on the insulating substrate and are in electrical contact with the first conductive region, so that the block of the piezoelectric material bonds to the first conductive region; and

dicing the block of the piezoelectric material into at least 20 transducer elements, wherein the dicing step is controlled so as to cut all the way through the block of the piezoelectric material and all the way through the first conductive region, and part way through, but not completely through, the insulating substrate, and wherein the dicing step is performed at positions that are aligned with respect to the at least 20 conductive traces so that after the dicing step is implemented, (a) the first conductive region is divided into at least 20 regions that are electrically isolated from each other, and (b) each of the at least 20 regions is in electrical contact with a respective one of the at least 20 conductive traces;

disposing a matching layer on top of the block of the piezoelectric material after the dicing step is completed; and

affixing a backing layer beneath the flex circuit.

2. The method of claim 1 , wherein each of the at least 20 transducer elements has a conductive electrical interface with a respective one of the at least 20 conductive traces.

3. The method of claim 1 , wherein each of the at least 20 transducer elements has a capacitively coupled electrical interface with a respective one of the at least 20 conductive traces.

4. The method of claim 1 , wherein the at least 20 transducer elements are diced at a pitch between 100 and 200 μm, and the transducer elements are between 150 and 400 μm thick.

5. The method of claim 4 , wherein the at least 20 conductive traces are spaced at a regular pitch, and the block of the piezoelectric material is diced in the dicing step at a regular pitch that matches the pitch of the at least 20 conductive traces, in a direction that is parallel to the at least 20 conductive traces.

6. The method of claim 5 , wherein the bonding step comprises bonding the block of the piezoelectric material to the first conductive region using an electrically insulating adhesive.

7. The method of claim 1 , wherein a thickness of the insulating substrate is below ¼ wavelength at an operating frequency of the transducer, and wherein a thickness of the first conductive region is below ¼ wavelength at the operating frequency.

8. The method of claim 1 , wherein the insulating substrate is a layer of polyimide that is about 25 μm thick.

9. The method of claim 8 , wherein the first conductive region is a layer of copper that is about 17.5 μm thick.

10. A method of fabricating an ultrasound transducer, the method comprising the steps of:

bonding a block of piezoelectric material having a conductive coating to a flex circuit having at least 20 parallel conductive traces disposed on an insulating substrate, so that that the block of the piezoelectric material bonds with a distal end of the at least 20 parallel conductive traces;

dicing the block of the piezoelectric material into at least 20 transducer elements, wherein the dicing step is controlled so as to cut all the way through the block of the piezoelectric material and part way through, but not completely through, the insulating substrate, and wherein the dicing step is performed at positions that are aligned with respect to the at least 20 parallel conductive traces so that after the dicing step is implemented, the at least 20 transducer elements are electrically isolated from each other, with each of the at least 20 transducer elements bonded to a respective one of the at least 20 parallel conductive traces;

disposing a matching layer on top of the block of the piezoelectric material after the dicing step is completed; and

affixing a backing layer beneath the flex circuit.

11. The method of claim 10 , wherein each of the at least 20 transducer elements has a conductive electrical interface with a respective one of the at least 20 parallel conductive traces.

12. The method of claim 10 , wherein each of the at least 20 transducer elements has a capacitively coupled electrical interface with a respective one of the at least 20 parallel conductive traces.

13. The method of claim 10 , wherein the at least 20 transducer elements are diced at a pitch between 100 and 200 μm, and the transducer elements are between 150 and 400 μm thick.

14. The method of claim 13 , wherein the at least 20 parallel conductive traces are spaced at a regular pitch, and the block of the piezoelectric material is diced in the dicing step at a regular pitch that matches the pitch of the conductive traces, in a direction that is parallel to the at least 20 parallel conductive traces.

15. The method of claim 13 , wherein the bonding step comprises bonding the block of the piezoelectric material to the first conductive region using an electrically insulating adhesive.

16. The method of claim 10 , wherein a thickness of the insulating substrate is below ¼ wavelength at an operating frequency of the transducer, and wherein a thickness of the conductive traces is below ¼ wavelength at the operating frequency.

17. The method of claim 10 , wherein the insulating substrate is a layer of polyimide that is about 25 μm thick.

18. The method of claim 17 , wherein the conductive traces are copper and are about 17.5 μm thick.