Ultrasonic probe and ultrasonic diagnosis device
An ultrasonic probe and an ultrasonic diagnosis device which can improve electrical safety for an operator are provided. The ultrasonic probe 2 has an insulating portion 62 between a mounting board 43 and a case 25 . Since electrical leakage from the internal device of the ultrasonic probe 2 can be prevented, electrical safety of the ultrasonic probe 2 for the operator can be improved. A conductive film 61 is provided on the ultrasonic wave radiation side of a cMUT chip 20 , and a conductive member 63 is provided along the insulating member 62 . A conductive film 61 and a conductive member 63 are connected by a conductive member 64 . A closed space having a ground potential is formed by the conductive film 61 , the conductive member 63 and a coaxial cable 55 connected to ground. Main components or the body circuits of the ultrasonic probe 2 are contained in the closed space having the ground potential and shielded electrically from the outside.
1. An ultrasonic probe comprising:
a Capacitive Micromachined Ultrasonic Transducer (cMUT) chip having a plurality of vibration elements to transmit or receive an ultrasonic wave;
a mounting board on which electrical parts for controlling the vibration elements are mounted;
an electrical wiring portion to connect the mounting board and the cMUT chip;
a casing portion for storing the cMUT chip, the mounting board and the electrical wiring portion; and
an acoustic lens for converging the ultrasonic wave from the cMUT chip;
wherein an insulating portion is provided between the mounting board and the casing portion;
wherein the cMUT chip, the electrical wiring portion and the mounting board are stored in a closed space formed by a conductive film and a ground layer having a ground potential;
wherein a part of the ground layer is provided along an ultrasonic wave radiation side of the cMUT chip and is provided along a backward side of the acoustic lens.
2. The ultrasonic probe according to claim 1 , wherein the insulating portion is provided along a surface of the electrical wiring portion.
3. The ultrasonic probe according to claim 1 , wherein the insulating portion is provided so as to cover the overall periphery of the mounting board.
4. The ultrasonic probe according to claim 1 , wherein the insulating portion is provided along an inner surface of the casing portion.
5. The ultrasonic probe according to claim 1 , wherein the insulating portion includes an insulating member of silicon oxide or paraxylylene.
6. The ultrasonic probe according to claim 1 , wherein the ground layer is provided along an ultrasonic wave radiation side of the cMUT chip and a surface of the electrical wiring portion or an inner surface of the casing portion.
7. The ultrasonic probe according to claim 1 , wherein the ground layer includes a conductive member.
8. The ultrasonic probe according to claim 1 , wherein the ground layer is provided along the outer surface of the insulating layer.
9. The ultrasonic probe according to claim 1 , wherein a filler is filled in at least a portion of an internal space of the casing portion.
10. The ultrasonic probe according to claim 1 , wherein a filler is filled in an overall internal space of the casing portion for storing the cMUT chip.
11. The ultrasonic probe according to claim 1 , wherein an acoustic lens is provided on an ultrasonic wave radiation side of the cMUT chip and a backing layer is provided on a side of the cMUT chip opposed to the acoustic lens.
12. The ultrasonic probe according to claim 11 , wherein the electrical wiring portion is placed along the backing layer.
13. The ultrasonic probe according to claim 11 , wherein the insulating portion is provided between the cMUT chip and the acoustic lens.