Diode and heat spreader for solar module

1. A solar system, comprising:

a plurality of solar cells;

a backsheet covering the plurality of solar cells, the backsheet having a top surface and a bottom surface opposite the top surface, the backsheet having a thickness defined at least by the top surface and the bottom surface; and

a plurality of low profile, surface-mount diodes coupled to the plurality of solar cells, each low profile, surface-mount diode disposed above the top surface of the backsheet such that the top surface of the backsheet faces the low profile, surface-mount diode and the bottom surface of the backsheet faces away from the low profile, surface-mount diode, and for each low profile, surface-mount diode:

a respective pair of ribbon interconnects, each ribbon interconnect coupled to the low profile, surface-mount diode and penetrating the backsheet through the thickness of the backsheet, each ribbon interconnect comprising a plurality of segments angled relative to one another such that at least one segment is disposed below the bottom surface of the backsheet and at least one segment is disposed above the low profile, surface-mount diode; and

a respective heat spreader mounted directly above the low profile, surface-mount diode.

2. The solar system of claim 1 , wherein each low profile, surface-mount diode rises less than 10 millimeters above the backsheet.

3. The solar system of claim 1 , wherein each low profile, surface-mount diode is attached directly to each ribbon interconnect of the respective pair of ribbon interconnects.

4. The solar system of claim 1 , wherein the respective heat spreader comprises a thin metal strip coated, by a thermally conductive dielectric, on at least one side of the metal strip.

5. The solar system of claim 4 , wherein the respective heat spreader is mounted to the backsheet with a thermal adhesive.

6. The solar system of claim 1 , wherein each ribbon interconnect of the respective pair of ribbon interconnects comprises four or more bends, a first bend for penetration of the backsheet, a second bend for bringing each ribbon interconnect into a plane of a surface of the backsheet, a third bend to bring each ribbon interconnect vertical, and a fourth bend to bring each ribbon interconnect of the respective pair of ribbon interconnects coplanar with one another and for coupling to the low profile, surface-mount diode.

7. A solar module, comprising:

a backsheet having a top surface and a bottom surface opposite the top surface, the backsheet having a thickness defined at least by the top surface and the bottom surface;

a low profile, surface-mount diode disposed above the top surface of the backsheet;

a pair of ribbon interconnects, each ribbon interconnect coupled to the low profile, surface-mount diode and penetrating the backsheet through the thickness of the backsheet, each ribbon interconnect comprising a plurality of segments angled relative to one another such that a first segment is disposed below the backsheet oriented in a first direction and a second segment passes through the thickness of the backsheet in a second direction that is transverse to the first direction; and

a heat spreader mounted directly above the low profile, surface-mount diode.

8. The solar module of claim 7 , wherein the low profile, surface-mount diode rises less than 10 millimeters above the backsheet.

9. The solar module of claim 7 , wherein the low profile, surface-mount diode is attached directly to each of the ribbon interconnects.

10. The solar module of claim 7 , wherein the heat spreader comprises a thin metal strip coated, by a thermally conductive dielectric, on at least one side of the metal strip.

11. The solar module of claim 10 , wherein the heat spreader is mounted to the backsheet with a thermal adhesive.

12. The solar module of claim 7 , wherein each ribbon interconnect further comprises a third segment, a fourth segment and a fifth segment, wherein each of the pair of ribbon interconnects comprises four or more bends, a first bend between the first segment and the second segment for penetration of the backsheet, a second bend between the second segment and the third segment for bringing each ribbon interconnect into a plane of the top surface of the backsheet, a third bend between the third segment and the fourth segment to bring each ribbon interconnect vertical, and a fourth bend between the fourth segment and the fifth segment to bring each ribbon interconnect coplanar with one another and for coupling to the low profile, surface-mount diode.

13. The solar system of claim 6 , wherein each ribbon interconnect includes at least a first segment, a second segment, a third segment, a fourth segment and a fifth segment,

wherein the first segment is disposed below the bottom surface of the backsheet,

wherein the second segment passes through the thickness of the backsheet between the first bend and the second bend and is transverse to the first segment,

wherein the third segment is disposed above the top surface of the backsheet between the second bend and the third bend,

wherein the fourth segment is disposed between the third bend and the fourth bend, and

wherein the fifth segment is disposed above the low profile, surface-mount diode.

14. The solar module of claim 7 , wherein at least one segment of each ribbon interconnect is disposed above the low profile, surface-mount diode on a side of the low profile, surface-mount diode opposite the backsheet.