Low-temperature dielectric formation for devices with strained germanium-containing channels
A method of forming a semiconductor device includes providing a substrate in a vacuum processing tool, the substrate having a strained Ge-containing layer on the substrate and a Si layer on the strained Ge-containing layer, maintaining the substrate at a temperature less than 700° C., and generating a soft plasma in the vacuum processing tool. The Si layer is exposed to the soft plasma to form a Si-containing dielectric layer while minimizing oxidation and strain relaxation in the underlying strained Ge-containing layer. A semiconductor device containing a substrate, a strained Ge-containing layer on the substrate, and an Si-containing dielectric layer formed on the strained Ge-containing layer is provided. The semiconductor device can further contain a gate electrode layer on the Si-containing dielectric layer or a high-k layer on the Si-containing dielectric layer and a gate electrode layer on the high-k layer.
1. A method of forming a semiconductor device, comprising:
providing a substrate in a vacuum processing tool, the substrate having a strained Ge-containing layer on the substrate and a Si layer on the strained Ge-containing layer;
maintaining the substrate at a temperature less than 700° C.;
generating a soft plasma in the vacuum processing tool; and
exposing the Si layer to the soft plasma to form a Si-containing dielectric layer while minimizing oxidation and strain relaxation in the strained Ge-containing layer.
2. The method according to claim 1 , wherein the providing comprises:
depositing a strained Ge-containing layer on the substrate; and
forming a Si layer on the strained Ge-containing layer, wherein
one or both of the depositing and the forming is performed in the vacuum processing tool.
3. The method according to claim 1 , wherein the exposing comprises forming a Si-containing dielectric layer comprising a SiO 2 layer, a SiON layer, or a SiN layer, or a combination of two or more thereof.
4. The method according to claim 1 , wherein the exposing comprises generating the soft plasma by microwave irradiation from a slot plane antenna plasma source having a plurality of slots.
5. The method according to claim 4 , wherein the exposing comprises generating a soft plasma comprising electron temperatures between about 0.5 eV and about 6 eV and plasma densities between about 1×10 10 /cm 3 and about 5×10 12 /cm 3 .
6. The method according to claim 4 , wherein the exposing comprises generating a soft plasma comprising electron temperatures between about 0.5 eV and about 2 eV and plasma densities between about 1×10 12 /cm 3 and about 5×10 12 /cm 3 .
7. The method according to claim 2 ,
wherein the forming comprises forming a Si layer having a thickness between about 0.3 nm and about 2 nm; and
wherein the exposing comprises forming a SiO 2 , SiON, or SiN layer having a thickness between about 0.3 nm and about 2 nm.
8. The method according to claim 2 ,
wherein the forming comprises forming a Si layer having a thickness between about 0.5 nm and about 1 nm; and
wherein the exposing comprises forming a SiO 2 , SiON, or SiN layer having a thickness between about 0.5 nm and about 1 nm.
9. The method according to claim 1 , wherein the exposing comprises exposing the Si layer to a soft plasma formed from a process gas containing O 2 , H 2 O, N 2 , NH 3 , NO, NO 2 , or N 2 O, or a combination thereof.
10. The method according to claim 1 , wherein the exposing comprises sequentially exposing the Si layer to a soft plasma formed from a first process gas containing O 2 and a soft plasma from a second process gas containing N 2 .
11. The method according to claim 1 , further comprising forming a gate electrode layer on the Si-containing dielectric layer, the gate electrode layer comprising poly Si, W, WN, WSi x , Al, Mo, Ta, TaN, TaSiN, HfN, HfSiN, Ti, TiN, TiSiN, Mo, MoN, Re, Pt, or Ru.
12. The method according to claim 1 , further comprising:
forming a high-k dielectric layer on the Si-containing dielectric layer wherein the high-k dielectric layer comprises Ta 2 O 5 , TiO 2 , ZrO 2 , Al 2 O 3 , Y 2 O 3 , HfSiO x , HfO 2 , ZrO 2 , ZrSiOx, TaSiO x , SrO x , SrSiO x , LaO x , LaSiO x , YO x , or YSiO x , or combinations of two or more thereof and
forming a gate electrode layer on the high-k dielectric layer wherein the gate electrode layer comprises poly Si, W, WN, WSi x , Al, Mo, Ta, TaN, TaSiN, HfN, HfSiN, Ti, TiN, TiSiN, Mo, MoN, Re, Pt, or Ru.
13. The method according to claim 1 , wherein the exposing comprises oxidizing or nitridizing only a portion of the Si layer.
14. A method of forming a semiconductor device, comprising:
providing a substrate in a vacuum processing tool;
depositing a strained Ge-containing layer on the substrate;
forming a Si layer on the strained Ge-containing layer; and
exposing the Si layer to a soft plasma at a substrate temperature less than 700° C., wherein the soft plasma comprises electron temperatures between about 0.5 eV and about 6 eV and plasma densities between about 1×10 10 /cm 3 and about 5×10 12 /cm 3 and is generated by microwave irradiation from a slot plane antenna plasma source comprising a plurality of slots.