Passive cooling enclosure system and method for electronics devices

1. An apparatus for passively cooling electronics comprising:

a modular support structure including:

a first heat sink configured to be thermally coupled to a cabinet, wherein the first heat sink comprises a first thermal port and the cabinet comprises a second thermal port, wherein the first heat sink is configured to be thermally coupled to the cabinet via a first solid, releasably couplable thermal connection formed by the first thermal port and the second thermal port, wherein the first thermal port comprises a heat pipe conduit and the second thermal port comprises a heat pipe configured to extend from the cabinet and to be mounted to a heat pipe protrusion, wherein the heat pipe conduit is configured to receive the heat pipe protrusion and to clamp around at least a portion of the heat pipe protrusion; and

a second heat sink configured to be thermally coupled to the cabinet via a second solid thermal connection;

wherein the first heat sink and the second heat sink are external to the cabinet;

wherein the modular support structure is configured to support the cabinet in a location between the first and second heat sinks;

wherein when the cabinet is thermally coupled to the first heat sink and the second heat sink; and

wherein the first heat sink and the second heat sink are configured to passively draw heat from the cabinet.

2. The apparatus of claim 1 , wherein

the cabinet comprises at least one electronic device that generates heat.

3. The apparatus of claim 1 , wherein the first thermal port and the second thermal port comprise a clamping mechanism configured to enhance the thermal coupling of the cabinet to the first heat sink, and wherein the cabinet has a width in a range of about 19 inches to about 23 inches.

4. The apparatus of claim 1 , wherein the modular support structure is positioned beside a second modular support structure such that a channel is formed between the modular support structure and the second modular support structure, and wherein the channel is configured to receive and direct cooling air over the first heat sink of the modular support structure and a third heat sink of the second modular support structure, wherein the first heat sink comprises at least a portion of a wall of the modular support structure, and wherein the third heat sink comprises at least a portion of a wall of the second modular support.

5. The apparatus of claim 1 , wherein the first heat sink is not thermally coupled to the at least one cabinet using a liquid or a gas.

6. The apparatus of claim 1 , wherein the first heat sink and the second heat sink are each located in at least one wall of the modular support structure.

7. The apparatus of claim 1 , wherein the modular support structure includes a plurality of slots that are external to the cabinet, and wherein the plurality of slots are configured to allow the cabinet to linearly slide along respective slots of the plurality of slots, and wherein the plurality of slots are configured to receive respective heat pipes extending from an external surface of the cabinet.

8. The apparatus of claim 1 , wherein the modular support structure includes a plurality of pipe connectors configured to connect the first heat sink and the second heat sink to the first solid thermal connection and the second solid thermal connection, respectively, and wherein the plurality of pipe connectors are configured to selectively secure the cabinet to the modular support structure.

9. The apparatus of claim 1 , wherein the modular support structure encloses the cabinet, and wherein the modular support structure comprises at least four sides, wherein a first side of the at least four sides comprises the first heat sink, and wherein a second side of the at least four sides opposite the first side comprises the second heat sink.

10. The apparatus of claim 1 , wherein the first heat sink and the second heat sink are further configured to passively dissipate heat from the cabinet to a space outside of the modular support structure.

11. An apparatus for passively cooling electronics comprising:

a cabinet configured to be thermally coupled to a modular support structure that includes:

a first heat sink thermally coupled to the cabinet via at least one first solid thermal connection formed by a first thermal port that comprises a heat pipe conduit and a second thermal port, wherein the first heat sink comprises the first thermal port, wherein the first thermal port and the second thermal port are releasably coupled, and wherein the first heat sink is located on a first side of the cabinet; and

a second heat sink thermally coupled to the cabinet via at least one second solid thermal connection, wherein the second heat sink is located on an opposite side of the at least one cabinet;

wherein when the cabinet is thermally coupled to the first heat sink and the second heat sink, the first heat sink and the second heat sink passively draw heat from the cabinet; and

wherein the cabinet is located between the first heat sink and the second heat sink such that the first heat sink and the second heat sink are external to the cabinet, wherein the cabinet includes the second thermal port that comprises one or more heat pipes extending from a surface of the cabinet and configured to be mounted to a heat pipe protrusion, and wherein the heat pipe conduit is configured to receive the heat pipe protrusion and to clamp around at least a portion of the heat pipe protrusion.

12. The apparatus of claim 11 , wherein

the cabinet comprises at least one electronic device that generates heat.

13. The apparatus of claim 11 , wherein the first thermal port and the second thermal port comprise a clamping mechanism configured to enhance the thermal coupling of the cabinet to the first heat sink and the at least one cabinet has a width in a range of about 19 inches to about 23 inches.

14. The apparatus of claim 11 , wherein the cabinet comprises a sealed cabinet.

15. The apparatus of claim 11 , wherein the cabinet is configured to be removably coupled to the first heat sink and the second heat sink.

16. The apparatus of claim 11 , wherein the apparatus does not include an active cooling element.

17. A method for passively cooling electronics comprising:

passively drawing heat from a cabinet through:

a first solid thermal joint to a first heat sink located in a modular support structure external to the cabinet, wherein the first heat sink comprises a first thermal port and the cabinet comprises a second thermal port, and

a second solid thermal joint to a second heat sink located in the modular support structure external to the cabinet; and

dissipating the heat in a channel, wherein the first heat sink forms at least part of the channel;

wherein the second thermal port comprises a heat pipe configured to extend from the cabinet and to be mounted to a heat pipe protrusion;

wherein the first thermal port comprises a heat pipe conduit configured to receive the heat pipe protrusion and to releasably clamp around at least a portion of the heat pipe protrusion; and

wherein the cabinet is located between the first heat sink and the second heat sink.