Three-dimensional multichip module
A three-dimensional multichip module includes a first integrated circuit chip having at least one first high-temperature functional area and one first low-temperature functional area, and at least one second integrated circuit chip having a second high-temperature functional area and a second low-temperature functional area. The second high-temperature functional area is arranged opposite the first low-temperature functional area. As an alternative, at least one low-temperature chip having only one low-temperature functional area can also be arranged between the first and second chips.
1. A three-dimensional multichip module comprising:
a first processor core in a first high-temperature functional area with high emission of heat in a first integrated circuit chip;
a second processor core in a second high-temperature functional area with high emission of heat in a second integrated circuit chip;
a third processor core in a third high-temperature functional area with high emission of heat in a third integrated circuit chip; and
a fourth processor core in a fourth high-temperature functional area with high emission of heat in a fourth integrated circuit chip,
wherein the first processor core is disposed in a first corner of the three-dimensional multichip module, wherein the second processor core is disposed in a second corner of the three-dimensional multichip module, wherein the third processor core is disposed in a third corner of the three-dimensional multichip module, and wherein the fourth processor core is disposed in a fourth corner of the three-dimensional multichip module.
2. The three-dimensional multichip module as claimed in claim 1 , wherein the first integrated circuit chip comprises a first memory unit in a first low-temperature functional area with a low emission of heat, wherein the second integrated circuit chip comprises a second memory unit in a second low-temperature functional area with a low emission of heat, wherein the third integrated circuit chip comprises a third memory unit in a third low-temperature functional area with a low emission of heat, and wherein the fourth integrated circuit chip comprises a fourth memory unit in a fourth low-temperature functional area with a low emission of heat.
3. The three-dimensional multichip module as claimed in claim 1 , wherein the first integrated circuit chip comprises bus control units in a first low-temperature functional area with a low emission of heat, wherein the second integrated circuit chip comprises bus control units in a second low-temperature functional area with a low emission of heat, wherein the third integrated circuit chip comprises third bus control units in a third low-temperature functional area with a low emission of heat, and wherein the fourth integrated circuit chip comprises fourth bus control units in a fourth low-temperature functional area with a low emission of heat.
4. The three-dimensional multichip module as claimed in claim 1 , wherein the first to fourth integrated circuit chips are electrically connected by through via bonds.
5. The three-dimensional multichip module as claimed in claim 1 , wherein at least two of the first to fourth integrated circuit chips are electrically connected by a face-to-face bond.
6. A three-dimensional multichip module comprising:
a first processor core in a first high-temperature functional area with high emission of heat in a first integrated circuit chip; and
a second processor core in a second high-temperature functional area with high emission of heat in a second integrated circuit chip,
wherein the first processor core is disposed in a first corner of the three-dimensional multichip module, and wherein the second processor core is disposed in a second corner of the three-dimensional multichip module.
7. The three-dimensional multichip module as claimed in claim 6 , wherein the first integrated circuit chip is identical to the second integrated circuit chip.
8. The three-dimensional multichip module as claimed in claim 6 , wherein the first integrated circuit chip further comprises a first low-temperature functional area with a low emission of heat and wherein the second integrated circuit chip comprises a second low-temperature functional area with low emission of heat.
9. The three-dimensional multichip module as claimed in claim 8 , wherein the first low-temperature functional area comprise a first memory unit and the second low-temperature functional area comprise a second memory unit.
10. The three-dimensional multichip module as claimed in claim 9 , wherein the first memory unit and the second memory unit comprise SRAM units.
11. The three-dimensional multichip module as claimed in claim 9 , wherein the first memory unit and the second memory unit comprise DRAM unit.
12. The three-dimensional multichip module as claimed in claim 9 , wherein the first memory unit and the second memory unit comprise flash memory units.
13. The three-dimensional multichip module as claimed in claim 9 , wherein a first total wiring length of a first electrical connection between the first processor core and the second memory unit is shorter than a second total wiring length of a second electrical connection between the first processor core and the first memory unit.
14. The three-dimensional multichip module as claimed in claim 6 , wherein the first corner of the three-dimensional multi-chip and the second corner of the three-dimensional multi-chip are opposite corners.
15. The three-dimensional multichip module as claimed in claim 6 , wherein at least one of the first integrated circuit chip and the second integrated circuit chip comprises a heat sink, air cooling or liquid cooling.
16. The three-dimensional multichip module as claimed in claim 6 , wherein the first integrated circuit chip and the second integrated circuit chip are face-to-face bonded.
17. The three-dimensional multichip module as claimed in claim 6 , wherein the first integrated circuit chip and the second integrated circuit chip are front side to back side bonded and connected via a through via.
18. A three-dimensional multichip module comprising:
a first processor core in a first high-temperature functional area with high emission of heat in a first integrated circuit chip;
a second processor core in a second high-temperature functional area with high emission of heat in a second integrated circuit chip; and
a third processor core in a third high-temperature functional area with high emission of heat in a third integrated circuit chip,
wherein the first processor core is disposed in a first corner of the three-dimensional multichip module, wherein the second processor core is disposed in a second corner of the three-dimensional multichip module, and wherein the third processor core is disposed in a third corner of the three-dimensional multichip module.
19. The three-dimensional multichip module as claimed in claim 18 , wherein the first integrated circuit chip further comprises a first low-temperature functional area with a low emission of heat, wherein the second integrated circuit chip further comprises a second low-temperature functional area with low emission of heat and wherein the third integrated circuit chip further comprises a third low-temperature functional area with low emission of heat.