IP Library Granted Patent US 8,605,427
Granted Patent B2
US 8,605,427 · App. 13/072,456 · Granted Dec 10, 2013

Heat dissipation device utilizing fan duct

Inventors: Xiao-Zhu Chen (Shenzhen, CN); Lei Liu (Shenzhen, CN)
Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.; Hon Hai Precision Industry Co., Ltd.
H05K7/20145
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,605,427
App. No.
13/072,456
Granted
Dec 10, 2013
Kind
B2
Abstract

A heat dissipation device includes a heat sink and a fan duct. The fan duct includes a cover and a baffle. The cover includes a top plate, a first sidewall and a second sidewall respectively extending from opposite sides of the top plate. The baffle is located between the first sidewall and the second sidewall of the cover and pivotally contacts the first and second sidewalls. The baffle forms an angle with the top plate and is rotatable relative to the first and second sidewalls to adjust the angle between the baffle and the top plate.

Claims (31)

1. A heat dissipation device comprising:

a heat sink; and

a fan duct comprising:

a cover comprising a top plate, a first sidewall and a second sidewall respectively extending from opposite sides of the top plate; and

a baffle received in the cover, the baffle pivotally engaged between the first and second sidewalls, the baffle forming an angle with the top plate and being rotatable relative to the first and second sidewalls to adjust the angle between the baffle and the top plate;

wherein the baffle comprises a shaft adjoining the top plate of the cover, and an extending plate extending from a side of the shaft, the shaft having a first end pivotally received in the first sidewall and a second end pivotally received in the second sidewall; and

wherein each of the first sidewall and the second sidewall defines a pivot hole therein to pivotally receive the shaft, the first sidewall defining a plurality of recesses surrounding the pivot hole in the first side wall, the first end of the shaft having at least a protrusion received in one of the recesses.

2. The heat dissipation device of claim 1 , wherein the shaft contacts an operating member at the first end, and forms a blocking portion at the second end, the operating member and the blocking portion being located at outer surfaces of the first sidewall and the second sidewall, an elastic member, installed between the blocking portion and the second sidewall, coils around the shaft.

3. The heat dissipation device of claim 2 , wherein the protrusion extending from the operating member to be received in one of the recesses.

4. The heat dissipation device of claim 2 , wherein the second sidewall defines a plurality of recesses surrounding the shaft, at least a protrusion extending from the second end of the shaft to be received in one of the recesses.

5. The heat dissipation device of claim 4 , wherein a contact member is mounted on the shaft and at an inner side of the second sidewall, the protrusion extending from the contact member.

6. The heat dissipation device of claim 2 , wherein the elastic member is a spring.

7. The heat dissipation device of claim 1 , wherein the heat sink defines a plurality of channels aligned along a direction of airflow, and the baffle baffles airflow between the top plate of the cover and the top of the heat sink.

8. An electronic device comprising:

a printed circuit board (PCB); and

a fan duct mounted on the PCB, the fan duct comprising:

a cover comprising a top plate, a first sidewall and a second sidewall respectively extending from opposite sides of the top plate; and

a baffle received in the cover, the baffle pivotally engaged between the first and second sidewalls, the baffle forming an angle with the top plate;

wherein when a first electronic component with a first heat sink thereon is mounted on the PCB and is located under the baffle of the fan duct, the baffle is engaged on a top of the first heat sink in a first position; when a second electronic component with a second heat sink thereon is mounted on the PCB and is located under the baffle of the fan duct, and the second heat sink has a height different from that of the first heat sink, the baffle is rotatable relative to the first and second sidewalls to engage with a top of the second heat sink in a second position; such that the baffle baffles air flowing through the fan duct between the top plate and the top of the first heat sink or the second heat sink and directs at least part of such air flowing toward the first heat sink or the second heat sink;

wherein the baffle comprises a shaft adjoining the top plate of the cover and an extending plate extending from a side of the shaft, the shaft having a first end pivotally received in the first sidewall and a second end pivotally received in the second sidewall; and

wherein the shaft contacts an operating member at the first end, and forms a blocking portion at the second end, the operating member and the blocking portion being located at outer surfaces of the first sidewall and the second sidewall, an elastic member, installed between the blocking portion and the second sidewall, coils around the shaft.

9. The electronic device of claim 8 , wherein the first sidewall defines a plurality of recesses surrounding the shaft, at least a protrusion extending from the operating member to be received in one of the recesses.

10. The electronic device of claim 8 , wherein the second sidewall defines a plurality of recesses surrounding the shaft, at least a protrusion extending from the second end of the shaft to be received in one of the recesses.

11. A fan duct, the fan duct comprising:

a cover comprising a top plate, a first sidewall and a second sidewall respectively extending from opposite sides of the top plate; and

a baffle between the first sidewall and the second sidewall of the cover, the baffle pivotally engaged with the first and second sidewalls, the baffle forming an angle with the top plate and being rotatable relative to the first and second sidewalls to adjust the angle between the baffle and the top plate;

wherein the baffle comprises a shaft adjoining the top plate of the cover and an extending plate extending from a side of the shaft, the shaft having a first end pivotally received in the first sidewall and a second end pivotally received in the second sidewall; and

wherein the shaft contacts an operating member at the first end, and forms a blocking portion at the second end, the operating member and the blocking portion being located at outer surfaces of the first sidewall and the second sidewall, an elastic member abutting the blocking portion and the second sidewall.

12. The fan duct of claim 11 , wherein the first sidewall defines a plurality of recesses surrounding the shaft, at least a protrusion extending from the operating member to be received in one of the recesses.

13. The fan duct of claim 11 , wherein the second sidewall defines a plurality of recesses surrounding the shaft, at least a protrusion extending from the second end of the shaft to be received in one of the recesses.

14. The fan duct of claim 13 , wherein a contact member is mounted on the shaft and at an inner side of the second sidewall, the protrusion extending from the contact member.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2011
From: CHEN, XIAO-ZHU; LIU, LEI
To: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 026025/0148 →
Priority Claims (1)
CN 2010 1 0609125 · Dec 28, 2010 · national
Continuity (1)
Related Publication 20120162917A1 · Jun 28, 2012