Megasonic precision cleaning of semiconductor process equipment components and parts
Apparatuses are provided for cleaning a processing component using megasonic energy including megasonic tanks, scanning megasonic plates, megasonic jets, and megasonic sweeping beams etc., in combination with selective chemistries to remove sub-micron particulate contaminants from the surfaces of the processing component that is used in cleaning semiconductor, medical, or any other processing substrates. The apparatus includes a processing chamber having a carrier element that is configured to support the processing component. The carrier element includes a mechanism to flip the processing component within the processing chamber during cleaning. A fluid supply assembly supplies a fluid to a surface of the processing component and a beam assembly equipped with a megasonic transducer is used to provide high frequency megasonic acoustic energy to the fluid during cleaning.
1. An apparatus for cleaning a processing component, comprising:
a processing chamber having a carrier element, wherein the carrier element is capable of supporting the processing component within the processing chamber, the carrier element having a mechanism for flipping the processing component within the processing chamber during cleaning;
a fluid supply assembly, the fluid supply assembly being capable of supplying a fluid to a surface of the processing component; and
a beam assembly equipped with a megasonic transducer, the beam assembly extending through an opening into a cavity defined in the processing chamber, the beam assembly configured to generate a beam of high frequency megasonic acoustic energy, wherein the beam of high frequency megasonic acoustic energy is applied to the fluid on the surface of the processing component to generate a force that is communicated to exposed surfaces of the processing component,
wherein the processing component is a part of a processing tool.
2. The apparatus as recited in claim 1 , wherein the fluid supply assembly includes a supply line coupling a nozzle to a source of the fluid.
3. The apparatus as recited in claim 1 , wherein the fluid is deionized water.
4. The apparatus as recited in claim 1 , wherein the fluid is an aqueous alkali solution, an aqueous acidic solution, a neutral surfactant solution, an acidic surfactant solution, a basic surfactant solution, an aqueous surfactant solution, or a mixture of organic solvent and water.
5. The apparatus as recited in claim 1 , wherein the beam assembly is a sweeping beam assembly, the sweeping beam assembly configured to perform a sweeping motion to apply the beam of acoustic energy to the exposed surfaces of the processing component.
6. The apparatus as recited in claim 5 , wherein the beam assembly is configured to scan substantially around all exposed surfaces of the processing component.
7. The apparatus as recited in claim 1 , wherein the high frequency megasonic acoustic energy is energy having a frequency of about 600 KHz to about 2 MHz.
8. An apparatus for cleaning a processing component, comprising:
a processing chamber having a carrier element, wherein the carrier element is capable of supporting the processing component within the processing chamber, the carrier element having a mechanism for flipping the processing component within the processing chamber during cleaning; and
a beam assembly equipped with a megasonic transducer, the beam assembly extending through an opening into a cavity defined in the processing chamber, the beam assembly includes a transducer portion and a head portion, the transducer portion including a throughway for providing a fluid to the head portion, the head portion configured to provide high frequency megasonic acoustic energy to the fluid and to supply the acoustically energized fluid to a surface of the processing component so as to generate a force that is communicated to exposed surfaces of the processing component,
wherein the processing component is a part of the processing chamber.
9. The apparatus of claim 8 , wherein the throughway of the transducer portion includes an inlet coupled to a fluid supply line for receiving the fluid from a fluid source and an outlet coupled to the head portion for conveying the fluid to the head portion.
10. The apparatus as recited in claim 8 , wherein the beam assembly is a sweeping beam assembly, the sweeping beam assembly configured to perform a sweeping motion to apply the acoustically energized fluid to the exposed surfaces of the processing component.