Methods of forming integrated circuit chips having vertically extended through-substrate vias therein
Methods of forming an integrated circuit device include forming an interlayer dielectric layer on a first surface of a semiconductor substrate and then forming an interconnect hole that extends through the interlayer dielectric layer and into the semiconductor substrate. A first sidewall spacer layer is formed on a sidewall of the interconnect hole. The semiconductor substrate at a bottom of the interconnect hole is isotropically etched to define an undercut recess in the semiconductor substrate. This etching step is performed using the first sidewall spacer layer as an etching mask. The interconnect hole and the uncut recess are then filled with a through-via electrode. A second surface of the semiconductor substrate is removed for a sufficient duration to expose the uncut recess containing the through-via electrode.
1. A method of forming a semiconductor device, the method comprising:
forming an integrated circuit on a top surface of a semiconductor substrate;
forming a dielectric layer covering the integrated circuit device on the top surface of the semiconductor substrate;
forming a through-via electrode extending into the substrate through the dielectric layer;
forming a multi-level metal pattern on the dielectric layer to electrically contact the through-via electrode; and
reducing a thickness of a first portion of the semiconductor substrate disposed under and corresponding to the integrated circuit and reducing a thickness of a second portion of the semiconductor substrate disposed under and corresponding to the through-via electrode until the thickness of the second portion becomes substantially zero, wherein an amount of the reduced thickness of the first portion is substantially same as an amount of the reduced thickness of the second portion.
2. The method of claim 1 , further comprising further reducing the thickness of the second portion of the semiconductor substrate so that the through-via electrode extends beyond a bottom surface the substrate to electrically connect the bottom surface of the through-via electrode with another device.
3. The method of claim 1 , wherein removing the thickness of the first portion and the thickness of the second portion is performed by a CMP.
4. The method of claim 1 , wherein the through-via electrode has a width constant from top to bottom.
5. The method of claim 1 , wherein the integrated circuit comprises a gate transistor, a bit line, and a capacitor.
6. The method of claim 1 , wherein the integrated circuit comprises a gate transistor including a charge storage layer and a control gate electrode, and a bit line.
7. A method of forming a semiconductor device, the method comprising:
forming an integrated circuit on a top surface of a semiconductor substrate;
forming a dielectric layer covering the integrated circuit device on the top surface of the semiconductor substrate;
forming a through-via electrode extending into the substrate through the dielectric layer;
forming a multi-level metal pattern on the dielectric layer to electrically contact the through-via electrode; and
grinding an entire bottom surface of the semiconductor substrate until the substrate disposed under and corresponding to a bottom surface of the through-via electrode is completely removed.
8. The method of claim 7 , further comprising further grinding the semiconductor substrate
so that the through-via electrode extends beyond a bottom surface of the substrate to electrically connect the bottom surface of the through-via electrode with another device.
9. The method of claim 7 , wherein grinding the entire bottom surface of the semiconductor substrate is performed by a CMP.
10. The method of claim 7 , wherein the through-via electrode has a width constant from top to bottom.
11. The method of claim 7 , wherein the integrated circuit comprises a gate transistor, a bit line, and a capacitor.
12. The method of claim 7 , wherein the integrated circuit comprises a gate transistor including a charge storage layer and a control gate electrode, and a bit line.
13. A method of forming a semiconductor device, the method comprising:
forming an integrated circuit on a top surface of a semiconductor substrate;
forming a dielectric layer covering the integrated circuit device on the top surface of the semiconductor substrate;
forming a via hole extending into the substrate through the dielectric layer;
forming a spacer insulating layer on side and bottom walls of the via hole; and then
filling the via hole with an electrically conductive through-via electrode to form a through-via electrode extending into the substrate through the dielectric layer;
forming a multi-level metal pattern on the dielectric layer to electrically contact the through-via electrode; and
grinding an entire bottom surface of the semiconductor substrate until the spacer insulating layer disposed on a bottom surface of the through-via electrode is exposed.
14. The method of claim 13 , further comprising further grinding the semiconductor substrate so that the through-via electrode extends beyond a bottom surface of the substrate to electrically connect the bottom surface of the through-via electrode with another device.
15. The method of claim 13 , wherein grinding the entire bottom surface of the semiconductor substrate is performed by a CMP.
16. The method of claim 13 , further comprising removing the spacer insulating layer disposed on the bottom surface of the through-via electrode using a wet etching.
17. The method of claim 13 , wherein the integrated circuit comprises a gate transistor, a bit line, and a capacitor.
18. The method of claim 13 , wherein the integrated circuit comprises a gate transistor including a charge storage layer and a control gate electrode, and a bit line.