IP Library Granted Patent US 8,629,439
Granted Patent B2
US 8,629,439 · App. 11/476,508 · Granted Jan 14, 2014

Light emitting device, method of preparing the same and device for fabricating the same

Inventors: Shunpei Yamazaki (Tokyo, JP); Masaaki Hiroki (Kanagawa, JP); Masakazu Murakami (Kanagawa, JP); Hideaki Kuwabara (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
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Quick Facts
Patent No.
US 8,629,439
App. No.
11/476,508
Granted
Jan 14, 2014
Kind
B2
Abstract

A light emitting device having a high definition, a high aperture ratio and a high reliability is provided. The present invention realizes a high definition and a high aperture ratio for a flat panel display of full colors using luminescent colors of red, green and blue without being dependent upon the film formation method and deposition precision of an organic compound layer by forming the laminated sections 21, 22 by means of intentionally and partially overlapping different organic compound layers of adjacent light emitting elements. Moreover, the protective film 32 a containing hydrogen is formed and the drawback in the organic compound layer is terminated with hydrogen, thereby realizing the enhancement of the brightness and the reliability.

Claims (75)

1. A light emitting device comprising:

a substrate;

a pixel portion including a light emitting element on the substrate;

a drive circuit portion on the substrate;

a first terminal portion for pasting a first FPC on the substrate;

a second terminal portion for pasting a second FPC on the substrate; and

a sealing substrate over the pixel portion, the drive circuit portion, a part of the first terminal portion and a part of the second terminal portion,

wherein the sealing substrate is pasted with a sealing member, and

wherein the sealing member overlaps with the first terminal portion, the second terminal portion and the drive circuit portion.

2. The light emitting device according to claim 1 ,

wherein the first terminal portion and the second terminal portion are on the same side of the substrate.

3. The light emitting device according to claim 1 ,

wherein the first terminal portion includes a first electrode for pasting the first FPC and the second terminal portion includes a second electrode for pasting the second FPC.

4. The light emitting device according to claim 3 ,

wherein the first electrode and the second electrode are formed with the same material with that of a cathode of the light emitting element.

5. A light emitting device comprising:

a substrate;

a pixel portion including a light emitting element on the substrate;

a drive circuit portion on the substrate;

a first terminal portion for pasting a first FPC on the substrate;

a second terminal portion for pasting a second FPC on the substrate; and

a sealing substrate over the pixel portion, the drive circuit portion, a part of the first terminal portion and a part of the second terminal portion,

wherein the sealing substrate is pasted with a sealing member,

wherein the sealing member overlaps with the first terminal portion and the second terminal portion,

wherein a convex portion is formed on a region of the sealing substrate, and

wherein the sealing member is between the substrate and the region where the convex portion is formed.

6. The light emitting device according to claim 5 ,

wherein the first terminal portion and the second terminal portion are on the same side of the substrate.

7. The light emitting device according to claim 5 ,

wherein the first terminal portion includes a first electrode for pasting the first FPC and the second terminal portion includes a second electrode for pasting the second FPC.

8. The light emitting device according to claim 7 ,

wherein the first electrode and the second electrode are formed with the same material with that of a cathode of the light emitting element.

9. The light emitting device according to claim 5 ,

wherein the convex portion is formed with the same material with that of a color filter in the pixel portion.

10. A light emitting device comprising:

a substrate;

a pixel portion including a light emitting element on the substrate;

a drive circuit portion on the substrate;

a first terminal portion for pasting a first FPC on the substrate;

a second terminal portion for pasting a second FPC on the substrate;

an interlayer insulating film over the substrate; and

a sealing substrate over the pixel portion, the drive circuit portion, a part of the first terminal portion and a part of the second terminal portion,

wherein the interlayer insulating film has a concave portion in each of the first terminal portion and the second terminal portion,

wherein an inorganic insulating film is formed over the interlayer insulating film and in the concave portion, and

wherein a sealing member is between the sealing substrate and the inorganic insulating film and a part of the sealing member is in the concave portion.

11. The light emitting device according to claim 10 ,

wherein the first terminal portion and the second terminal portion are on the same side of the substrate.

12. The light emitting device according to claim 10 ,

wherein the first terminal portion includes a first electrode for pasting the first FPC and the second terminal portion includes a second electrode for pasting the second FPC.

13. The light emitting device according to claim 12 ,

wherein the first electrode and the second electrode are formed with the same material with that of a cathode of the light emitting element.

14. The light emitting device according to claim 10 ,

wherein the interlayer insulating film includes an organic material.

15. A light emitting device comprising:

a substrate;

a pixel portion including a light emitting element on the substrate;

a drive circuit portion on the substrate;

a first terminal portion for pasting a first FPC on the substrate;

a second terminal portion for pasting a second FPC on the substrate;

an interlayer insulating film over the substrate; and

a sealing substrate over the pixel portion, the drive circuit portion, a part of the first terminal portion and a part of the second terminal portion,

wherein the interlayer insulating film has a concave portion in each of the first terminal portion and the second terminal portion,

wherein an inorganic insulating film is formed over the interlayer insulating film and in the concave portion,

wherein a convex portion is formed on a region of the sealing substrate, and

wherein a sealing member is between the region where the convex portion is formed and the inorganic insulating film and a part of the sealing member is in the concave portion.

16. The light emitting device according to claim 15 ,

wherein the first terminal portion and the second terminal portion are on the same side of the substrate.

17. The light emitting device according to claim 15 ,

wherein the first terminal portion includes a first electrode for pasting the first FPC and the second terminal portion includes a second electrode for pasting the second FPC.

18. The light emitting device according to claim 17 ,

wherein the first electrode and the second electrode are formed with the same material with that of a cathode of the light emitting element.

19. The light emitting device according to claim 15 ,

wherein the convex portion is formed with the same material with that of a color filter in the pixel portion.

20. The light emitting device according to claim 15 ,

wherein the interlayer insulating film includes an organic material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2006
From: YAMAZAKI, SHUNPEI; HIROKI, MASAAKI; MURAKAMI, MASAKAZU; KUWABARA, HIDEAKI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 018058/0527 →
Priority Claims (1)
JP 2002-016244 · Jan 24, 2002 · national
Continuity (2)
Division 10349750 · Jan 22, 2003
Related Publication 20060243989A1 · Nov 2, 2006