IP Library Granted Patent US 8,659,911
Granted Patent B2
US 8,659,911 · App. 13/811,830 · Granted Feb 25, 2014

Fixing metal bracket for component mounted on circuit board

Inventor: Takashi Muro (Makinohara, JP)
Assignee: Yazaki Corporation
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Quick Facts
Patent No.
US 8,659,911
App. No.
13/811,830
Granted
Feb 25, 2014
Kind
B2
Abstract

A fixing metal bracket for a component mounted on a circuit board, includes a solder bonding plate section to be solder-fixed on a surface of a circuit board with a cream solder, and a component fixing section to be fixed to a component mounted on the circuit board. An annular through-groove is formed on the solder bonding plate section at a position surrounding a central area thereof. An island-shaped portion at the inside of the through-groove is separated from a peripheral portion at the outside of the through-groove while the connection part is remained. A step is formed on a solder bonding face of the connection part. Pure Sn plating is applied to the solder bonding face of the island-shaped portion and whisker resistance plating is applied to a surface of a portion other than the island-shaped portion.

Claims (6)

1. A fixing metal bracket for a component mounted on a circuit board, comprising:

a solder bonding plate section configured to be solder-fixed on a surface of a circuit board with a cream solder; and

a component fixing section configured to be fixed to a component to be mounted on the circuit board,

wherein an annular through-groove is formed on the solder bonding plate section at a position surrounding a central area of the solder bonding plate section so as to pass therethrough in a plate thickness direction while a connection part is partially remained in a circumferential direction, and thereby an island-shaped portion at the inside of the through-groove is separated from a peripheral portion at the outside of the through-groove while the connection part is remained;

wherein a step which is recessed from a solder bonding face of the island-shaped portion is formed on a solder bonding face of the connection part; and

wherein pure Sn plating is applied to the solder bonding face of the island-shaped portion, and whisker resistance plating is applied to a surface of a portion other than the island-shaped portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2013
From: MURO, TAKASHI
To: YAZAKI CORPORATION
Reel/Frame 029679/0969 →
Priority Claims (1)
JP 2010-167814 · Jul 27, 2010 · national
Continuity (1)
Related Publication 20130118789A1 · May 16, 2013