Nanoimprinting method and method for producing substrates utilizing the nanoimprinting method
Droplets of resist material are coated using the ink jet method under conditions that: the viscosity of the resist material is within a range from 8 cP to 20 cP, the surface energy of the resist material is within a range from 25 mN/m to 35 mN/m, the amount of resist material in each of the droplets is within a range from 1 pl to 10 pl, and the placement intervals among the droplets are within a range from 10 μm to 1000 μm. A mold is pressed against the surface of the substrate in a He and/or a depressurized atmosphere such that: an intersection angle formed between a main scanning direction of the ink jet method and the direction of the lines of the linear pattern of protrusions and recesses, which is an intersection angle when pressing the mold against the surface of the substrate, is within a range from 30° to 90°.
1. A nanoimprinting method, comprising:
coating a substrate with a plurality of droplets of resist material by the ink jet method; and
pressing a linear pattern of protrusions and recesses of a mold onto the surface of the substrate which is coated with the droplets, to spread the droplets on the substrate, to form a resist film constituted by bonds among the spread plurality of droplets and to transfer the linear pattern of protrusions and recesses onto the resist film;
the droplets being coated under the conditions of: the viscosity of the resist material being within a range from 8 cP to 20 cP, the surface energy of the resist material being within a range from 25 mN/m to 35 mN/m, the amount of resist material in each of the plurality of droplets being within a range from 1 pl to 10 pl, and the placement intervals among the droplets being within a range from 10 μm to 1000 μm, and such that an intersection angle formed between a main scanning direction of the ink jet method when coating the substrate with the droplets and the direction of the lines of the linear pattern of protrusions and recesses, which is an intersection angle when pressing the mold against the surface of the substrate, is within a range from 30° to 90°; and
the mold being pressed against the surface of the substrate in a He and/or a depressurized atmosphere.
2. A nanoimprinting method as defined in claim 1 , wherein:
the resist material is a photocuring resin.
3. A method for producing a substrate, comprising:
forming a resist film, onto which a pattern of protrusions and recesses has been transferred by the nanoimprinting method of claim 1 , on a substrate; and
performing dry etching using the resist film as a mask, to form a pattern of protrusions and recesses corresponding to the pattern of protrusions and recesses transferred onto the resist film on the substrate, and to obtain a substrate having a predetermined pattern.
4. A method for producing a substrate, comprising:
forming a resist film, onto which a pattern of protrusions and recesses has been transferred by the nanoimprinting method of claim 2 , on a substrate; and
performing dry etching using the resist film as a mask, to form a pattern of protrusions and recesses corresponding to the pattern of protrusions and recesses transferred onto the resist film on the substrate, and to obtain a substrate having a predetermined pattern.