Corrosion-resistant member for semiconductor manufacturing apparatus and method for manufacturing the same
Initially, an Yb 2 O 3 raw material was subjected to uniaxial pressure forming at a pressure of 200 kgf/cm 2 , so that a disc-shaped compact having a diameter of about 35 mm and a thickness of about 10 mm was produced, and was stored into a graphite mold for firing. Subsequently, firing was performed by using a hot-press method at a predetermined firing temperature (1,500° C.), so as to obtain a corrosion-resistant member for semiconductor manufacturing apparatus. The press pressure during firing was specified to be 200 kgf/cm 2 and an Ar atmosphere was kept until the firing was finished. The retention time at the firing temperature (maximum temperature) was specified to be 4 hours. In this manner, the corrosion-resistant member for semiconductor manufacturing apparatus made from an Yb 2 O 3 sintered body having an open porosity of 0.2% was obtained.
1. A corrosion-resistant member for a semiconductor manufacturing apparatus, comprising a sintered body having an open porosity of 0.3% or less and consisting essentially of at least one type of rare-earth oxide selected from the group consisting of Yb 2 O 3 , Ho 2 O 3 , Dy 2 O 3 and Er 2 O 3 , wherein grain boundary phases containing at least one type selected from the group consisting of Mg, Ca, and Sr and at least one type of O and F are dispersed in the sintered body.
2. The corrosion-resistant member for a semiconductor manufacturing apparatus according to claim 1 , wherein the sintered body containing Yb 2 O 3 has a bulk density of 8.8 to 9.2 g/cm 3 .
3. The corrosion-resistant member for a semiconductor manufacturing apparatus according to claim 1 , wherein the sintered body containing Ho 2 O 3 has a bulk density of 8.1 to 8.4 g/cm 3 .
4. The corrosion-resistant member for a semiconductor manufacturing apparatus according to claim 1 , wherein the sintered body containing Yb 2 O 3 has a bulk density of 8.8 to 9.2 g/cm 3 .
5. The corrosion-resistant member for a semiconductor manufacturing apparatus according to claim 1 , wherein the sintered body containing Ho 2 O 3 has a bulk density of 8.1 to 8.4 g/cm 3 .
6. The corrosion-resistant member for a semiconductor manufacturing apparatus according to claim 1 , wherein an amount of impurity metals in the sintered body is 0.1 wt % or less with respect to a total weight of the rare-earth oxide.
7. A method for manufacturing a corrosion-resistant member for a semiconductor manufacturing apparatus, comprising the step of:
subjecting at least one type of rare-earth oxide raw material selected from the group consisting of Yb 2 O 3 , Ho 2 O 3 , Dy 2 O 3 and Er 2 O 3 to (a) forming into the shape of a desired corrosion-resistant member for semiconductor manufacturing apparatus without using a sintering aid and, thereafter, hot-press firing in an inert atmosphere at a predetermined firing temperature or (b) forming into the shape of a desired corrosion-resistant member for semiconductor manufacturing apparatus together with a sintering aid which is a fluoride of at least one type of element selected from the group consisting of Mg, Ca, and Sr and, thereafter, hot-press firing in an inert atmosphere at a temperature lower than the predetermined firing temperature, so as to sinter the oxide raw material and obtain a sintered body having an open porosity of 0.3% or less.
8. The method for manufacturing a corrosion-resistant member for a semiconductor manufacturing apparatus, according to claim 7 ,
wherein an annealing treatment in the air is performed at 1,000° C. or higher after the sintered body having an open porosity of 0.3% or less is obtained by sintering the oxide raw material.
9. The method for manufacturing a corrosion-resistant member for a semiconductor manufacturing apparatus according to claim 7 , wherein an amount of impurity metals is 0.1 wt % or less with respect to a total weight of the rare-earth oxide raw material.