IP Library Granted Patent US 8,680,443
Granted Patent B2
US 8,680,443 · App. 10/752,359 · Granted Mar 25, 2014

Combined material layering technologies for electric heaters

Inventors: James McMillin (Algonquin, IL); Louis P. Steinhauser (St. Louis, MO); Kevin Ptasienski (O'Fallon, MO)
Assignee: Watlow Electric Manufacturing Company
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Quick Facts
Patent No.
US 8,680,443
App. No.
10/752,359
Granted
Mar 25, 2014
Kind
B2
Abstract

A layered heater is provided with a dielectric layer formed by a first layered process, a resistive layer formed on the dielectric layer, the resistive layer formed by a second layered process, and a protective layer formed on the resistive layer, wherein the protective layer is formed by one of the first or second layered processes or yet another layered process. The first layered process is different than the second layered process in order to take advantage of the unique processing benefits of each of the first and second layered processes for a synergistic result. The layered processes include, by way of example, thick film, thin film, thermal spraying, and sol-gel. Additional functional layers are also provided by the present invention, along with methods of forming each of the individual layers.

Claims (30)

1. A layered heater comprising:

a plurality of resistive layers separated by a corresponding plurality of dielectric layers, wherein the plurality of resistive layers are formed on the corresponding plurality dielectric layers, and at least one of the plurality of resistive layers and the corresponding one of the plurality dielectric layers are formed by different layered processes.

2. The layered heater according to claim 1 , wherein the layered processes are selected from a group consisting of thick film, thin film, thermal spray and sol-gel.

3. The layered heater according to claim 1 , further comprising a substrate, wherein one of the plurality of dielectric layers is formed on the substrate.

4. The layered heater according to claim 3 , wherein the substrate is a stainless steel material.

5. The layered heater according to claim 1 , further comprising at least one conductor pad in contact with at least one of the resistive layers.

6. The layered heater according to claim 5 , wherein the conductor pad is formed by a layered process selected from a group consisting of thick film, thin film, thermal spray, and sol-gel.

7. The layered heater according to claim 1 further comprising:

a two-wire controller in communication with the layered heater,

wherein at least one of the resistive layers has sufficient temperature coefficient of resistance characteristics such that the resistive layer is a heater element and a temperature sensor and the two-wire controller determines temperature of the layered heater using the resistance of the resistive layer and controls heater temperature accordingly.

8. A layered heater comprising:

a substrate;

a graded layer formed on the substrate;

a dielectric layer formed on the graded layer, the dielectric layer formed by a first layered process; and

a resistive layer formed on the dielectric layer, the resistive layer formed by a second layered process,

wherein the first layered process is different than the second layered process.

9. The layered heater according to claim 8 further comprising:

a protective layer formed on the resistive layer, the protective layer formed by a layered process.

10. A layered heater comprising:

a dielectric layer formed by a sol-gel process;

a resistive layer formed on the dielectric layer, the resistive layer formed by a thick film process; and

a protective layer formed on the resistive layer, the protective layer formed by a sol-gel process.

11. A layered heater comprising:

a dielectric layer formed by a thermal spray process;

a resistive layer formed on the dielectric layer, the resistive layer formed by a thick film process; and

a protective layer formed on the resistive layer, the protective layer formed by a sol-gel process.

12. A layered heater comprising:

a dielectric layer formed by a sol-gel process;

a resistive layer formed on the dielectric layer, the resistive layer formed by a thermal spray process; and

a protective layer formed on the resistive layer, the protective layer formed by a sol-gel process.

Assignments (2)
PATENT SECURITY AGREEMENT (SHORT FORM) Recorded Mar 3, 2021
From: WATLOW ELECTRIC MANUFACTURING COMPANY
To: BANK OF MONTREAL, AS ADMINISTRATIVE AGENT
Reel/Frame 055479/0708 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2004
From: MCMILLIN, JAMES; STEINHAUSER, LOUIS P.; PTASIENSKI, KEVIN
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 014868/0129 →
Continuity (2)
Related Publication 20050145617A1 · Jul 7, 2005
Related Publication 20070278213A2 · Dec 6, 2007