Semiconductor device and driving apparatus including semiconductor device

1. A semiconductor device comprising:

a semiconductor module including a plurality of switching elements, a plurality of conductors, and a molded member, the switching elements being related to switching of electric current, each of the switching elements mounted on a corresponding one of the conductors, the molded member covering the switching elements and the conductors; and

a pressing member configured to press the semiconductor module to a heat radiation member,

wherein more than three of the switching elements are disposed around the pressing member,

wherein the switching elements are disposed in a region in which a pressure generated between the semiconductor module and the heat radiation member by pressing with the pressing member is greater than or equal to a predetermined pressure with which heat generated from the switching elements is releasable from the semiconductor module to the heat radiation member.

2. The semiconductor device according to claim 1 ,

wherein the molded member has a first surface and a second surface opposite from the first surface,

wherein the semiconductor module further includes a winding terminal protruding from the first surface and coupled with a winging and a control terminal protruding from the second surface and coupled with a control substrate.

3. The semiconductor device according to claim 1 ,

wherein the molded member has a middle line that is equidistant from the first surface and the second surface,

wherein the pressing member is disposed between the middle line and the second surface,

wherein one of the switching elements is disposed between the pressing member and the first surface, and

wherein another of the switching elements is disposed in a region from which a distance to the second surface is equal to a distance between the pressing member and the second surface.

4. The semiconductor device according to claim 3 ,

wherein four of the switching elements are disposed around the pressing member,

wherein two of the four switching elements are disposed between the pressing member and the first surface, and

wherein the other two of the four switching elements are disposed on either side of the pressing member and are disposed in the region from which the distance to the second surface is equal to the distance between the pressing member and the second surface.

5. The semiconductor device according to claim 3 ,

wherein the switching element disposed between the pressing member and the first surface is a high-potential side switching element coupled to a high potential side, and

wherein the switching element disposed in the region from which the distance to the second surface is equal to the distance between the pressing member and the second surface is a low-potential side switching element coupled to a low potential side of the high-potential side switching element.

6. The semiconductor device according to claim 1 ,

wherein the pressing member includes a screw.

7. The semiconductor device according to claim 1 ,

wherein the pressing member includes a spring member.

8. The semiconductor device according to claim 1 , further comprising

a medium member disposed between the semiconductor module and the heat radiation member.

9. A driving apparatus comprising:

a motor including a winding; and

a control unit disposed on a side of the motor in an axial direction of the motor, the control unit including the semiconductor device according to claim 1 electrically coupled with the winding, the heat radiation member to which the semiconductor module is pressed with the pressing member, and a substrate electrically coupled with the semiconductor module.