Light source, light-emitting module having the same and backlight unit have the same
A light source includes a heat-dissipating plate, a heat-dissipating pin protruding from the heat-dissipating plate, a light emitting chip for emitting light, and a housing surrounding the light emitting chip, the housing having a receiving space spanning from a top surface to a bottom surface of the housing, wherein the heat-dissipating plate is disposed on the bottom surface of the housing, wherein the light emitting chip is disposed on the heat-dissipating plate exposed by the receiving space.
1. A light source comprising:
a heat-dissipating plate disposed on a base substrate;
a heat-dissipating pin protruding from and continuously extending from the heat-dissipating plate, wherein a first end of the heat-dissipating pin opposite a leading end of the heat-dissipating pin continuously extends from the heat-dissipating plate, wherein the heat-dissipating pin extending from the heat dissipating plate forms a substantial L-shape, wherein the heat-dissipating plate on the base substrate is a first leg of the substantial L-shape, and the heat dissipating pin is a second leg of the substantial L-shape, the second leg of the substantial L-shape extending into a hole formed in the base substrate;
a heat-dissipating layer including a first portion disposed between the base substrate and the heat-dissipating plate forming the first leg, a second portion disposed on a bottom exterior surface of the base substrate, and a connecting portion extending into the hole in the base substrate, wherein the connecting portion connects the first portion to the second portion and is disposed on a sidewall of the base substrate and in contact with the heat-dissipating pin forming the second leg;
a light emitting chip for emitting light;
a housing surrounding the light emitting chip, the housing having a receiving space spanning from a top surface to a bottom surface of the housing, wherein the heat-dissipating plate is disposed on the bottom surface of the housing, wherein the light emitting chip is disposed on the heat-dissipating plate exposed by the receiving space, and the light emitting chip makes contact to the heat-dissipating plate;
a first solder disposed on a corner edge of the heat-dissipating plate and on the first portion of the heat-dissipating layer to connect the corner edge of the heat-dissipating plate to the first portion of the heat-dissipating layer; and
a second solder connecting an end portion of the heat-dissipating pin to the connecting portion of the heat-dissipating layer in the hole of the base substrate and the second portion of the heat-dissipating layer.
2. The light source of claim 1 , further comprising:
a power-transmitting part fixed to the housing adjacent to the heat-dissipating plate, and exposed to the outside of the housing; and
a plurality of power connecting wires electrically connecting the light-emitting chip with the power-transmitting part.
3. The light source of claim 2 , wherein the power-transmitting part comprises power input and power output parts fixed to the housing and positioned respectively adjacent to both sides of the heat-dissipating plate along a second direction substantially perpendicular to the first direction, and the power input and output parts extend beyond the housing.
4. The light source of claim 3 , wherein the heat-dissipating pin extends substantially perpendicular to the heat-dissipating plate, and the power input and power output parts are exposed through the receiving space and extend substantially parallel with the bottom surface of the housing.
5. The light source of claim 1 , further comprising an insulating adhesive disposed between the light-emitting chip and the heat-dissipating plate.
6. The light source of claim 1 , further comprising a light-transmitting window covering the receiving space and transmitting light emitted from the light-emitting chip.
7. A light-emitting module comprising:
a base substrate and a power line, the base substrate having a first surface on which a plurality of light source areas is defined and a second surface facing the first surface, a combination hole being formed through the base substrate from the first surface to the second surface in the light source area, the power line being formed adjacent to the light source area, wherein the first surface is located on an exterior top surface of the base substrate and the second surface is located on an exterior bottom surface of the base substrate; and
a light source including:
a heat-dissipating plate disposed on the base substrate;
a heat-dissipating pin protruding from and continuously extending from the heat-dissipating plate and inserted into the combination hole, wherein a first end of the heat-dissipating pin opposite a leading end of the heat-dissipating pin continuously extends from the heat-dissipating plate, wherein the heat-dissipating pin extending from the heat dissipating plate forms a substantial L-shape, wherein the heat-dissipating plate on the base substrate is a first leg of the substantial L-shape, and the heat dissipating pin is a second leg of the substantial L-shape, the second leg of the substantial L-shape extending into the combination hole formed through the base substrate;
a heat-dissipating layer including a first portion disposed between the base substrate and the heat-dissipating plate forming the first leg, a second portion disposed on the exterior bottom surface of the base substrate adjacent to the combination hole, and a connecting portion extending into an inner surface of the combination hole in the base substrate, wherein the first portion contacts an exterior bottom surface of the heat-dissipating plate forming the first leg and wherein the connecting portion connects the first portion to the second portion and is disposed on a sidewall of the base substrate and in contact with the heat-dissipating pin forming the second leg;
a light emitting chip electrically connected to the power line;
a housing surrounding the light emitting chip, the housing having a receiving space spanning from a top surface to a bottom surface of the housing,
wherein the heat-dissipating plate is disposed on the bottom surface of the housing,
wherein the light emitting chip is disposed on the heat-dissipating plate exposed by the receiving space, and the light emitting chip makes contact to the heat-dissipating plate;
a first solder disposed on a corner edge of the heat-dissipating plate and on the first portion of the heat-dissipating layer to connect the corner edge of the heat-dissipating plate to the first portion of the heat-dissipating layer; and
a second solder connecting an end portion of the heat-dissipating pin to the connecting portion of the heat-dissipating layer in the hole of the base substrate and the second portion of the heat-dissipating layer.
8. The light-emitting module of claim 7 , further comprising:
power input and power output parts fixed to the housing and respectively adjacent to both sides of the heat-dissipating plate along a second direction substantially perpendicular to the first direction, and extending beyond the housing and electrically connected with power input and power output lines of the power line, respectively; and
a plurality of power connecting wires respectively connecting the power input and power output parts with the light-emitting chip.
9. The light-emitting module of claim 8 , wherein the heat-dissipating pin extends substantially perpendicular to the heat-dissipating plate, and the power input and power output parts extend substantially parallel with the first surface.
10. The light-emitting module of claim 7 , wherein the heat-dissipating pin protrudes beyond the second surface of the base substrate.
11. A backlight unit (BLU) comprising:
a receiving container including a bottom plate;
a base substrate and a power line, the base substrate having a first surface on which a plurality of light source areas is defined, and a second surface facing the first surface and facing the bottom plate, a combination hole being formed through the base substrate from the first surface to the second surface in the light source area, the power line being formed adjacent to the light source area, wherein the first surface is located on an exterior top surface of the base substrate and the second surface is located on an exterior bottom surface of the base substrate; and
a light source including:
a heat-dissipating plate disposed on the base substrate;
a heat-dissipating pin protruding from and continuously extending from the heat-dissipating plate and inserted into the combination hole, wherein a first end of the heat-dissipating pin opposite a leading end of the heat-dissipating pin continuously extends from the heat-dissipating plate, wherein the heat-dissipating pin extending from the heat dissipating plate forms a substantial L-shape, wherein the heat-dissipating plate on the base substrate is a first leg of the substantial L-shape, and the heat dissipating pin is a second leg of the substantial L-shape, the second leg of the substantial L-shape extending into the combination hole formed through the base substrate;
a heat-dissipating layer including a first portion disposed between the base substrate and the heat-dissipating plate forming the first leg, a second portion disposed on the exterior bottom surface of the base substrate adjacent to the combination hole, and a connecting portion extending into an inner surface of the combination hole in the base substrate, wherein the first portion contacts an exterior bottom surface of the heat-dissipating plate forming the first leg and wherein the connecting portion connects the first portion to the second portion and is disposed on a sidewall of the base substrate and in contact with the heat-dissipating pin forming the second leg;
a light emitting chip electrically connected to the power line;
a housing surrounding the light emitting chip, the housing having a receiving space spanning from a top surface to a bottom surface of the housing,
wherein the heat-dissipating plate is disposed on the bottom surface of the housing,
wherein the light emitting chip is disposed on the heat-dissipating plate exposed by the receiving space, and the light emitting chip makes contact to the heat-dissipating plate;
a first solder disposed on a corner edge of the heat-dissipating plate and on the first portion of the heat-dissipating layer to connect the corner edge of the heat-dissipating plate to the first portion of the heat-dissipating layer; and
a second solder connecting an end portion of the heat-dissipating in to the connecting portion of the heat-dissipating layer in the hole of the base substrate and the second portion of the heat-dissipating layer.
12. The BLU of claim 11 , wherein the light source further comprises the power-transmitting part including power input and power output parts fixed to the housing and respectively adjacent to both sides of the heat-dissipating plate along a second direction substantially perpendicular to the first direction, the power input part and the power output part extending beyond the housing to be electrically connected with power input and power output lines of the power line, respectively.
13. The BLU of claim 11 , further comprising a heat-dissipating sheet disposed between the bottom plate and the second surface and contacting the second surface and the heat-dissipating layer.
14. The BLU of claim 11 , wherein the heat-dissipating pin has a length shorter than a thickness of the base substrate.