IP Library › Granted Patent US 868,993
Granted Patent S1
US 868,993 · App. 29/635,287 · Granted Dec 3, 2019

Electrode plate for a plasma processing apparatus

Inventors: Masakazu Isozaki (Tokyo, JP); Masahito Mori (Tokyo, JP); Kenetsu Yokogawa (Tokyo, JP); Takao Arase (Tokyo, JP); Takahisa Hashimoto (Tokyo, JP)
Assignee: Hitachi High-Technologies Corporation
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Quick Facts
Patent No.
US 868,993
App. No.
29/635,287
Granted
Dec 3, 2019
Kind
S1
Claims (1)

The ornamental design for an electrode plate for a plasma processing apparatus, as shown and described.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2018
From: ISOZAKI, MASAKAZU; MORI, MASAHITO; YOKOGAWA, KENETSU; ARASE, TAKAO; HASHIMOTO, TAKAHISA
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 046536/0291 →
Priority Claims (1)
JP 2017-018889 · Aug 31, 2017 · national