IP Library › Granted Patent US 870,314
Granted Patent S1
US 870,314 · App. 29/635,292 · Granted Dec 17, 2019

Electrode cover for a plasma processing apparatus

Inventors: Masakazu Isozaki (Tokyo, JP); Masahito Mori (Tokyo, JP); Kenetsu Yokogawa (Tokyo, JP); Takao Arase (Tokyo, JP); Yousuke Sakai (Tokyo, JP)
Assignee: Hitachi High-Technologies Corporation
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Quick Facts
Patent No.
US 870,314
App. No.
29/635,292
Granted
Dec 17, 2019
Kind
S1
Claims (1)

The ornamental design for an electrode cover for a plasma processing apparatus, as shown and described.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2018
From: ISOZAKI, MASAKAZU; MORI, MASAHITO; YOKOGAWA, KENETSU; ARASE, TAKAO; SAKAI, YOUSUKE
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 046562/0692 →
Priority Claims (1)
JP 2017-018891 · Aug 31, 2017 · national