Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device
The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer. The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate. The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.
1. An implantable device comprising:
a flexible circuit including
a polymer base layer, defining a void suitable to form an attachment point,
patterned metal traces deposited on the polymer base layer forming electrodes in an electrode array suitable to contact neural tissue, bond pads and traces connecting the electrodes to bond pads, and
a polymer top layer deposited on the polymer base layer and the metal traces; and
an electronic package bonded to the bond pads;
wherein the bond pads are located on the opposite side of the flexible circuit from the electrodes.
2. The implantable device according to claim 1 , wherein the electrode array includes electrodes suitable to stimulate neural tissue.
3. The implantable device according to claim 1 , wherein the polymer base layer contain polyimide, polyamide, LCP, Peek, polypropylene, polyethylene, paralyne, BCB or mixtures or copolymers or block copolymer thereof
4. The implantable device according to claim 1 , wherein the traces contain Pt, Pd, Au, Ni, Ru, Ti, or alloys or layers thereof.
5. The implantable device according to claim 4 , wherein the traces contain one or more layers.
6. The implantable device according to claim 1 , wherein the electrodes contain Pt gray, Pt, Pd, Au, Ni, Ru, Ti, or alloys or layers thereof.
7. The implantable device according to claim 1 , wherein the polymer base layer has a thickness of 2 μm to 4 μm.
8. The implantable device according to claim 1 , wherein the electrode array is suitable to attach to retina and the bond pads are suitable to attach to bond pads of an electronic package.
9. The implantable device according to claim 1 , wherein the electrodes comprise plated platinum grey.
10. The implantable device according to claim 1 , wherein the bond pads comprise plated platinum grey.
11. The implantable device according to claim 1 , wherein the polymer top layer defines voids at the electrodes.
12. The implantable device according to claim 1 , wherein the polymer base layer defines voids at the bond pads.
13. The implantable device according to claim 1 , further comprising a soft polymer, softer than the polymer base layer, covering at least part of the flexible circuit electrode array.
14. The implantable device according to claim 1 , further comprising a stress relief surrounding the attachment point.