Maintaining alignment in a multi-chip module using a compressible structure
An MCM includes a two-dimensional array of facing chips, including island chips and bridge chips that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures are in cavities in a substrate, which house the bridge chips, provide a compressive force on back surfaces of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.
1. A multi-chip module (MCM), comprising:
a substrate having a first surface and a cavity defined by an edge in the first surface, wherein a bottom of the cavity is vertically offset from the first surface;
an island chip having a second surface, wherein the island chip is mechanically coupled to the first surface;
a bridge chip having a third surface that faces the second surface, wherein the bridge chip is mechanically coupled to the island chip, and wherein the bridge chip is positioned in the cavity; and
a compressible structure positioned between the bottom of the cavity and a fourth surface of the bridge chip which is on an opposite side of the bridge chip from the third surface, wherein the compressible structure includes a compliant material with shape and volume compression, wherein the compressible structure is separate from the substrate, thereby allowing the compressible structure to slide laterally; and
wherein the compressible structure provides a force on the bridge chip so that the second surface and the third surface are approximately coplanar without bending the bridge chip.
2. The MCM of claim 1 , wherein the bridge chip is electrically coupled to the island chip by proximity-communication connectors.
3. The MCM of claim 2 , wherein the proximity-communication connectors include one of: capacitive proximity-communication connectors, inductive proximity-communication connectors, conductive proximity-communication connectors, and optical proximity-communication connectors.
4. The MCM of claim 2 , wherein the proximity-communication connectors include micro-spring connectors.
5. The MCM of claim 1 , wherein the island chip is electrically coupled to the first surface by solder.
6. The MCM of claim 1 , wherein the bridge chip is mechanically coupled to the island chip by pairs of negative features on the second surface and the third surface and positive features that mate with corresponding pairs of negative features.
7. The MCM of claim 6 , wherein the negative features include pits and the positive features includes spherical balls.
8. The MCM of claim 6 , wherein the pairs of negative features are proximate to corners of the bridge chip and the island chip.
9. The MCM of claim 1 , wherein the compressible structure includes one of: a cylindrically shaped feature, an elliptically shaped bump, and a follicle-shaped feature.
10. The MCM of claim 1 , wherein the compressible structure is other than a spring.
11. The MCM of claim 1 , wherein the compliant material includes an elastomer.
12. A system, comprising:
a processor;
a memory storing a program module that is configured to be executed by the processor; and
an MCM, wherein the MCM includes:
a substrate having a first surface and a cavity defined by an edge in the first surface, wherein a bottom of the cavity is vertically offset from the surface;
an island chip having a second surface, wherein the island chip is mechanically coupled to the first surface;
a bridge chip having a third surface that faces the second surface, wherein the bridge chip is mechanically coupled to the island chip, and wherein the bridge chip is positioned in the cavity; and
a compressible structure positioned between the bottom of the cavity and a fourth surface of the bridge chip which is on an opposite side of the bridge chip from the third surface, wherein the compressible structure includes a compliant material with shape and volume compression, wherein the compressible structure is separate from the substrate, thereby allowing the compressible structure to slide laterally; and
wherein the compressible structure provides a force on the bridge chip so that the second surface and the third surface are approximately coplanar without bending the bridge chip.
13. The system of claim 12 , wherein the bridge chip is electrically coupled to the island chip by proximity-communication connectors.
14. The system of claim 13 , wherein the proximity-communication connectors include one of: capacitive proximity-communication connectors, inductive proximity-communication connectors, conductive proximity-communication connectors, and optical proximity-communication connectors.
15. The system of claim 13 , wherein the proximity-communication connectors include micro-spring connectors.
16. The system of claim 12 , wherein the island chip is electrically coupled to the first surface by solder.
17. The system of claim 12 , wherein the bridge chip is mechanically coupled to the island chip by pairs of negative features on the second surface and the third surface and positive features that mate with corresponding pairs of negative features.
18. The system of claim 12 , wherein the compressible structure is other than a spring.
19. The system of claim 12 , wherein the compliant material includes an elastomer.
20. A method for maintaining alignment of an island chip and a bridge chip in an MCM, the method comprising:
positioning a compressible structure in a cavity, defined by an edge, in a first surface of a substrate in the MCM, wherein the compressible structure includes a compliant material with shape and volume compression, and where a bottom of the cavity is vertically offset from the first surface, wherein the compressible structure is separate from the substrate, thereby allowing the compressible structure to slide laterally;
positioning a bridge chip, which has a third surface and a fourth surface on an opposite side of the bridge chip from the third surface, in the cavity on top of the compressible structure, wherein the fourth surface is mechanically coupled to the compressible structure; and
mechanically coupling an island chip, having a second surface, to the first surface and the third surface, wherein the compressible structure provides a force on the bridge chip so that the second surface and the third surface are approximately coplanar without bending the bridge chip.