Integrated circuit package including embedded thin-film battery
An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.
1. An integrated circuit package apparatus, comprising:
a thin-film battery adhered to a first surface of a substrate;
an integrated circuit die overlying at least a portion of the thin-film battery such that the portion of the thin-film battery is interposed between the substrate and the integrated circuit die;
a lead frame adhered to one of a portion of the thin-film battery underlying the integrated circuit die and a second surface of the substrate opposite the first surface, wherein the lead frame is electrically connected to the integrated circuit die;
an electrical connection between the integrated circuit die and the thin-film battery; and
a crystal mounted to a surface of the substrate facing the integrated circuit die such that the crystal and the thin-film battery are disposed in separate areas on the substrate,
wherein the integrated circuit die, the lead-frame, the substrate, the thin-film battery, the electrical connection and the crystal are encapsulated together within an encapsulant material.
2. The apparatus of claim 1 , wherein the thin-film battery is one of a lithium-ion battery and a lithium-free battery.
3. The apparatus of claim 1 , wherein the lead-frame includes a die pad, the die pad having a pair of oppositely facing sides, the integrated circuit die attached to one of the sides and the substrate attached to the other of the sides.
4. The apparatus of claim 1 , wherein the substrate is a flexible substrate.
5. The apparatus of claim 4 , wherein the substrate is an electrically conductive foil substrate.
6. The apparatus of claim 5 , wherein the substrate is a copper foil substrate.
7. The apparatus of claim 1 , wherein the lead-frame includes a die pad on which the integrated circuit die is supported, and wherein the die pad is the substrate on which the thin-film battery is provided.
8. The apparatus of claim 1 , wherein the lead-frame includes a die pad on which the integrated circuit die is supported, the thin-film battery interposed between the die pad and the integrated circuit die.
9. The apparatus of claim 8 , wherein the thin-film battery includes an anode electrically connected to a back of the integrated circuit die, and a cathode electrically connected to the die pad, and wherein the die pad is electrically connected to the integrated circuit die.
10. The apparatus of claim 9 , wherein the back of the integrated circuit die is grounded, and the die pad is wire bonded to a voltage supply pad of the integrated circuit die.
11. The apparatus of claim 8 , wherein the substrate is an electrically conductive foil.
12. The apparatus of claim 11 , wherein the substrate is attached to the die pad by an electrically conductive epoxy.
13. The apparatus of claim 11 , wherein the substrate is a copper foil substrate.
14. The apparatus of claim 8 , wherein the die pad is the substrate.
15. The apparatus of claim 8 , wherein the substrate is attached to the die pad and the integrated circuit die is stacked on the thin-film battery.
16. The apparatus of claim 1 , wherein the integrated circuit die is the substrate.
17. An integrated circuit package, comprising:
a thin-film battery having an anode and a cathode and adhered to a first surface of a substrate;
an integrated circuit die overlying at least a portion of the thin-film battery such that the portion of the thin-film battery is interposed between the substrate and the integrated circuit die;
a lead frame adhered to one of a portion of the thin-film battery underlying the integrated circuit die and a second surface of the substrate opposite the first surface, wherein the lead frame is electrically connected to the integrated circuit die;
a crystal; and
an encapsulant material encapsulating the thin-film battery, the lead-frame, the integrated circuit die and the crystal, wherein the thin-film battery is mounted on the lead-frame in physical contact with the lead-frame, the lead-frame is electrically coupled to one of the anode and cathode, and the integrated circuit die is electrically coupled to the crystal, the lead-frame and the other of the anode and cathode.
18. The integrated circuit package of claim 17 , wherein the integrated circuit die is electrically coupled to the thin-film battery by an electrically conductive epoxy.
19. The integrated circuit of claim 18 , wherein the integrated circuit die is electrically connected to the lead-frame by a wire bond connection.
20. An integrated circuit package, comprising:
a thin-film battery having first and second surfaces on opposing sides of the thin-film battery and adhered to a first surface of a substrate;
an integrated circuit die overlying at least a portion of the thin-film battery such that the portion of the thin-film battery is interposed between the substrate and the integrated circuit die, wherein the integrated circuit die is electrically coupled to the second surface;
a lead-frame adhered to one of a portion of the thin-film battery underlying the integrated circuit die and a second surface of the substrate opposite the first surface such that the portion of the thin-film battery, the integrated circuit die and a portion of the lead-frame are in stacked alignment, wherein the lead frame is electrically coupled to the first surface;
a crystal electrically coupled to the integrated circuit; and
an encapsulant material encapsulating the thin-film battery, the lead-frame, the integrated circuit die and the crystal.
21. The integrated circuit of claim 20 , wherein the substrate is an electrically conductive foil.
22. The integrated circuit of claim 21 , wherein the lead-frame is electrically coupled to the substrate by an electrically conductive epoxy.
23. The integrated circuit of claim 22 , wherein the integrated circuit die is electrically coupled to the second surface by an electrically conductive epoxy.
24. The apparatus of claim 1 , wherein the thin-film battery is less than fifteen micrometers thick, wherein the thin-film battery is fabricated on the substrate, and wherein the substrate does not comprise bonding pads.