IP Library Granted Patent US 8,784,621
Granted Patent B1
US 8,784,621 · App. 13/250,070 · Granted Jul 22, 2014

Wafer carrier comprising a variable aperture shield

Inventor: Rico Sto. Domingo (Calamba, PH)
Assignee: DECA Technologies Inc.
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Quick Facts
Patent No.
US 8,784,621
App. No.
13/250,070
Granted
Jul 22, 2014
Kind
B1
Abstract

A wafer carrier is described. In one embodiment, the wafer carrier includes a variable aperture shield.

Claims (15)

1. A wafer carrier, comprising:

a variable aperture shield, the variable aperture shield further comprising:

a cover plate,

a fixed base plate, and

a plurality of fins forming a variable aperture of the variable aperture shield, the plurality of fins mounted on the fixed base plate and disposed between the fixed base plate and the cover plate, wherein at least one of the plurality of fins is configured to move towards or away from a center of the variable aperture when the cover plate is moved such that at least one of the plurality of fins overlaps an adjacent fin and changes a diameter of the variable aperture.

2. The wafer carrier of claim 1 wherein the movement comprises a rotation of at least one of the plurality of the fins.

3. The wafer carrier of claim 2 wherein the rotation of the fins comprises a simultaneous rotation of the plurality of fins.

4. The wafer carrier of claim 1 wherein the movement of the plurality of fins comprises a convergence of the plurality of fins towards the center of the variable aperture.

5. The wafer carrier of claim 1 wherein each of the plurality of fins comprises a pivot point configured to move the fin with respect to the fixed base plate.

6. The wafer carrier of claim 1 wherein each of the plurality of fins comprises a lever point configured to move the fin towards or away from the center of the variable aperture.

7. The wafer carrier of claim 1 wherein the variable aperture shield further comprising a cover plate mounted onto the fixed base plate.

8. The wafer carrier of claim 7 wherein the cover plate is clamped onto the fixed base plate to align a center of the cover plate with a center of the fixed base plate upon movement of the cover plate.

9. The wafer carrier of claim 7 wherein the plurality of fins are positioned between the fixed base plate and the cover plate.

10. The wafer carrier of claim 7 wherein the cover plate is configured to move the lever points of the fin.

11. The wafer carrier of claim 7 , wherein the cover plate comprises a handle configured to move the cover plate to change a diameter of the variable aperture, the handle further configured to be disposed outside a plating bath.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 27, 2021
From: DECA TECHNOLOGIES USA, INC.
To: SEMSYSCO GMBH
Reel/Frame 058479/0846 →
CHANGE OF NAME Recorded Jan 18, 2021
From: DECA TECHNOLOGIES INC.
To: DECA TECHNOLOGIES USA, INC.
Reel/Frame 055017/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: DECA TECHNOLOGIES INC.
Reel/Frame 038346/0179 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2014
From: STO. DOMINGO, RICO
To: DECA TECHNOLOGIES INC.
Reel/Frame 032415/0480 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2012
From: DOMINGO, RICO STO.
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 027655/0788 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2012
From: DOMINGO, RICO STO.
To: DECA TECHNOLOGIES INC.
Reel/Frame 027660/0290 →
Continuity (2)
Provisional Application 61494339 · Jun 7, 2011
Provisional Application 61540238 · Sep 28, 2011