Optoelectric semiconductor chip
An optoelectronic semiconductor chip includes a semiconductor layer stack consisting of a nitride compound semiconductor material on a carrier substrate, wherein the carrier substrate includes a surface containing silicon. The semiconductor layer stack includes a recess extending from a back of the semiconductor layer stack through an active layer to a layer of a first conductivity type. The layer of the first conductivity type connects electrically to a first electrical connection layer which covers at least a portion of the back through the recess. The layer of a second conductivity type connects electrically to a second electrical connection layer arranged at the back.
1. An optoelectronic semiconductor chip comprising a semiconductor layer stack consisting of a nitride compound semiconductor material on a carrier substrate, wherein
the carrier substrate comprises a surface containing silicon and facing the semiconductor layer stack,
the semiconductor layer stack comprises an active layer that generates radiation arranged between a layer of a first conductivity type and a layer of a second conductivity type,
the layer of the first conductivity type is adjacent a front of the semiconductor layer stack,
the semiconductor layer stack contains at least one recess extending from a back, opposite the front, of the semiconductor layer stack through the active layer to the layer of the first conductivity type,
the layer of the first conductivity type electrically connects to a first electrical connection layer, which covers the back of the semiconductor layer stack at least in places, through the recess, and
the layer of the second conductivity type electrically connects to a second electrical connection layer arranged at the back,
a plurality of nanostructures is arranged on the front,
the nano structures are formed rod-like or are nanopyramids, nanowires or nanorods,
a conversion element is arranged on the front which converts at least some of the radiation emitted by the active layer into radiation of another wavelength, and
the conversion element is an InGaN layer arranged and integrated into the nanostructures.
2. The semiconductor chip according to claim 1 , wherein an interlayer is arranged in the semiconductor layer stack and/or on the front.
3. The semiconductor chip according to claim 1 , wherein the wavelength of the converted radiation is determined at least in part by diameters and/or distribution of the nanostructures.
4. The semiconductor chip according to claim 1 , wherein the semiconductor chip is a thin film chip.
5. The semiconductor chip according to claim 1 , wherein the semiconductor chip is an LED.