Method of manufacturing an OLED
The invention describes a method of manufacturing an OLED device ( 10 ), which method comprises applying a number of conductive strips ( 4 ) onto a substrate ( 1 ); depositing an organic layer ( 2 ) onto the substrate ( 1 ) within a region bounded by the conductive strips ( 4 ); applying a sealant onto the conductive strips ( 4 ) to encapsulate the OLED device ( 10 ); and depositing a conductive protective layer ( 6 ) at least partially onto each conductive strip ( 4 ) such that a surface of a conductive strip ( 4 ) external to the sealant is protected by the conductive protective layer ( 6 ). The invention also describes an OLED device ( 10 ) comprising a number of conductive strips ( 4 ) applied onto a substrate ( 1 ); an organic layer ( 2 ) deposited on the substrate ( 1 ) within a region bounded by the conductive strips ( 4 ); a conductive protective layer ( 6 ) deposited at least partially onto the conductive strips ( 4 ); and a sealant for encapsulating the OLED device ( 10 ), which sealant is applied to the conductive strips ( 4 ) such that a surface of the conductive strips ( 4 ) external to the sealant is protected by the conductive protective layer ( 6 ).
1. A method of manufacturing an OLED device comprising:
applying a number of conductive strips onto a substrate;
depositing an organic layer onto the substrate within a region bounded by the conductive strips;
applying a sealant onto the conductive strips to encapsulate the OLED device; and
depositing a conductive protective layer at least partially onto each conductive strip such that a surface of a conductive strip external to the sealant is protected by the conductive protective layer, wherein the step of depositing a conductive protective layer comprises transferring part of a transfer layer or a sequence of transfer layers from a carrier.
2. A method according to claim 1 , wherein the carrier comprises a plastic foil.
3. A method according to claim 1 , wherein the step of depositing a conductive protective layer onto each conductive strip comprises performing laser mass transfer to transfer the part of the transfer layer from the carrier onto the conductive strip.
4. A method according to claim 3 , wherein the step of performing laser mass transfer comprises depositing energy at a specific location in the transfer layer to cause the transfer layer to be at least partially transferred onto the conductive strip.
5. A method according to claim 2 , wherein the carrier is positioned with respect to the organic layer such that the transfer layer is in direct contact with the organic layer.
6. A method according to claim 2 , wherein the step of depositing a conductive protective layer onto each conductive strip precedes the step of applying a sealant onto the conductive strips.
7. An OLED device, comprising:
a number of conductive strips applied onto a substrate;
an organic layer deposited on the substrate within a region bounded by the conductive strips;
a conductive protective layer applied to abut at least one given conductive strip of the conductive strips at a lateral surface of said given conductive strip such that an electrical contact is established between the conductive protective layer and the given conductive strip; and
a sealant for encapsulating the OLED device, wherein said sealant is applied above said given conductive strip and is applied at a boundary between the conductive protective layer and the given conductive strip such that said lateral surface of the given conductive strip is protected by the conductive protective layer.
8. An OLED device according to claim 7 , wherein the conductive protective layer comprises a layer of at least one corrosion-resistant metal.
9. An OLED device according to claim 7 , wherein the conductive protective layer has a thickness of at most 1.0 μm.
10. An OLED device according to claim 9 , wherein the conductive protective layer has a thickness of less than about 100 nm.