IP Library Granted Patent US 8,841,687
Granted Patent B2
US 8,841,687 · App. 13/623,210 · Granted Sep 23, 2014

Light emitting device package and lighting system including the same

Inventors: Yon Tae Moon (Seoul, KR); Yun Soo Song (Seoul, KR); Kwang Kyu Choi (Seoul, KR)
Assignee: LG Innotek Co., Ltd.
H01L33/60F21V7/05H01L33/54F21Y2101/02H01L33/486F21K9/13H01L2924/0002F21Y2113/005F21Y2105/001
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Quick Facts
Patent No.
US 8,841,687
App. No.
13/623,210
Granted
Sep 23, 2014
Kind
B2
Abstract

Provided are a light emitting device package and a lighting system including the light emitting device package. The light emitting device package includes a package body, at least one electrode on the package body, a light emitting device on the package body, a reflective structure around the light emitting device on the package body and a lens on the light emitting device and the electrode.

Claims (51)

1. A light emitting device package comprising:

a package body;

at least one electrode on the package body;

a light emitting device on the package body;

a reflective structure around the light emitting device on the package body; and

a lens on the light emitting device, wherein the lens covers the reflective structure,

wherein the electrode comprises:

a upper electrode disposed on the package body;

a middle electrode connecting to the upper electrode and passing through inside the package body: and

a lower electrode connecting to the middle electrode and disposed under the parking body,

wherein the reflective structure is disposed on a part of the upper electrode of the electrode in the lens.

2. The light emitting device package according to claim 1 , wherein the lens is contact with the upper electrode of the electrode

wherein the reflective structure is contact with the upper electrode of the electrode.

3. The light emitting device package according to claim 1 , wherein the reflective structure surrounds the light emitting device.

4. The light emitting device package according to claim 1 , wherein a top surface of the reflective structure is higher than a top surface of the light emitting device from a top surface of the package body.

5. The light emitting device package according to claim 1 , wherein at least one portion of the reflective structure is disposed between the lens and the electrode.

6. The light emitting device package according to claim 1 , wherein the reflective structure comprises a plurality of layers formed of different materials or the same material.

7. The light emitting device package according to claim 1 , wherein the lens and the reflective structure are different in an index of refraction.

8. The light emitting device package according to claim 1 , wherein the reflective structure has a cone type in a cross section view.

9. The light emitting device package according to claim 1 , wherein the reflective structure has a side surface having an angle of inclination smaller than 90° from a horizontal line.

10. The light emitting device package according to claim 1 , wherein the reflective structure comprises an oxide film formed of at least one of TiO 2 and SiO 2 .

11. The light emitting device package according to claim 1 , wherein the package body comprises a ceramic dielectric layer.

12. A light emitting device package comprising:

a package body;

at least one electrode on the package body;

a light emitting device on the package body;

a reflective structure around the light emitting device on the package body; and

a lens on the light emitting device, wherein the lens covers the reflective structure, and

wherein the lens and the reflective structure are different in an index of refraction,

wherein the electrode comprises:

a upper the package body;

a middle electrode connecting to the upper electrode and passing through inside the package body: and

a lower electrode connecting to the middle electrode and disposed under the package body,

wherein a part of the lens is contact with the upper electrode.

13. The light emitting device package according to claim 3 , wherein the reflective structure is provided in the form of a dam or a ring.

14. The light emitting device package according to claim 5 , wherein the reflective structure is disposed on the electrodes and under periphery of the lens.

15. The light emitting device package according to claim 9 , wherein the reflective structure has a side surface having an angle of inclination larger than 45° from a horizontal lint.

16. The light emitting device package according to claim 11 , wherein the package body is formed of a nitride or oxide.

17. The light emitting device package according to claim 11 , wherein the package body is comprised at least one of SiO 2 , Si x O y , Si 3 N 4 , Si x N y , SiO x N y , Al 2 O 3 , or AlN.

18. A light emitting device package comprising:

a package body;

at least one electrode on the package body;

a light emitting device on the package body;

a reflective structure around the light emitting device on the package body; and

a lens on the light emitting device, wherein the lens covers the reflective structure,

wherein the angle of inclination of the side surface of the reflective structure is range from about 45° to about 90°,

wherein the electrode comprises:

a upper electrode disposed on the package body;

a lower electrode disposed under the package body,

wherein the reflective structure is disposed on a part of the upper electrode of the electrode

wherein a part of the lens is contact with the upper electrode.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2012
From: MOON, YON TAE; SONG, YUN SOO; CHOI, KWANG KYU
To: LG INNOTEK CO., LTD.
Reel/Frame 028994/0503 →
Priority Claims (1)
KR 10-2011-0094802 · Sep 20, 2011 · national
Continuity (1)
Related Publication 20130070441A1 · Mar 21, 2013