IP Library Granted Patent US 8,845,307
Granted Patent B2
US 8,845,307 · App. 12/929,635 · Granted Sep 30, 2014

Micro-ejector and method for manufacturing the same

Inventors: Changsung Sean Kim (Gyunggi-do, KR); Sang Jin Kim (Gyunggi-do, KR); Suk Ho Song (Gyunggi-do, KR)
Assignee: Samsung Electro-Mechanics Co., Ltd.
B01L3/0268B01L2400/086F04B43/043
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Quick Facts
Patent No.
US 8,845,307
App. No.
12/929,635
Granted
Sep 30, 2014
Kind
B2
Abstract

There are provided a micro-ejector and a method for manufacturing the same. The micro-ejector according to the present invention includes a passage plate including a barrier rib portion disposed in an upper space in a chamber and a protruding portion disposed in a lower space in the chamber and forming a passage in the same direction as a fluid discharging direction together with the barrier rib portion; and an actuator formed on the upper portion of the passage plate to correspond to the chamber and providing a driving force of discharging the fluid to the nozzle from the chamber.

Claims (30)

1. A micro-ejector, comprising:

an upper substrate including

a groove for a chamber, and

a barrier rib portion formed downwardly in a thickness direction within the groove in which the chamber of the upper substrate is formed, the barrier rib portion forming a plurality of passages in the chamber by partitioning an inner space of the chamber;

a lower substrate coupled to the upper substrate, the lower substrate including

a protruding portion protruding upwardly from an upper surface of the lower substrate, having an upper surface in contact with a lower surface of the barrier rib portion within the chamber, and forming the passages in a fluid discharging direction together with the barrier rib portion; and

at least one actuator disposed on an upper surface of the upper substrate to correspond to the passages and providing a driving force of discharging the fluid from the chamber to a nozzle.

2. The micro-ejector of claim 1 , wherein the widths of the upper substrate and the lower substrate are formed to be narrow in a direction towards the nozzle from the chamber.

3. The micro-ejector of claim 1 , wherein the fluid, passing through the passages formed by the barrier rib portion and the protruding portion in the chamber, is integrated in one passage to be supplied to the nozzle.

4. The micro-ejector of claim 1 , wherein the width of the nozzle is formed to be narrow in the fluid discharging direction.

5. The micro-ejector of claim 1 , wherein the width of the nozzle is formed to be narrow stepwise in the fluid discharging direction.

6. The micro-ejector of claim 1 , wherein the barrier rib portion includes a guide portion disposed at a longitudinal end thereof and guiding the fluid to flow into or out of the chamber.

7. The micro-ejector of claim 1 , wherein the actuators are formed above each of the passages formed by the barrier rib portion and the protruding portion.

8. The micro-ejector of claim 1 , wherein the lower substrate is formed by sequentially stacking a lower silicon layer, an insulating layer, and an upper silicon layer, and

the protruding portion is formed by the upper silicon layer.

9. A method for manufacturing a micro-ejector, comprising:

preparing an upper substrate having a groove for a chamber therein and a lower substrate;

forming a barrier rib portion in the groove in order to form a plurality of passages in the chamber by partitioning an inner space of the chamber and forming a protruding portion on the lower substrate, the protruding portion disposed to be in contact with the barrier rib portion in the chamber and forming the passages in the same direction as a fluid discharging direction, the forming the barrier rib portion in the groove being performed by etching portions of the upper substrate, other than a portion thereof for forming the barrier rib portion, such that the barrier rib portion is formed in an inner space of the chamber, and the forming the protruding portion on the lower substrate being performed by removing portions thereof other than portions thereof to be formed as the protruding portion; and

forming at least one actuator on the upper surface of the upper substrate to correspond to the passages, the at least one actuator providing a driving force for discharging the fluid from the chamber to a nozzle.

10. The method for manufacturing the micro-ejector of claim 9 , wherein the preparing of the upper substrate and the lower substrate comprises forming the widths thereof to be narrowed in a direction towards the nozzle from the chamber.

11. The method for manufacturing the micro-ejector of claim 9 , wherein the forming of the barrier rib portion and the protruding portion comprises allowing the fluid, passing through the passages formed by the barrier rib portion and the protruding portion in the chamber, to be integrated in one passage to be supplied to the nozzle.

12. The method for manufacturing the micro-ejector of claim 9 , further comprising forming a width of the nozzle to be narrowed in the fluid discharging direction.

13. The method for manufacturing the micro-ejector of claim 9 , further comprising forming a width of the nozzle to be narrowed in a stepwise manner in the fluid discharging direction.

14. The method for manufacturing the micro-ejector of claim 9 , wherein the forming of the barrier rib portion comprises forming a guide portion disposed at a longitudinal end thereof and guiding the fluid to flow into or out of the chamber.

15. The method for manufacturing the micro-ejector of claim 9 , wherein the forming of the actuators comprises forming the actuators above each of the passages formed by the barrier rib portion and the protruding portion.

16. The method for manufacturing the micro-ejector of claim 9 , wherein the preparing of the lower substrate is performed by sequentially stacking a lower silicon layer, an insulating layer, and an upper silicon layer.

17. The method for manufacturing the micro-ejector of claim 9 , further comprising bonding the upper substrate to the lower substrate,

wherein the bonding of the upper substrate to the lower substrate is made by silicon direct bonding (SDB).

18. The method for manufacturing the micro-ejector of claim 9 , further comprising bonding the upper substrate to the lower substrate,

wherein the bonding of the upper substrate and the lower substrate is performed by bonding a bottom surface of the upper substrate to an upper surface of the insulating layer of the lower substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2011
From: KIM, CHANGSUNG SEAN; KIM, SANG JIN; SONG, SUK HO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 025782/0965 →
Priority Claims (1)
KR 10-2010-0048816 · May 25, 2010 · national
Continuity (1)
Related Publication 20110293452A1 · Dec 1, 2011