Semiconductor device
A semiconductor device includes a semiconductor substrate including a semiconductor layer, a power device formed in the semiconductor substrate, a plurality of concentric guard rings formed in the semiconductor substrate and surrounding the power device, and voltage applying means for applying successively higher voltages respectively to the plurality of concentric guard rings, with the outermost concentric guard ring having the highest voltage applied thereto.
1. A semiconductor device comprising:
a semiconductor layer;
a gate electrode formed in a top surface of said semiconductor layer;
an emitter electrode formed on said top surface of said semiconductor layer;
a collector electrode formed on a bottom surface of said semiconductor layer;
a gate wire configured to supply a gate drive signal to said gate electrode;
a delay circuit configured to delay said gate drive signal; and
grounding means for receiving an output voltage of said delay circuit and a voltage on said semiconductor layer and, if said output voltage of said delay circuit and the voltage on said semiconductor layer are both at a high level, grounding said gate wire.
2. The semiconductor device as claimed in claim 1 , wherein said grounding means includes:
a NAND circuit for receiving said output voltage of said delay circuit and said voltage on said semiconductor layer;
a NOT circuit for inverting the output of said NAND circuit; and
a transistor for turning on to ground said gate wire when the output of said NOT circuit is at a high level.
3. The semiconductor device as claimed in claim 1 , wherein
the time by which said gate drive signal is delayed by said delay circuit is longer than the period from the time when power device begins to turn on until said voltage on said semiconductor layer falls below said high level, and is shorter than the period from the time when at least a predetermined voltage is applied to said semiconductor layer until said power device suffers degradation.
4. A semiconductor device comprising:
a semiconductor layer;
a gate electrode, a drain electrode, and a source electrode that are all formed on a surface of said semiconductor layer;
a gate wire configured to supply a gate drive signal to said gate electrode;
a delay circuit configured to delay said gate drive signal; and
grounding means for receiving an output voltage of said delay circuit and a voltage on the said drain electrode and, if said output voltage of said delay circuit and said voltage on said drain electrode are both at a high level, grounding said gate wire.
5. The semiconductor device as claimed in claim 4 , wherein said grounding means includes:
a NAND circuit for receiving said output voltage of said delay circuit and said drain voltage;
a NOT circuit for inverting the output of said NAND circuit; and
a transistor for turning on to ground said gate wire when the output of said NOT circuit is at a high level.
6. The semiconductor device as claimed in claim 5 , wherein:
said grounding means further includes a flip-flop circuit for holding said output of said NOT circuit;
said flip-flop circuit is formed on a different substrate than said semiconductor layer and includes an N-channel MOSFET and a P-channel MOSFET; and
an insulating film is disposed immediately under a drain region of said N-channel MOSFET and a drain region of said P-channel MOSFET.
7. The semiconductor device as claimed in claim 6 , wherein
said insulating film separates a well region of said N-channel MOSFET and a well region of said P-channel MOSFET from each other.
8. A semiconductor device comprising:
a semiconductor layer;
a gate electrode formed in a top surface of said semiconductor layer;
an emitter electrode formed on said top surface of said semiconductor layer;
a collector electrode formed on a bottom surface of said semiconductor layer;
a gate wire configured to supply a gate drive signal to said gate electrode;
a delay circuit configured to delay said gate drive signal; and
a ground circuit connected to an output voltage of said delay circuit and to a voltage on said semiconductor layer and configured to connect said gate wire to ground if said output voltage of said delay circuit and the voltage on said semiconductor layer are both at a high level.
9. The semiconductor device as claimed in claim 8 , wherein said ground circuit includes:
a NAND circuit configured to receive said output voltage of said delay circuit and said voltage on said semiconductor layer;
a NOT circuit configured to invert the output of said NAND circuit; and
a transistor configured to turn on to said ground said gate wire when the output of said NOT circuit is at a high level.
10. The semiconductor device as claimed in claim 8 , wherein
the time by which said gate drive signal is delayed by said delay circuit is longer than the period from the time when power device begins to turn on until said voltage on said semiconductor layer falls below said high level, and is shorter than the period from the time when at least a predetermined voltage is applied to said semiconductor layer until said power device suffers degradation.
11. A semiconductor device comprising:
a semiconductor layer;
a gate electrode, a drain electrode, and a source electrode that are all formed on a surface of said semiconductor layer;
a gate wire configured to supply a gate drive signal to said gate electrode;
a delay circuit configured to delay said gate drive signal; and
ground circuit connected to an output voltage of said delay circuit and to a voltage on said drain electrode and configured to connect said gate wire to ground if said output voltage of said delay circuit and the voltage on said drain electrode are both at a high level.
12. The semiconductor device as claimed in claim 11 , wherein said ground circuit includes:
a NAND circuit configured to receive said output voltage of said delay circuit and said drain voltage;
a NOT circuit configured to invert the output of said NAND circuit; and
a transistor configured to turn on to said ground said gate wire when the output of said NOT circuit is at a high level.
13. The semiconductor device as claimed in claim 12 , wherein:
said ground circuit further includes a flip-flop circuit configured to hold said output of said NOT circuit;
said flip-flop circuit is formed on a different substrate than said semiconductor layer and includes an N-channel MOSFET and a P-channel MOSFET; and
an insulating film is disposed immediately under a drain region of said N-channel MOSFET and a drain region of said P-channel MOSFET.
14. The semiconductor device as claimed in claim 13 , wherein
said insulating film separates a well region of said N-channel MOSFET and a well region of said P-channel MOSFET from each other.