IP Library Granted Patent US 8,871,537
Granted Patent B2
US 8,871,537 · App. 13/613,812 · Granted Oct 28, 2014

Method of manufacturing an organic electroluminescence display device

Inventors: Daisuke Yoshitoku (Mobara, JP); Nobuhiko Sato (Mobara, JP)
Assignee: Canon Kabushiki Kaisha
H01L27/3211H01L51/0018
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Quick Facts
Patent No.
US 8,871,537
App. No.
13/613,812
Granted
Oct 28, 2014
Kind
B2
Abstract

Provided is a method of manufacturing an organic electroluminescence display device which enables production of a high-resolution organic electroluminescence display device in which display failure is suppressed. The method of manufacturing an organic electroluminescence display device includes multiple organic electroluminescence elements each including an organic compound layer that includes at least an emission layer, the method including: forming the organic compound layer on a substrate; sequentially forming an intermediate layer and a resist layer on the organic compound layer; removing a part of the resist layer by a photolithography method; and selectively removing, by dry etching, the intermediate layer and the organic compound layer in a region in which the part of the resist layer is removed, the light shielding layer having a function of blocking light having a wavelength of 190 nm or more and 360 nm or less.

Claims (20)

1. A method of manufacturing an organic electroluminescence display device including multiple organic electroluminescence elements each including an organic compound layer that includes at least an emission layer, the method comprising:

forming the organic compound layer on a substrate;

sequentially forming an intermediate layer and a resist layer on the organic compound layer;

removing a part of the resist layer by a photolithography method; and

selectively removing, by dry etching, the intermediate layer and the organic compound layer in a region in which the part of the resist layer is removed,

wherein the intermediate layer includes a release layer and a light shielding layer, the release layer is provided between the light shielding layer and the organic compound layer, and the light shielding layer has a function of blocking light having a wavelength of 190 nm or more and 360 nm or less.

2. The method according to claim 1 , wherein the light shielding layer is set to have a transmittance of 5% or less with respect to the light having the wavelength of 190 nm to 360 nm.

3. The method according to claim 1 , wherein the light shielding layer has a stacked configuration of multiple layers.

4. The method according to claim 1 , wherein the light shielding layer includes a film made of silicon nitride and has a thickness of 2 μm or more.

5. The method according to claim 1 , wherein

the release layer is made of a material soluble in a solvent which hardly dissolves a constituent material for the organic compound layer.

6. The method according to claim 5 , wherein the constituent material for the organic compound layer includes any one of an arylamine derivative, a stilbene derivative, polyarylene, and a fused polycyclic hydrocarbon compound, and wherein the release layer is made of a material that is soluble in water.

7. The method according to claim 6 , wherein the release layer is made of a water-soluble polymer.

8. The method according to claim 5 , further comprising, after the selectively removing, by dry etching, the intermediate layer and the organic compound layer in the region in which the part of the resist layer is removed, dissolving the release layer and performing lift off of the light shielding layer for removal.

9. The method according to claim 1 , the organic electroluminescence display device including multiple first organic electroluminescence elements and multiple second organic electroluminescence elements in each of which one of a layer configuration and an emission color of the organic compound layer is different from the one of the layer configuration and the emission color of the organic compound layer of each of the multiple first organic electroluminescence elements,

wherein the method comprises performing each of the following steps multiple times:

the forming the organic compound layer;

the sequentially forming the intermediate layer and the resist layer on the organic compound layer;

the removing the part of the resist layer; and

the selectively removing, by dry etching, the intermediate layer and the organic compound layer in the region in which the part of the resist layer is removed.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2012
From: YOSHITOKU, DAISUKE; SATO, NOBUHIKO
To: CANON KABUSHIKI KAISHA
Reel/Frame 029467/0553 →
Priority Claims (2)
JP 2011-217678 · Sep 30, 2011 · national
JP 2012-191772 · Aug 31, 2012 · national
Continuity (1)
Related Publication 20130084664A1 · Apr 4, 2013