Method for isolating flexible film from support substrate

1. A method for fabricating a flexible electronic device, comprising:

providing a support substrate with a top surface;

subjecting a part of the top surface of the support substrate with a surface treatment, thereby forming a mold release region, wherein an adhesive region is the part of the top surface beyond the mold release region;

forming a flexible film on the top surface, wherein the flexible film covers the mold release region and the adhesive region;

forming an electronic element on the flexible film; and

cutting the flexible film within the mold release region to isolate a flexible electronic device from the support substrate,

wherein the surface treatment comprises providing a chemical agent to react with the top surface of the support substrate; and

wherein the chemical agent has the structure represented by

 wherein w is C, Si, or Ge; X is S, or Se; Y is C, or S; R 1 , R 2 , and R 3 are independent and comprise H, alkenyl group, alkyl group, or —OR; R is C 1-18 alkyl group; R 4 is F, Br, I, carboxyl group, amino group, amine group, cyano group, amide group, alkyl halide group, or combinations thereof; R 5 is Li; and R 6 , R 7 , and R 8 are independent and comprise F, Cl, Br, I, alkenyl group, alkyl group, carboxyl group, amino group, amine group, cyano group, amide group, alkyl halide group, or combinations thereof.

2. The method as claimed in claim 1 , wherein the support substrate comprises a metallic substrate, a plastic substrate, a ceramic substrate, a glass substrate, or a silicon wafer.

3. The method as claimed in claim 1 , after subjecting the top surface of the support substrate to the surface treatment, functional groups of the treated top surface of the support substrate, which are able to form bonds with the flexible film, are consumed, covered or displaced.

4. The method as claimed in claim 3 , wherein the functional groups which are able to be bonded with the flexible film comprise hydroxyl group, carboxyl group, amino group, or ester group.

5. The method as claimed in claim 3 , wherein the bonds formed between the top surface of the support substrate and the flexible film comprises ionic bond, covalent bond or hydrogen bond.

6. The method as claimed in claim 1 , wherein the chemical agent comprises chloromethyl trimethylsilane, 2-bromopropane, trimethyl fluorosilane, trimethyl bromosilane, trimethyl iodosilane, trimethylsilyl cyanide, thionyl chloride, lithium diisopropylamide, phosphorus trichloride, sulfuryl chloride, or combinations thereof.

7. The method as claimed in claim 1 , wherein the chemical agent is formed on the top surface of the support substrate by dip coating, spin coating, stamping, scraping, or roll-coating.

8. The method as claimed in claim 1 , wherein the flexible film comprises polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polynorbornene (PNB), polyetherimide (PEI), polyethylene naphthalate (PEN) or polyethylene terephthalate (PET).

9. The method as claimed in claim 1 , before forming the flexible film on the top surface of the support substrate, further comprising:

forming a functional film on the support substrate, wherein the functional film comprises a stress reduction film, an anti-scratch film, an anti-reflection film, a gas barrier film or lamination thereof.

10. The method as claimed in claim 1 , wherein the flexible film is formed on the top surface of the support substrate by wet coating or evaporation.

11. The method as claimed in claim 1 , wherein the flexible film is preformed and is disposed on the top surface of the support substrate by adhering.

12. The method as claimed in claim 1 , wherein the adherence between the flexible film within the mold release region and the support substrate is less than the adherence between the flexible film within the adhesive region and the support substrate.

13. The method as claimed in claim 1 , wherein the size of the flexible electronic device is equal to the size of the mold release region.

14. The method as claimed in claim 1 , wherein the size of the flexible electronic device is less than that of the mold release region.

15. The method as claimed in claim 1 , wherein the flexible electronic device comprises a transistor array, a memory element, a flat panel display, a solar cell, a semiconductor current, or combinations thereof.