IP Library Granted Patent US 8,884,524
Granted Patent B2
US 8,884,524 · App. 13/302,012 · Granted Nov 11, 2014

Apparatus and methods for improving reliability of RF grounding

Inventors: Jianhua Zhou (Campbell, CA); Dale R. Du Bois (Los Gatos, CA); Mohamad A. Ayoub (Los Gatos, CA); Juan Carlos Rocha-Alvarez (San Carlos, CA)
Assignee: Applied Materials, Inc.
H01J37/32091H01J37/32577
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Quick Facts
Patent No.
US 8,884,524
App. No.
13/302,012
Granted
Nov 11, 2014
Kind
B2
Abstract

Embodiments of the present invention provide an RF conducting rod comprising a hollow portion. Particularly, the RF conducting rod comprises an elongated hollow body having a sidewall enclosing an inner volume, a first solid connector extending from a first end of the elongated hollow body, and a second solid connector extending from a second end of the elongated hollow body. Each of the elongated hollow body, the first solid connector and the second solid connector is formed from an electrically conductive material.

Claims (38)

1. An apparatus for conducting RF power, comprising:

an elongated hollow body having a sidewall enclosing an inner volume, wherein the elongated hollow body has a venting port formed through the sidewall, and the venting port fluidly connects the inner volume to an exterior of the sidewall;

a first solid connector extending from a first end of the elongated hollow body; and

a second solid connector extending from a second end of the elongated hollow body, wherein each of the elongated hollow body, the first solid connector and the second solid connector is formed from an electrically conductive material.

2. The apparatus of claim 1 , wherein the elongated hollow body is a hollow cylinder.

3. The apparatus of claim 1 , wherein the elongated hollow body, the first solid connector and the second solid connector are formed from the same metal.

4. The apparatus of claim 3 , wherein the elongated hollow body is joined to the first and second solid connectors by electron beam welding or laser welding.

5. The apparatus of claim 4 , wherein the metal is nickel.

6. The apparatus of claim 1 , wherein the first solid connector has one or more mounting features.

7. A substrate support comprising:

a support body having a substrate supporting surface, wherein the support body is formed from a non-electrically-conductivity material;

a hollow shaft extending from the support body;

an RF electrode embedded in the support body; and

an RF connector disposed in the hollow shaft and coupled to the RF electrode, wherein the RF connector comprises:

an elongated hollow body having a sidewall enclosing an inner volume;

a first solid connector extending from a first end of the elongated hollow body; and

a second solid connector extending from a second end of the elongated hollow body, wherein each of the elongated hollow body, the first solid connector and the second solid connector is formed from an electrically conductive material, and the second solid connector is coupled to the RF electrode.

8. The substrate support of claim 7 , further comprising:

a heating element embedded in the support body.

9. The substrate support of claim 8 , wherein the sidewall of the elongated hollow body has a venting port formed therethrough, and the venting port fluidly connects the inner volume to an exterior of the sidewall.

10. The substrate support of claim 9 , wherein the venting port is closer to the first solid connector than to the second solid connector.

11. The substrate support of claim 9 , wherein the elongated hollow body, the first solid connector and the second solid connector are formed from the same metal.

12. The substrate support of claim 11 , wherein the elongated hollow body is joined to the first and second solid connectors by electron beam welding or laser welding.

13. The substrate support of claim 12 , wherein the metal is nickel.

14. The substrate support of claim 9 , wherein the RF electrode is a metal mesh, and the second solid connector is coupled to the RF electrode by brazing.

15. A method for generating a plasma, comprising:

applying an RF power source between a chamber component and a substrate support, wherein the substrate support comprises:

a support body having a substrate supporting surface, wherein the support body is formed from a non-electrically-conductivity material;

a hollow shaft extending from the support body;

an RF electrode embedded in the support body; and

an RF connector disposed in the hollow shaft and coupled to the RF electrode, wherein the RF connector comprises:

an elongated hollow body having a sidewall enclosing an inner volume;

a first solid connector extending from a first end of the elongated hollow body; and

a second solid connector extending from a second end of the elongated hollow body, wherein each of the elongated hollow body, the first solid connector and the second solid connector is formed from an electrically conductive material, the second solid connector is coupled to the RF electrode, and the first solid connector is coupled to an RF ground terminal or an RF hot terminal of the RF power source.

16. The method of claim 15 , further comprising heating a substrate disposed on the substrate support with a heating element embedded in the support body.

17. The method of claim 16 , wherein the sidewall of the elongated hollow body has a venting port formed therethrough, and heating the substrate comprises venting the inner volume of the elongated hollow body through the venting port.

18. The method of claim 17 , wherein the chamber component is a showerhead disposed over the substrate support.

19. The method of claim 18 , wherein applying the RF power comprises connecting a RF grounding terminal to the RF electrode embedded in the substrate support.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2011
From: ZHOU, JIANHUA; DU BOIS, DALE R.; AYOUB, MOHAMAD A.; ROCHA-ALVAREZ, JUAN CARLOS
To: APPLIED MATERIALS, INC.
Reel/Frame 027454/0094 →
Continuity (1)
Related Publication 20130126206A1 · May 23, 2013