IP Library Granted Patent US 8,889,255
Granted Patent B2
US 8,889,255 · App. 13/502,153 · Granted Nov 18, 2014

Radiation-cure removal type pressure-sensitive adhesive sheet

Inventors: Hitoshi Takahira (Osaka, JP); Satomi Yoshie (Osaka, JP)
Assignee: Nitto Denko Corporation
C08G18/4233C08K5/0025C08G18/428B32B27/00C09J167/00C09J175/06C09J7/0246B32B27/36C08G2170/40C09J2205/31C09J2467/00C09J2205/302C09J5/00
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Quick Facts
Patent No.
US 8,889,255
App. No.
13/502,153
Granted
Nov 18, 2014
Kind
B2
Abstract

A radiation-cure removable type pressure-sensitive adhesive sheet includes: a pressure-sensitive adhesive layer made from a polyester-based pressure-sensitive adhesive composition containing a polyester including at least a lactic acid unit, a dibasic acid unit, and a glycol unit, a radiation-cure resin, a radiation reaction initiator, and a crosslinking agent. The dibasic acid unit includes a dimer acid, the polyester has a glass transition temperature of −70 to −20° C., a weight average molecular weight of 20,000 to 200,000, and a hydroxyl value of 1 to 60 mgKOH/g, the composition contains 30 to 70 parts by weight of the radiation-cure resin based on 100 parts by weight of the polyester and contains 3 to 10% by weight of the radiation reaction initiator based on the amount of the radiation-cure resin.

Claims (16)

1. A radiation-cure removable pressure-sensitive adhesive sheet, comprising:

a pressure-sensitive adhesive layer made from a polyester-based pressure-sensitive adhesive composition comprising a polyester comprising at least a lactic acid unit, a dibasic acid unit, and a glycol unit, a radiation-cure resin, a radiation reaction initiator, and a crosslinking agent, wherein

the dibasic acid unit comprises a dimer acid,

the polyester has a weight average molecular weight of 20,000 to 200,000 and a glass transition temperature of −70 to −20° C. as measured using a differential scanning calorimeter at a temperature rise rate of 20° C./minute,

the polyester has a hydroxyl value of 1 to 60 mgKOH/g,

the adhesive composition contains 30 to 70 parts by weight of the radiation-cure resin based on 100 parts by weight of the polyester,

the adhesive composition contains 3 to 10% by weight of the radiation reaction initiator based on the amount of the radiation-cure resin, and wherein

the pressure-sensitive adhesive layer has a gel fraction of 20 to 80% by weight before exposure to radiation, and

a storage modulus before exposure to radiation of 1×10 4 to 1×10 7 Pa as measured using a dynamic viscoelasticity meter under conditions of 23° C. and a frequency of 1 Hz.

2. The radiation-cure removable pressure-sensitive adhesive sheet according to claim 1 , wherein the polyester contains 10 to 50% by mole of the lactic acid unit and 50 to 90% by mole of components other than the lactic acid unit, and the molar ratio of the dibasic acid unit to the glycol unit is 1:0.8 to 1:1.2.

3. The radiation-cure removable pressure-sensitive adhesive sheet according to claim 1 , wherein the dibasic acid unit further comprises an aliphatic dibasic acid other than the dimer acid.

4. The radiation-cure removable pressure-sensitive adhesive sheet according to claim 1 , wherein the polyester comprises a tri- or polyfunctional carboxylic acid and/or polyol component as a component other than the lactic acid unit, the dibasic acid unit, and the glycol unit, and the polyester has a dispersity (Mw/Mn) of 2.5 to 10.0.

5. The radiation-cure removable pressure-sensitive adhesive sheet according to claim 1 , wherein the polyester has an acid value of 5 mgKOH/g or less.

6. The radiation-cure removable pressure-sensitive adhesive sheet according to claim 1 , wherein the radiation-cure resin has a part with a molecular weight of 100 to 10,000 between functional groups.

7. The radiation-cure removable pressure-sensitive adhesive sheet according to claim 1 , wherein the crosslinking agent is a tri- or polyfunctional polyisocyanate.

8. The radiation-cure removable pressure-sensitive adhesive sheet according to claim 1 , which has an adhesive strength of 1.4 N/20 mm or more before exposure to radiation, and has an adhesive strength of 0.9 N/20 mm or less after exposure to radiation.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2012
From: TAKAHIRA, HITOSHI; YOSHIE, SATOMI
To: NITTO DENKO CORPORATION
Reel/Frame 028051/0027 →
Priority Claims (1)
JP 2009-241722 · Oct 20, 2009 · national
Continuity (1)
Related Publication 20120208016A1 · Aug 16, 2012