Multilayer ceramic electronic component and method of manufacturing the same
There is provided a multilayer ceramic electronic component, including: a ceramic sintered body having a plurality of dielectric layers laminated therein; first and second capacitance portions being formed on surfaces of the dielectric layers; first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other; sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively.
1. A multilayer ceramic electronic component, comprising:
a ceramic sintered body having a plurality of dielectric layers laminated therein;
first and second internal electrodes having first and second capacitance portions and first and second lead-out portions, respectively, the first and second capacitance portions being formed on surfaces of the dielectric layers to be spaced apart from both side surfaces of the ceramic sintered body, and the first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other in a length direction of the dielectric layers;
sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and
first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively.
2. The multilayer ceramic electronic component of claim 1 , wherein a ratio of an exposed length of the first and second lead-out portions to a width of the ceramic sintered body is 60 to 75%.
3. The multilayer ceramic electronic component of claim 1 , wherein the first and second capacitance portions each have at least one end contacting one end of the dielectric layer.
4. The multilayer ceramic electronic component of claim 3 , wherein the dielectric layer has a margin portion on which the first or second internal electrode is not formed in a corner portion thereof.
5. The multilayer ceramic electronic component of claim 1 , wherein the first and second internal electrodes are alternately formed in a vertical direction of the ceramic sintered body.
6. The multilayer ceramic electronic component of claim 1 , wherein a length of a portion of each of the first and second external electrodes, which covers one side surface of the ceramic sintered body, is greater than a length of each of the first and second lead-out portions.
7. The multilayer ceramic electronic component of claim 1 , further comprising cover layers formed on upper and lower surfaces of the ceramic sintered body, respectively.
8. A method of manufacturing a multilayer ceramic electronic component, the method comprising:
forming first internal electrode films on surfaces of first ceramic sheets, respectively, each first internal electrode film having a first capacitance portion spaced apart from both sides of the first ceramic sheet and a first lead-out portion connected to both sides of the first ceramic sheet from both sides of the first capacitance portion;
forming second internal electrode films on surfaces of second ceramic sheets, respectively, each second internal electrode film having a second capacitance portion spaced apart from both sides of the second ceramic sheet and a second lead-out portion connected to both sides of the second ceramic sheet from both sides of the second capacitance portion and the second lead-out portion being separated from the first lead-out portion;
alternately laminating the first and second ceramic sheets having the first and second inner electrode films formed thereon, to form a laminate;
firing the laminate;
forming sealing films to enclose both end portions and corner portions of the laminate; and
forming first and second external electrode films on both end portions of the laminate, the first and second external electrode films enclosing the sealing films and being electrically connected to the first and second lead-out portions exposed through both side surfaces of the ceramic sintered body.
9. The method of claim 8 , wherein a ratio of an exposed length of the first and second lead-out portions to a width of the ceramic sintered body is 60 to 75%.
10. The method of claim 8 , further comprising forming cover layers on upper and lower surfaces of the laminate after the forming of the laminate.
11. The method of claim 8 , wherein, in the forming of the first and second internal electrode films, at least one end of each of the first and second capacitance portions is extended to one end of each of the first and second ceramic sheets.
12. The method of claim 8 , wherein, in the forming of the first and second internal electrode films, the first and second ceramic sheets have a margin portion provided in a corner portion thereof.
13. The method of claim 8 , wherein, in the forming of the laminate, the first and second internal electrode films are alternately formed in a vertical direction of the ceramic sintered body.