IP Library › Granted Patent US 8,895,874
Granted Patent B1
US 8,895,874 · App. 12/721,557 · Granted Nov 25, 2014

Indium-less transparent metalized layers

Inventors: Sunity Kumar Sharma (Fremont, CA); Alex Newsom Beavers, Jr. (Menlo Park, CA); Thomas Furst (Menlo Park, CA)
Assignee: Averatek Corp.
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Quick Facts
Patent No.
US 8,895,874
App. No.
12/721,557
Granted
Nov 25, 2014
Kind
B1
Abstract

Thin indium-less “optically porous” layers adapted to replace traditional ITO layers are provided herein. A thin metalized film adapted to carry an electrical charge can include a dense pattern of small openings to allow the transmission of light to or from an underlying semiconductor material. The pattern of openings can create a regular or irregular grid pattern of low aspect ratio fine-line metal conductors. Creation of this optically porous metalized film can include the printing of a catalytic precursor material, such as palladium in solution in a pattern on a substrate, drying or curing the catalytic precursor, and the deposition of a thin layer of metal, such as copper on the dried precursor to form the final conductive and optically porous film.

Claims (10)

1. An optoelectronic device, comprising:

a substrate having a surface; and

an optically-porous electrically-conductive layer on the surface of the substrate, wherein the optically-porous electrically-conductive layer has a pattern that defines a plurality of fine openings therethrough such that the optically-porous electrically-conductive layer has an optical transmissivity of at least 85%, the optically-porous electrically-conductive layer comprising elemental palladium monoatomically bound to the surface of the substrate and an electrically conductive layer disposed on the monoatomically-bound elemental palladium.

2. The optoelectronic device of claim 1 , wherein the fine openings have irregular shapes.

3. The optoelectronic device of claim 1 , wherein the fine openings are rectangular in shape and have a width of less than 250 microns and a length of less than 250 microns.

4. The optoelectronic device of claim 1 , wherein the electrically conductive layer has a thickness of less than about 250 microns.

5. The optoelectronic device of claim 1 , wherein the substrate with the optically-porous electrically-conductive layer adhered thereto is flexible.

6. The optoelectronic device of claim 1 , wherein the substrate is rigid.

7. The optoelectronic device of claim 1 , wherein the electrically conductive layer comprises copper.

8. The optoelectronic device of claim 1 , further comprising an additional layer of material electroplated on the electrically conductive layer.

Assignments (3)
SECURITY INTEREST Recorded Jan 6, 2026
From: AVERATEK CORPORATION NKA LQDX, INC.
To: ARES FINANCIAL, LLC
Reel/Frame 073381/0760 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 024423 FRAME: 0790. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jun 13, 2018
From: SHARMA, SUNITY KUMAR; BEAVERS, ALEX NEWSOM, JR.; FURST, THOMAS
To: AVERATEK CORPORATION
Reel/Frame 046354/0986 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2010
From: SHARMA, SUNITY KUMAR; BEAVERS, ALEX NEWSOM, JR.; FURST, THOMAS
To: AVERATEK, INC.
Reel/Frame 024423/0790 →
Continuity (1)
Provisional Application 61159037 · Mar 10, 2009