Nanostructured metal-diamond composite thermal interface material (TIM) with improved thermal conductivity
Various aspects of the disclosure provide thermal interface materials having high thermal conductivities. In one aspect, a thermal interface material comprises metal-diamond composite nanoparticles, where each composite nanoparticle comprises a diamond core surrounded by a metal shell with a low fusion temperature. In one aspect, a thermal interface is formed between two surfaces (e.g., surfaces of a heat source and heat sink) by applying the thermal interface material between the two surfaces and heating the thermal interface material to the fusion temperature of the metal shells. The heating causes the metal shells to fuse together and to the two surfaces. The fusion results in a thermal interface between the two surfaces comprising a metal layer formed by the fused metal shells and the diamond cores embedded within the metal layer. The high thermal conductivity of the embedded diamond cores greatly enhance the thermal conductivity of the thermal interface.
1. A thermal interface material, comprising:
a plurality of metal-diamond composite nanoparticles, each composite nanoparticle comprising a diamond core surrounded by a continuous metal shell in contact with the diamond core, the metal shell comprising a plurality of metal nanoparticles, the metal nanoparticles having a fusion temperature of less than about 220° C.
2. The thermal interface material of claim 1 , further comprising an organic surfactant coating the composite nanoparticles.
3. The thermal interface material of claim 1 , wherein each composite nanoparticle comprises about 30% to 50% by volume of the respective metal shell and about 50% to 70% by volume of the respective diamond core.
4. The thermal interface material of claim 1 , wherein the metal nanoparticles have a diameter of 20 nanometers or less.
5. The thermal interface material of claim 1 , further comprising a solvent mixed in with the plurality of composite nanoparticles.
6. The thermal interface material of claim 5 , wherein the solvent is selected from the group consisting of dodecanoic acid and triethanolamine.
7. The thermal interface material of claim 1 , wherein the metal shell has a thickness of about 2 nm or less.