IP Library Granted Patent US 8,907,024
Granted Patent B2
US 8,907,024 · App. 13/989,116 · Granted Dec 9, 2014

Curable composition

Inventors: Kiyoshi Miyafuji (Takasago, JP); Ayako Yano (Takasago, JP)
Assignee: Kaneka Corporation
C08L71/02C09D201/10C09J183/16C08L101/10
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Quick Facts
Patent No.
US 8,907,024
App. No.
13/989,116
Granted
Dec 9, 2014
Kind
B2
Abstract

An object of the present invention is to provide a curable composition that provides high hardness and can be used in adhesives and coating agents. This object can be achieved by a curable composition containing: 100 parts by weight of a reactive silyl group-containing organic polymer (A) that has a number average molecular weight of 2,000 to 6,000 and contains 1.3 to 5 reactive silyl groups per molecule; and 0 to 40 parts by weight of a plasticizer (C). This curable composition is suitable for flooring adhesives and tile adhesives, which require high hardness.

Claims (31)

1. A curable composition, comprising:

100 parts by weight of a reactive silyl group-containing organic polymer (A) that has a number average molecular weight of 2,000 to 6,000 and contains 2.1 to 3 reactive silyl groups per molecule; and

0 to 40 parts by weight of a plasticizer (C).

2. The curable composition according to claim 1 ,

wherein the backbone skeleton of the reactive silyl group-containing organic polymer (A) is a polyoxyalkylene polymer.

3. The curable composition according to claim 1 ,

wherein the backbone structure of the reactive silyl group-containing organic polymer (A) has at least one branch.

4. The curable composition according to claim 1 , which does not comprise the plasticizer (C).

5. An adhesive, comprising the curable composition according to claim 1 .

6. A flooring adhesive, comprising the curable composition according to claim 1 .

7. A tile adhesive, comprising the curable composition according to claim 1 .

8. A coating agent, obtained by curing the curable composition according to claim 1 .

9. A cured product, obtained by curing the curable composition according to claim 1 .

10. A curable composition, comprising:

100 parts by weight of a reactive silyl group-containing organic polymer (A) that has a number average molecular weight of 2,000 to 6,000 and contains 1.3 to 5 reactive silyl groups per molecule;

a reactive silyl group-containing organic polymer (B) that has a number average molecular weight of 8,000 to 50,000 and contains 1.3 to 5 reactive silyl groups per molecule; and

0 to 40 parts by weight of a plasticizer (C).

11. The curable composition according to claim 10 ,

wherein the backbone skeleton of the reactive silyl group-containing organic polymer (B) is a polyoxyalkylene polymer.

12. The curable composition according to claim 10 ,

wherein the backbone structure of the reactive silyl group-containing organic polymer (A) has at least one branch.

13. The curable composition according to claim 10 ,

wherein the reactive silyl group-containing organic polymer (A) contains 2 to 5 reactive silyl groups per molecule.

14. The curable composition according to claim 10 , which does not comprise the plasticizer (C).

15. An adhesive, comprising the curable composition according to claim 10 .

16. A flooring adhesive, comprising the curable composition according to claim 10 .

17. A tile adhesive, comprising the curable composition according to claim 10 .

18. A coating agent, obtained by curing the curable composition according to claim 10 .

19. A cured product, obtained by curing the curable composition according to claim 10 .

20. The curable composition according to claim 10 ,

wherein the backbone skeleton of the reactive silyl group-containing organic polymer (A) is a polyoxyalkylene polymer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2013
From: MIYAFUJI, KIYOSHI; YANO, AYAKO
To: KANEKA CORPORATION
Reel/Frame 030728/0049 →
Priority Claims (1)
JP 2010-261730 · Nov 24, 2010 · national
Continuity (1)
Related Publication 20130274410A1 · Oct 17, 2013