IP Library Granted Patent US 8,910,369
Granted Patent B2
US 8,910,369 · App. 14/275,009 · Granted Dec 16, 2014

Fabricating a power supply converter with load inductor structured as heat sink

Inventors: Juan A Herbsommer (Allen, TX); Osvaldo J Lopez (Annandale, NJ); Jonathan A Noquil (Bethlehem, PA); David Jauregui (Bethlehem, PA); Lucian Hriscu (Freemansburg, PA)
Assignee: Texas Instruments Incorporated
H02M3/00H01R43/26H02B1/48
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,910,369
App. No.
14/275,009
Granted
Dec 16, 2014
Kind
B2
Abstract

A method for fabricating a power supply converter comprises a load inductor wrapped by a metal sleeve structured to transform the inductor into a heat sink positioned to deposit layers of solder paste on a sleeve surface and on the inductor leads. A metal carrier having a portion of a first thickness and portions of a greater second thickness is placed on the solder layers of the inductor. The carrier portion of first thickness is aligned with the inductor sleeve. The carrier portions of second thickness are aligned with the inductor leads. A sync and a control FET are placed side-by-side on solder layers deposited on the carrier portion of first thickness opposite the inductor sleeve. Reflowing is preformed and the solder layers are solidified. The FETs, the carrier and the inductor become integrated and the un-soldered surfaces of the FETs and the carrier portions of second thickness become coplanar.

Claims (11)

1. A method for fabricating a power supply converter, comprising:

providing a load inductor wrapped by a metal sleeve structured to transform the inductor into a heat sink;

positioning the inductor to deposit layers of solder paste on a sleeve surface and on the inductor leads;

providing a metal carrier having a portion of a first thickness and portions of a greater second thickness;

placing the carrier on the solder layers of the inductor wherein the carrier portion of first thickness is aligned with the inductor sleeve and the carrier portions of second thickness are aligned with the inductor leads;

placing a sync and a control FET side-by-side on solder layers deposited on the carrier portion of first thickness opposite the inductor sleeve; and

reflowing and then solidifying the solder layers, whereby the FETs, the carrier and the inductor become integrated and the un-soldered surfaces of the FETs and the carrier portions of second thickness become coplanar.

2. The method of claim 1 , further comprising before the steps in claim 1 :

providing a re-usable tray having a plurality of grooves sized for the dimensions of a plurality of inductors-to-be-assembled;

aligning each inductor from the plurality of inductors-to-be-assembled with a respective groove of the tray; and

inserting each inductor into the respective groove of the tray.

Continuity (2)
Division 13247650 · Sep 28, 2011
Related Publication 20140245598A1 · Sep 4, 2014