Embedded capacitor substrate module
An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board.
1. An embedded capacitor substrate module, comprising:
a substrate, having a first part and a second part;
a metal substrate, having a first part and a second part, wherein the first part of the metal substrate corresponds to the first part of the substrate, and the second part of the metal substrate corresponds to the second part of the substrate;
a solid electrolytic capacitor material, disposed on the metal substrate and disposed between the first part of the substrate and the first part of the metal substrate, and the solid electrolytic capacitor material comprises an aluminum oxide layer and a conductive polymer layer;
an electrode lead-out region, disposed by the second part of the metal substrate, a first insulating material, and the second part of the substrate, wherein the metal substrate serves as a first electrode, and the substrate serves as a second electrode;
a first via, disposed in the electrode lead-out region, to electrically connect the metal substrate and to be electrically isolated from the substrate; and
a second via, disposed in the electrode lead-out region, to electrically connect the substrate and to be electrically isolated from the metal substrate;
wherein the first insulating material is disposed between the second part of the substrate and the second part of the metal substrate.
2. The embedded capacitor substrate module according to claim 1 , wherein a second insulating material is disposed around the first via penetrating the substrate, and a third insulating material is disposed around the second via penetrating the metal substrate.
3. The embedded capacitor substrate module according to claim 1 , wherein one side of the solid electrolytic capacitor material not in contact with the metal substrate is bonded with the substrate through a conductive adhesive layer.
4. The embedded capacitor substrate module according to claim 3 , wherein the conductive adhesive layer is carbon paste.
5. The embedded capacitor substrate module according to claim 1 , wherein the metal substrate is an aluminum substrate.
6. The embedded capacitor substrate module according to claim 1 , wherein the metal substrate is disposed to have a scraggy surface.
7. The embedded capacitor substrate module according to claim 1 , wherein a material of the substrate is copper or silver.
8. The embedded capacitor substrate module according to claim 1 , wherein the first insulating material is resin or a dielectric material.
9. An embedded capacitor substrate module, comprising:
an upper substrate, having a first part and a second part;
a lower substrate, having a first part and a second part, wherein the first part of the lower substrate corresponds to the first part of the upper substrate, and the second part of the lower substrate corresponds to the second part of the upper substrate;
a metal substrate, having a first part and a second part, wherein the first part of the metal substrate corresponds to the first part of the lower substrate, and the second part of the metal substrate corresponds to the second part of the lower substrate;
more than one layer of solid electrolytic capacitor material, disposed between the first part of the upper substrate and the first part of the metal substrate and between the first part of the lower substrate and the first part of the metal substrate, or optionally disposed between the first part of the upper substrate and the first part of the metal substrate or between the first part of the lower substrate and the first part of the metal substrate, wherein the solid electrolytic capacitor material comprises an aluminum oxide layer and a conductive polymer layer;
an electrode lead-out region, disposed by a plurality of first insulating materials, the second part of the upper substrate, the second part of the lower substrate, and the second part of the metal substrate, wherein the metal substrate serves as a first electrode, and at least one of the upper substrate and the lower substrate serves as a second electrode;
a first via, disposed in the electrode lead-out region, to electrically connect the metal substrate and to be electrically isolated from at least one of the upper substrate and the lower substrate; and
a second via, disposed in the electrode lead-out region, to electrically connect at least one of the upper substrate and the lower substrate and to be electrically isolated from the metal substrate;
wherein the plurality of first insulating materials is disposed between the second part of the upper substrate and the second part of the metal substrate and disposed between the second part of the lower substrate and the second part of the metal substrate.
10. The embedded capacitor substrate module according to claim 9 , wherein a second insulating material is disposed around the first via penetrating the upper substrate and the lower substrate, and a third insulating material is disposed around the second via penetrating the metal substrate.
11. The embedded capacitor substrate module according to claim 9 , wherein when the more than one layer of solid electrolytic capacitor material is disposed between the upper substrate and the metal substrate and between the lower substrate and the metal substrate, one of the more than one layer of solid electrolytic capacitor material is bonded with the upper substrate through a first conductive adhesive layer, and the other one of the more than one layer of solid electrolytic capacitor material is bonded with the lower substrate through a second conductive adhesive layer.
12. The embedded capacitor substrate module according to claim 11 , wherein the first conductive adhesive layer is carbon paste, and the second conductive adhesive layer is carbon paste.
13. The embedded capacitor substrate module according to claim 9 , wherein the metal substrate is an aluminum substrate.
14. The embedded capacitor substrate module according to claim 9 , wherein the metal substrate is disposed to have a scraggy surface.
15. The embedded capacitor substrate module according to claim 9 , wherein a material of the upper substrate and the lower substrate is copper or silver.
16. The embedded capacitor substrate module according to claim 9 , wherein the plurality of first insulating materials is resin or a dielectric material.
17. The embedded capacitor substrate module according to claim 10 , further comprising a capacitor, wherein the solid electrolytic capacitor material is disposed on a first surface of the upper substrate and a second surface of the lower substrate, and the capacitor is disposed above a surface opposite to the first surface of the upper substrate and/or below a surface opposite to the second surface of the lower substrate.
18. The embedded capacitor substrate module according to claim 17 , further comprising a bonding layer disposed between the capacitor and the upper substrate and/or between the capacitor and the lower substrate.
19. The embedded capacitor substrate module according to claim 17 , wherein the capacitor comprises a first metal layer, a second metal layer and a fourth insulating material disposed between the first metal layer and the second metal layer.
20. The embedded capacitor substrate module according to claim 9 , wherein the solid electrolytic capacitor material is disposed at a center of the embedded capacitor substrate module.
21. The embedded capacitor substrate module according to claim 9 , wherein a number of layers of the solid electrolytic capacitor material is multiple.
22. The embedded capacitor substrate module according to claim 9 , further comprising insulating materials respectively disposed on an upper surface and a lower surface of the embedded capacitor substrate module, being embedded in an integrated circuit carrier having signal layers, a power layer and a grounding layer respectively disposed in the insulating materials.
23. The embedded capacitor substrate module according to claim 22 , wherein the embedded capacitor substrate module electrically connects to the integrated circuit carrier by solder balls and pads.