Coating method for an optoelectronic chip-on-board module
A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone.
1. A method for coating an optoelectronic chip-on-board module, the module comprising a flat substrate populated with at least one optoelectronic component, with a transparent, UV-resistant, and temperature-resistant coating made of silicone, the method comprising the following steps:
a) casting a liquid silicone in a mold having an open top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate;
b) inserting the substrate into the mold such that the at least one optoelectronic component is immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone with at least partially full surface contact;
c) curing and cross-linking the silicone with the at least one optoelectronic component and the substrate; and
d) removing the substrate from the mold with the coating of cured silicone.
2. The method according to claim 1 , wherein at east one of the steps is performed under an elevated atmospheric pressure.
3. The method according to claim 2 , wherein the elevated atmospheric pressure is between 4 and 10 bar.
4. The method according to claim 1 , wherein optically functional materials are mixed into the liquid silicone.
5. The method according to claim 4 , wherein the optically functional materials are selected from phosphorescing and dispersing materials or particles.
6. The method according to claim 1 , wherein a surface structure is generated on a surface of the coating.
7. The method according to claim 6 , wherein the surface structure is generated by the mold.
8. The method according to claim 1 , wherein the substrate is populated with optoelectronic components up to at least one edge.
9. The method according to claim 8 , wherein the substrate is coated without a margin and/or over the at least one edge.
10. The method according to claim 1 , wherein the silicone is molded such that at least one optical component is formed in the silicone.
11. The method according to claim 10 , wherein the at least one optical component formed in the silicone is at least one lens.
12. The method according to claim 1 , wherein the method is performed such that the chip-on-board module has at least one primary optical arrangement adjacent to the at least one optoelectronic component and optionally has at least one secondary optical arrangement, and wherein at least one of the optical arrangements is formed in the silicone.
13. An optoelectronic chip-on-board module produced according to the method of claim 1 .