Method of cutting a wafer-like object and semiconductor chip
A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
1. A method of cutting a wafer-like object to be processed along each of a plurality of intersecting cutting lines along which the object is intended to be cut, the object being made of monocrystal material and comprising a first surface and a second surface, the method comprising:
irradiating the object with laser light so as to form multiple light-converging points at respective locations within the object that are each spaced from the first surface and the second surface, the irradiation to form the light-converging points resulting in the formation of a modified spot at the location of each light-converging point, such that after formation of the modified spots, the object comprises a modified region including the modified spots that are formed along each of the plurality of intersecting cutting lines and a non-modified region which is not molten, with the non-modified region existing at least one of above and below the modified region such that the modified region does not extend continuously through the object from the first surface to the second surface, each modified spot not being formed in the laser light entrance surface of the object; and
cutting the object into parts along the plurality of intersecting cutting lines by growing cracks from the modified spots to grow towards a front and back surface of the object,
wherein the step of cutting the object into the parts along the plurality of intersecting cutting lines includes deforming a sheet supporting the object and applying stress to the object to cut and separate the object on the sheet into the parts.
2. The method according to claim 1 , further comprising applying a predetermined force to the object to cause the crack extending toward at least one of the first surface and the second surface from the starting point of the cutting of the object to cut the object along a respective cutting line.
3. The method according to claim 1 , wherein the first surface of the object is a surface of the object to which the laser light is irradiated.
4. The method according to claim 1 , wherein the first surface of the object is a laser light entrance surface of the object to which the laser light is irradiated and the second surface of the object is opposed to the laser light entrance through the object.
5. The method according to claim 1 , wherein a plurality of modified spots are formed along the plurality of intersecting cutting lines, with one of the modified spots being formed in a peripheral edge of the object so as to be exposed outside of the object at the peripheral edge of the object.
6. The method according to claim 1 , wherein a plurality of modified spots are formed along the plurality of intersecting cutting lines, with none of the modified spots being exposed outside of the object at a peripheral edge of the object.
7. The method according to claim 1 , wherein each modified spot is formed at least within the object by irradiation of the laser light without modification of the first surface of the object or the second surface of the object by the irradiation of the laser light.
8. The method according to claim 1 , wherein a plurality of modified spots are formed along the plurality of intersecting cutting lines, the irradiation of the laser light is performed by irradiation of a pulsed laser light along the plurality of intersecting cutting lines, and a distance between adjacent modified spots in a direction along a respective cutting line is not longer than a length of each of the modified spots in a direction along the respective cutting line.
9. The method according to claim 8 , wherein the length of each modified spot in the direction along a respective cutting line is longer than the distance between adjacent modified spots in the direction along the respective cutting line.
10. The method according to claim 8 , wherein adjacent modified spots overlap each other.
11. The method according to claim 1 , wherein a length of each of the modified spots in a thickness direction of the object is longer than its length in a direction perpendicular to the thickness direction.
12. The method according to claim 1 , wherein a length of each modified spot in a direction along a respective cutting line is larger than a length of the modified spot in a direction parallel to a surface of the object and perpendicular to a direction extending along the respective cutting line.
13. The method according to claim 1 , wherein the second surface is located on a side of the object opposite that where the first surface is located, and each modified spot is formed so that no portion of the modified spot is formed in the second surface of the object.
14. The method according to claim 1 , wherein the irradiation of laser light is performed by irradiation of a pulsed laser light along the plurality of intersecting cutting lines, and a distance between adjacent modified spots in a direction along a respective cutting line is longer than a length of each modified spot in a direction along the respective cutting line.
15. The method according to claim 1 , wherein the plurality of intersecting cutting lines include first lines and second lines,
wherein the first lines are arranged in parallel to each other and the second lines are arranged in parallel to each other so that the first and second lines form a grid-like pattern.
16. A method of cutting a wafer-like object to be processed along each of a plurality of intersecting cutting lines along which the object is intended to be cut, the object comprising a first surface and a second surface, the method comprising:
irradiating the object with laser light so as to form multiple light-converging points at respective locations within the object that are each spaced from the first surface and the second surface, the irradiation to form the light-converging points resulting in the formation of a modified spot at the location of each light-converging point, such that after formation of the modified spots, the object comprises a modified region including the modified spots that are formed along each of the plurality of intersecting cutting lines and a non-modified region which is not molten, with the non-modified region existing at least one of above and below the modified region such that the modified region does not extend continuously through the object from the first surface to the second surface, each modified spot not being formed in the laser light entrance surface of the object; and
cutting the object into parts along the plurality of intersecting cutting lines by growing cracks from the modified spots to grow towards a front and back surface of the object,
wherein the step of cutting the object into the parts along the plurality of intersecting cutting lines includes deforming a sheet supporting the object and applying stress to the object to cut and separate the object on the sheet into the parts.
17. The method according to claim 16 , wherein each modified spot is formed within the object at a position which is separated by a predetermined distance from the first surface comprising the laser light entrance surface of the object.
18. The method according to claim 16 , wherein the first surface of the object is a surface of the object to which the laser light is irradiated.
19. The method according to claim 16 , wherein the first surface of the object is a laser light entrance surface of the object to which the laser light is irradiated and the second surface of the object is opposed to the laser light entrance through the object.
20. The method according to claim 16 , wherein a plurality of modified spots are formed along the plurality of intersecting cutting lines, with one of the modified spots being formed in a peripheral edge of the object so as to be exposed outside of the object at the peripheral edge of the object.
21. The method according to claim 16 , wherein a plurality of modified spots are formed along the plurality of intersecting cutting lines, with none of the modified spots being exposed outside of the object at a peripheral edge of the object.
22. The method according to claim 16 , wherein each modified spot is formed at least within the object by irradiation of the laser light without modification of the first surface of the object or the second surface of the object by the irradiation of the laser light.
23. The method according to claim 16 , wherein a plurality of modified spots are formed along the plurality of intersecting cutting lines, the irradiation of the laser light is performed by irradiation of a pulsed laser light along the plurality of intersecting cutting lines, and a distance between adjacent modified spots in a direction along a respective cutting line is not longer than a length of each of the modified spots in a direction along the respective cutting line.
24. The method according to claim 23 , wherein the length of each modified spot in the direction along a respective cutting line is longer than the distance between adjacent modified spots in the direction along the respective cutting line.
25. The method according to claim 23 , wherein adjacent modified spots overlap each other.
26. The method according to claim 16 , wherein a length of each of the modified spots in a thickness direction of the object is longer than its length in a direction perpendicular to the thickness direction.
27. The method according to claim 16 , wherein a length of each modified spot in a direction along a respective cutting line is larger than a length of the modified spot in a direction parallel to a surface of the object and perpendicular to a direction extending along the respective cutting line.
28. The method according to claim 16 , wherein the second surface is located on a side of the object opposite that where the first surface is located, and each modified spot is formed so that no portion of the modified spot is formed in the second surface of the object.
29. The method according to claim 16 , wherein the irradiation of laser light is performed by irradiation of a pulsed laser light along the plurality of intersecting cutting lines, and a distance between adjacent modified spots in a direction along a respective cutting line is longer than a length of each modified spot in a direction along the respective cutting line.
30. The method according to claim 16 , wherein the plurality of intersecting cutting lines include first lines and second lines,
wherein the first lines are arranged in parallel to each other and the second lines are arranged in parallel to each other so that the first and second lines form a grid-like pattern.
31. A method of cutting a wafer-like object to be processed along each of a plurality of intersecting cutting lines, the object being made of monocrystal material and comprising a first surface and a second surface, the method comprising:
irradiating the object with laser light so as to form multiple light-converging points at respective locations within the object that are each spaced from the first surface and the second surface, the irradiation to form the light-converging points resulting in the formation of a modified spot at the location of each light-converging point, such that after formation of the modified spots, the object comprises a modified region including the modified spots that are formed along each of the plurality of intersecting cutting lines and a non-modified region which is not molten, with the non-modified region existing at least one of above and below the modified region such that the modified region does not extend continuously through the object from the first surface to the second surface, each modified spot not being formed in the laser light entrance surface of the object, and the modified region functioning as a starting crack location for cutting the object along the plurality of intersecting cutting lines; and
cutting the object by applying a predetermined force to the object to cause cracks inside the object to be cut along the plurality of intersecting cutting lines, the cracks grown from the modified region and growing towards at least one of the first and second surface of the object, the cracks not being started from the first and the second surface of the object.
32. The method according to claim 31 , wherein the first surface of the object is a surface of the object to which the laser light is irradiated.
33. The method according to claim 31 , wherein the first surface of the object is a laser light entrance surface of the object to which the laser light is irradiated and the second surface of the object is opposed to the laser light entrance through the object.
34. The method according to claim 31 , wherein a plurality of modified spots are formed along the plurality of intersecting cutting lines, with one of the modified spots being formed in a peripheral edge of the object so as to be exposed outside of the object at the peripheral edge of the object.
35. The method according to claim 31 , wherein a plurality of modified spots are formed along the plurality of intersecting cutting lines, with none of the modified spots being exposed outside of the object at a peripheral edge of the object.
36. The method according to claim 31 , wherein each modified spot is formed at least within the object by irradiation of the laser light without modification of the first surface of the object or the second surface of the object by the irradiation of the laser light.
37. The method according to claim 31 , wherein a plurality of modified spots are formed along the plurality of intersecting cutting lines, the irradiation of the laser light is performed by irradiation of a pulsed laser light along the plurality of intersecting cutting lines, and a distance between adjacent modified spots in a direction along a respective cutting line is not longer than a length of each of the modified spots in a direction along the respective cutting line.
38. The method according to claim 37 , wherein the length of each modified spot in the direction along a respective cutting line is longer than the distance between adjacent modified spots in the direction along the respective cutting line.
39. The method according to claim 37 , wherein adjacent modified spots overlap each other.
40. The method according to claim 31 , wherein a length of each of the modified spots in a thickness direction of the object is longer than its length in a direction perpendicular to the thickness direction.
41. The method according to claim 31 , wherein a length of each modified spot in a direction along a respective cutting line is larger than a length of the modified spot in a direction parallel to a surface of the object and perpendicular to a direction extending along the respective cutting line.
42. The method according to claim 31 , wherein the second surface is located on a side of the object opposite that where the first surface is located, and each modified spot is formed so that no portion of the modified spot is formed in the second surface of the object.
43. The method according to claim 31 , wherein the irradiation of laser light is performed by irradiation of a pulsed laser light along the plurality of intersecting cutting lines, and a distance between adjacent modified spots in a direction along a respective cutting line is longer than a length of each modified spot in a direction along the respective cutting line.
44. The method according to one of claim 1 , claim 16 , or claim 31 , wherein the irradiation of laser light to form the light-converging points resulting in the formation of the modified spots comprises a first irradiation of laser light to form a first single one of the light-converging points, relative movement between the object and a source of the irradiation of laser light, and a second irradiation of laser light to form a second single one of the light-converging points.
45. The method according to one of claim 1 , claim 16 , or claim 31 , wherein the irradiation of laser light to form the light-converging points resulting in the formation of the modified spots is performed to simultaneously form all of the multiple light-converging points.
46. The method according to claim 45 , wherein each of the multiple light-converging points is formed using multiple laser light sources.
47. The method according to claim 31 , wherein the plurality of intersecting cutting lines include first lines and second lines,
wherein the first lines are arranged in parallel to each other and the second lines are arranged in parallel to each other so that the first and second lines form a grid-like pattern.