Organic light emitting device and filler for sealing the same
An organic light emitting device display includes a substrate, an organic light emitting diode array on the substrate, an encapsulation substrate on the organic light emitting diode array, and an internal filler between the organic light emitting diode array and the encapsulation substrate, the internal filler including a cross-linked silicone polymer.
1. An organic light emitting device display, comprising:
a substrate;
an organic light emitting diode array on the substrate;
an encapsulation substrate on the organic light emitting diode array; and
an internal filler between the organic light emitting diode array and the encapsulation substrate, the internal filler including a cross-linked silicone polymer that includes an addition cure reaction product of an alkenyl-modified silicone polymer and a hydrogen-modified silicone polymer;
wherein:
the alkenyl-modified silicone polymer is represented by Formula 1:
wherein in Formula 1, R 1 to R 16 are each independently selected from the group of hydrogen, a C1 to C6 alkyl, a C1 to C6 alkoxy, a C6 to C18 aryl, a C5 to C17 heteroaryl, and a C2 to C6 alkenyl, provided that at least one of R 1 to R 16 is a C2 to C6 alkenyl, and n ranges from 1 to 20,
the hydrogen-modified silicone polymer is represented by Formula 2:
wherein in Formula 2, R 17 to R 30 are each independently selected from the group of hydrogen, a C1 to C6 alkyl, a C1 to C6 alkoxy, a C6 to C18 aryl, and a C5 to C17 heteroaryl, and m ranges from 0 to 20,
the addition cure reaction product is produced from the alkenyl-modified silicone polymer and the hydrogen-modified silicone polymer at a mixing weight ratio of 1:2 to about 1:9, and
wherein the molecular weight of the alkenyl-modified silicone polymer is about 500, and the molecular weight of the hydrogen-modified silicone polymer is about 450.
2. The organic light emitting device display as claimed in claim 1 , further comprising a sealing member between the substrate and the encapsulation substrate, the sealing member including frit.
3. The organic light emitting device display as claimed in claim 2 , wherein the frit includes at least one of K 2 O, Fe 2 O 3 , Sb 2 O 3 , ZnO, P 2 O 5 , V 2 O 5 , TiO 2 , Al 2 O 3 , WO 3 , SnO, PbO, MgO, CaO, BaO, Li 2 O, Na 2 O, B 2 O 3 , TeO 2 , SiO 2 , Ru 2 O, Rb 2 O, Rh 2 O, CuO, and Bi 2 O 3 .
4. The organic light emitting device display as claimed in claim 2 , wherein the internal filler and the sealing member are spaced apart from each other.
5. The organic light emitting device display as claimed in claim 4 , wherein the internal filler and the sealing member are spaced apart from each by about 100 μm to about 300 μm.
6. A method of manufacturing an organic light emitting device display, comprising:
providing an organic light emitting diode array on a substrate;
forming an encapsulation substrate on the organic light emitting diode array; and
forming an internal filler between the organic light emitting diode array and the encapsulation substrate, the internal filler including a cross-linked silicone polymer that includes an addition cure reaction product of an alkenyl-modified silicone polymer and a hydrogen-modified silicone polymer;
wherein:
the alkenyl-modified silicone polymer is represented by Formula 1:
wherein in Formula 1, R 1 to R 16 are each independently selected from the group of hydrogen, a C1 to C6 alkyl, a C1 to C6 alkoxy, a C6 to C18 aryl, a C5 to C17 heteroaryl, and a C2 to C6 alkenyl, provided that at least one of R 1 to R 16 is a C2 to C6 alkenyl, and n ranges from 1 to 20,
the hydrogen-modified silicone polymer is represented by Formula 2:
wherein in Formula 2, R 17 to R 30 are each independently selected from the group of hydrogen, a C1 to C6 alkyl, a C1 to C6 alkoxy, a C6 to C18 aryl, and a C5 to C17 heteroaryl, and m ranges from 0 to 20,
the addition cure reaction product is produced from the alkenyl-modified silicone polymer and the hydrogen-modified silicone polymer at a mixing weight ratio of 1:2 to about 1:9, and
wherein the molecular weight of the alkenyl-modified silicone polymer is about 500, and the molecular weight of the hydrogen-modified silicone polymer is about 450.
7. The method as claimed in claim 6 , wherein forming the internal filler includes cross-linking the alkenyl-modified silicone polymer and the hydrogen-modified silicone polymer in an addition cure reaction.
8. The method as claimed in claim 7 , wherein the addition cure reaction is performed at a temperature of about 80° C. to about 150° C.
9. The method as claimed in claim 7 , wherein the addition cure reaction is performed in a presence of a metal catalyst.