IP Library Granted Patent US 8,978,987
Granted Patent B2
US 8,978,987 · App. 11/468,816 · Granted Mar 17, 2015

Contactless integrated circuit device

Inventor: Michele Scarlatella (Naples, IT)
Assignee: STMicroelectronics International N.V.
G06K19/07749H01Q1/22H01Q1/2225H01Q1/52H01Q7/00
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Quick Facts
Patent No.
US 8,978,987
App. No.
11/468,816
Granted
Mar 17, 2015
Kind
B2
Abstract

An electronic device includes an integrated circuit linked to a coil antenna forming at least a spiral having opposite ends connected to the integrated circuit, and a plate support for supporting the integrated circuit and the coil antenna. The plate support is conductive and open ring shaped, wherein the internal circumference of the ring is concentric to the spiral. The opening of the ring is obtained by a cut through the plate support. The coil antenna is fastened to and isolated from the plate support through an insulating material. The cut and the plate support are filled by the same insulating material.

Claims (35)

1. An electronic device comprising:

an integrated circuit;

a coil antenna forming at least one spiral and having opposite ends coupled to said integrated circuit;

a rigid plate support for supporting said integrated circuit and said coil antenna, and having a central aperture therethrough with said coil antenna around an external perimeter of the central aperture;

said rigid plate support comprising a conductive material and having a lateral cut extending towards the central aperture resulting in said rigid plate support forming an open ring or C-shape;

an insulating layer between said rigid plate support and said coil antenna, with said insulating layer being non-conductive and directly contacting said coil antenna; and

an insulating material filling the lateral cut to maintain continuity between said rigid plate support and the lateral cut therein, as well as to maintain said rigid support plate in a planar and rigid position;

said rigid support plate and said insulating material filling the lateral cut therein supporting an entire length of said coil antenna.

2. An electronic device according to claim 1 further comprising a non-conductive frame, and wherein said integrated circuit and said coil antenna are inside said non-conductive frame.

3. An electronic device according to claim 2 further comprising an insulating material, and wherein said rigid plate support is coupled through said insulating material to said non-conductive frame.

4. An electronic device according to claim 1 wherein the central aperture in said rigid plate support has a rectangular-shape.

5. An electronic device according to claim 1 wherein said rigid plate support and the central aperture substantially forms an open frame structure.

6. An electronic device comprising:

an integrated circuit;

a coil antenna forming at least one spiral coupled to said integrated circuit;

a rigid conductive plate support for supporting said integrated circuit and said coil antenna, and having an aperture therethrough with said coil antenna around an external perimeter of the aperture;

said rigid conductive plate support comprising a conductive material and including an opening extending from an outer edge thereof to the aperture;

an insulating layer between said rigid conductive plate support and said coil antenna, with said insulating layer being non-conductive; and

an insulating material filling the opening to maintain continuity between said rigid conductive plate support and the opening therein, as well as to maintain said rigid support plate in a planar and rigid position;

said rigid support plate and said insulating material filling the lateral cut therein supporting an entire length of said coil antenna.

7. An electronic device according to claim 6 further comprising a non-conductive frame, and wherein said integrated circuit, said insulating layer and said coil antenna are inside said non-conductive frame.

8. An electronic device according to claim 7 further comprising an insulating material, and wherein said rigid conductive plate support is coupled through said insulating material to said non-conductive frame.

9. An electronic device according to claim 6 wherein the aperture in said rigid conductive plate support has a rectangular-shape.

10. An electronic device according to claim 6 wherein said rigid conductive plate support and the aperture substantially forms an open frame structure.

11. A method for making an electronic device comprising:

providing a coil antenna forming at least one spiral and coupled to an integrated circuit;

supporting the integrated circuit and the coil antenna on a rigid plate support comprising a conductive material, and with the rigid plate support having a central aperture therethrough with the coil antenna around an external perimeter of the central aperture;

providing an insulating layer between the rigid plate support and the coil antenna, with the insulating layer being non-conductive and directly contacting the coil antenna;

forming a lateral cut in the rigid plate support extending towards the central aperture resulting in the rigid plate support forming an open ring or C-shape; and

filling the lateral cut with an insulating material to maintain continuity between the rigid plate support and the lateral cut therein, as well as to maintain the rigid support plate in a planar and rigid position;

the rigid support plate and the insulating material filling the lateral cut therein supporting an entire length of the coil antenna.

12. A method according to claim 11 further comprising laminating the integrated circuit and the coil antenna inside a non-conductive frame.

13. A method according to claim 12 further comprising coupling the rigid plate support through insulating material to the non-conductive frame.

14. A method according to claim 11 wherein the aperture in the rigid plate support has a rectangular-shape.

15. A method according to claim 11 wherein the rigid plate support and the aperture substantially forms an open frame structure.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2013
From: INCARD SA
To: STMICROELECTRONICS N.V.
Reel/Frame 030669/0192 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2013
From: STMICROELECTRONICS N.V.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 030669/0257 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2007
From: SCARLATELLA, MICHELE
To: INCARD SA
Reel/Frame 019008/0493 →
Priority Claims (1)
EP 05018926 · Aug 31, 2005 · regional
Continuity (1)
Related Publication 20070145155A1 · Jun 28, 2007