Lighting module

1. A lighting module comprising:

at least one light emitting device arranged on a first carrier;

driving electronics for driving said at least one light emitting device arranged on a second carrier; and

an optical interface for outputting light emitted by said at least one light emitting device,

wherein said second carrier is arranged in a plane substantially parallel to said first carrier,

wherein said first and second carriers are configured such that a projection of said first carrier onto said plane is substantially non-overlapping with the second carrier so as to form a non-overlapping region, wherein said driving electronics is at least partially arranged in said non-overlapping region, further comprising a heat conducting element that has a first side having a surface with a protrusion, wherein the first carrier is arranged on top of the protrusion, and the second carrier is arranged on a portion of the surface that surrounds the protrusion, wherein a second side of the heat conducting element defines a thermal interface for thermally connecting said first and second carriers to a heat sink.

2. A lighting module according to claim 1 , wherein the plane in which the second carrier is arranged is displaced from said first carrier in a direction away from the optical interface.

3. A lighting module according to claim 1 , wherein the optical interface includes a reflecting structure arranged to reflect light emitted by said at least one light emitting device, said reflecting structure having an opening enclosing an area of the first carrier where the at least one light emitting device is arranged.

4. A lighting module according to claim 3 , wherein said second carrier is arranged outside the reflecting structure.

5. A lighting module according to claim 3 , wherein at least one of said first and second carriers is a printed circuit board.

6. A lighting module according to claim 5 , wherein said at least one light emitting device is a light emitting diode (LED).

7. A lighting module according to claim 6 , wherein said light emitting diode is mounted to the printed circuit board by means of surface mount technology.

8. A lighting module according to claim 5 , wherein said printed circuit board is configured to electrically isolate the at least one light emitting device from the heat conducting element, while thermally connecting the at least one light emitting device to the heat conducting element.

9. A lighting module according to claim 5 , wherein said driving electronics is at least partly mounted to the printed circuit board by means of through-hole technology.

10. A lighting module according to claim 9 , wherein an electrically insulating but thermally conductive layer is arranged between said second carrier and said heat conducting element.

11. A lighting module comprising:

at least one light emitting device arranged on a first carrier;

driving electronics for driving said at least one light emitting device arranged on a second carrier; and

an optical interface for outputting light emitted by said at least one light emitting device,

wherein said second carrier is arranged in a plane substantially parallel to said first carrier,

wherein said first and second carriers are configured such that a projection of said first carrier onto said plane is substantially non-overlapping with the second carrier so as to form a non-overlapping region, wherein said driving electronics is at least partially arranged in said non-overlapping region, further comprising a heat conducting element that has a first side having a surface with a protrusion, wherein the first carrier is arranged on top of the protrusion, and the second carrier is arranged on a portion of the surface that surrounds the protrusion, wherein the optical interface includes a reflecting structure arranged to reflect light emitted by said at least one light emitting device, said reflecting structure having an opening enclosing an area of the first carrier where the at least one light emitting device is arranged.