Digital microfluidic platform for actuating and heating individual liquid droplets
A digital microfluidic platform utilizes dual active matrix circuitry to actuate and heat liquid droplets on a biochip. Liquid droplets are introduced into a droplet handling area of the biochip where they can be actuated by electrodes residing in pixels of an actuating active matrix array according to the electrowetting on dielectric phenomenon and heated by heating elements residing in pixels of a heating active matrix array. Pixels of the actuating active matrix array and the heating active matrix array are independently addressable such that droplets in the droplet handling area can be selectively heated and actuated according to their location. The actuating active matrix array and heating active matrix array can be formed on the same or different substrates with the droplet handling area disposed above or between the substrates.
1. A device for manipulating droplets of fluid, comprising:
a first substrate comprising a plurality of pixels arranged in rows and columns, each pixel comprising:
a first switch coupled to an electrode, wherein each first switch is controllable to move a droplet with respect to its associated electrode; and
a second switch coupled to a heating element, wherein each second switch is controllable to heat a droplet proximate to its associated heating element;
a second substrate; and
a droplet handling area disposed between the first substrate and the second substrate, wherein the droplet handling area comprises at least one fluid input port for introducing a droplet into the droplet handling area, and at least one fluid output port for removing a droplet from the droplet handling area,
wherein the second switch is controlled independently of the first switch.
2. The device of claim 1 , wherein the droplet handling area further comprises at least one spacer between the first and second substrates.
3. The device of claim 1 , further comprising a hydrophobic layer between the first substrate and the droplet handling area.
4. The device of claim 1 , further comprising a first row and a first column coupled to each first switch, and a second row and second column coupled to each second switch.
5. The device of claim 4 , wherein the first row, first column, second row, and second column are independently controllable.
6. The device of claim 4 , wherein each first switch comprises a transistor, and wherein each second switch comprises a transistor.
7. The device of claim 1 , wherein the heating element comprises a resistor.