Semiconductor storage device and method for manufacturing the semiconductor storage device
A semiconductor-storage-device manufacturing method of the present invention is a method for manufacturing a semiconductor storage device provided with a ferroelectric capacitor including a lower electrode, a ferroelectric film, and an upper electrode, and the method includes a step of embedding a first metal plug and a second metal plug in an insulating layer; a step of forming a covering layer that covers at least the second metal plug while securing apart that comes into electric contact with the first metal plug; a step of forming a deposit structure by sequentially depositing a material for the lower electrode, a material for the ferroelectric film, and a material for the upper electrode after forming the covering layer; and a step of forming the ferroelectric capacitor by etching and removing other parts except a part of the deposit structure such that the part of the deposit structure remains on the first metal plug.
1. A semiconductor storage device comprising:
an insulating layer;
a ferroelectric capacitor disposed on the insulating layer, the ferroelectric capacitor including a lower electrode, a ferroelectric film, and an upper electrode;
an interlayer insulating film formed on the insulating layer, the interlayer insulating film having an opening at a part thereof at which the ferroelectric capacitor is disposed;
a first metal plug embedded in the insulating layer and connected to the lower electrode via the opening;
a second metal plug embedded in the insulating layer outside the ferroelectric capacitor when viewed planarly; and
a hydrogen barrier film partially covering the ferroelectric capacitor and the interlayer insulating film, wherein
an upper surface of the interlayer insulating film is in a level that is higher than a level that an upper surface of the first metal plug is in so that a step is between the upper surface of the interlayer insulating film and the upper surface of the first metal plug,
the lower electrode is formed continuously on the upper surface of the interlayer insulating film, the upper surface of the first metal plug and the step, and
the upper surface of the interlayer insulating film and the upper surface of the first metal plug are interlinked via a curved portion of the interlayer insulating film.
2. The semiconductor storage device according to claim 1 , wherein the upper surface of the first metal plug and an upper surface of the second metal plug are flush with each other.
3. The semiconductor storage device according to claim 1 , wherein the hydrogen barrier film includes a SiN film.
4. The semiconductor storage device according to claim 3 , wherein the hydrogen barrier film further includes an Al 2 O 3 film formed under the SiN film.
5. The semiconductor storage device according to claim 3 , wherein the hydrogen barrier film further includes an Al 2 O 3 film formed between the SiN film and the interlayer insulating film.
6. The semiconductor storage device according to claim 1 , further comprising a second insulating layer made of SiO 2 formed on the hydrogen barrier film.
7. The semiconductor storage device according to claim 1 , further comprising a MOSFET embedded in the insulating layer.
8. The semiconductor storage device according to claim 1 , wherein each of the ferroelectric film, the upper electrode and the lower electrode is composed of a material that is different than that of the hydrogen barrier film.
9. The semiconductor storage device according to claim 1 , wherein the interlayer insulating film, the ferroelectric capacitor and the hydrogen barrier film are stacked in that stated order along a straight line.
10. The semiconductor storage device according to claim 1 , wherein the lower electrode touches each of the upper surface of the interlayer insulating film, the upper surface of the first metal plug and the step.
11. The semiconductor storage device according to claim 1 , wherein a thickness of the lower electrode is 0.05 to 0.2 μm.
12. The semiconductor storage device according to claim 1 , wherein the step includes an inclination connecting the upper surface of the interlayer insulating film with the upper surface of the first metal plug.
13. A semiconductor storage device comprising:
an insulating layer;
a ferroelectric capacitor disposed on the insulating layer, the ferroelectric capacitor including a lower electrode, a ferroelectric film, and an upper electrode;
an interlayer insulating film formed on the insulating layer, the interlayer insulating film having an opening at a part thereof at which the ferroelectric capacitor is disposed;
a first metal plug embedded in the insulating layer and connected to the lower electrode via the opening; and
a hydrogen barrier film partially covering the ferroelectric capacitor and the interlayer insulating film, wherein
an upper surface of the interlayer insulating film is in a level that is higher than a level that an upper surface of the first metal plug is in so that a step is between the upper surface of the interlayer insulating film and the upper surface of the first metal plug,
the lower electrode is formed continuously on the upper surface of the interlayer insulating film, the upper surface of the first metal plug and the step, and
the upper surface of the interlayer insulating film and the upper surface of the first metal plug are interlinked via a curved portion of the interlayer insulating film.
14. The semiconductor storage device according to claim 13 , wherein the lower electrode touches each of the upper surface of the interlayer insulating film, the upper surface of the first metal plug and the step.
15. A semiconductor storage device comprising:
an insulating layer;
a ferroelectric capacitor disposed on the insulating layer, the ferroelectric capacitor including a lower electrode, a ferroelectric film, and an upper electrode;
an interlayer insulating film formed on the insulating layer, the interlayer insulating film having an opening at a part thereof at which the ferroelectric capacitor is disposed;
a first metal plug embedded in the insulating layer and connected to the lower electrode via the opening; and
a hydrogen barrier film on the ferroelectric capacitor and the interlayer insulating film, wherein
an upper surface of the interlayer insulating film is disposed in a position higher than a position of an upper surface of the first metal plug,
the lower electrode being formed continuously on the upper surface of the interlayer insulating film, the upper surface of the first metal plug and the between the upper surface of the interlayer insulating film and the upper surface of the first metal plug, and
a curved portion of the interlayer insulating film being between the upper surface of the interlayer insulating film and the upper surface of the first metal plug.