Ridged integrated heat spreader
An integrated circuit package is presented. In an embodiment, the integrated circuit package has a package substrate, an integrated circuit die attached to the package substrate, and a package level heat dissipation device, such as an integrated heat spreader, attached to the package substrate encapsulating the integrated circuit die. The package level heat dissipation device has a top side with a ridge formed on top of a perimeter of the top side, and a bottom side that couples to the integrated circuit die.
1. An integrated heat spreader (IHS), comprising:
a bottom side configured to be thermally coupled to an integrated circuit die; and
a top side configured to be coupled to a component level heat dissipation device, wherein at least a portion of a perimeter of the top side is elevated relative to an interior portion of the top side and wherein the top side of the IHS further comprises one or more elevated sections in an interior portion of the top side to form a plurality of cavities on the top side of the IHS.
2. The IHS of claim 1 , wherein the top side of the IHS further comprises an elevated circular section at a center of the top side to form a ring shape cavity.
3. The IHS of claim 1 , wherein the perimeter is elevated to a height of less than 2 mils above an interior portion of the top side of the IHS.
4. The IHS of claim 1 , wherein the perimeter is elevated by one of stamping, machining, or die casting.
5. The IHS of claim 1 , wherein the IHS is made of a material selected from the group consisting of copper and diamond.
6. An integrated heat spreader (IHS), comprising:
a bottom side configured to be thermally coupled to an integrated circuit die; and
a top side configured to be coupled to a component level heat dissipation device, wherein at least a portion of a perimeter of the top side is elevated relative to an interior portion of the top side and wherein the top side of the IHS further comprises an elevated circular section at a center of the top side to form a ring shape cavity.
7. The IHS of claim 6 , wherein the perimeter is elevated to a height of less than 2 mils above an interior portion of the top side of the IHS.
8. The IHS of claim 6 , wherein the perimeter is elevated by one of stamping, machining, or die casting.
9. The IHS of claim 6 , wherein the IHS is made of a material selected from the group consisting of copper and diamond.
10. An integrated heat spreader (IHS), comprising:
a bottom side configured to be thermally coupled to an integrated circuit die; and
a top side configured to be coupled to a component level heat dissipation device, wherein at least a portion of a perimeter of the top side is elevated relative to an interior portion of the top side and wherein the top side further comprises an interior island ridge.
11. The IHS of claim 10 , wherein the top side of the IHS further comprises one or more elevated sections in an interior portion of the top side to form a plurality of cavities on the top side of the IHS.
12. The IHS of claim 10 , wherein the perimeter is elevated to a height of less than 2 mils above an interior portion of the top side of the IHS.
13. The IHS of claim 10 , wherein the perimeter is elevated by one of stamping, machining, or die casting.
14. The IHS of claim 10 , wherein the IHS is made of a material selected from the group consisting of copper and diamond.