IP Library Granted Patent US 8,984,305
Granted Patent B2
US 8,984,305 · App. 13/118,183 · Granted Mar 17, 2015

Method and apparatus to configure thermal design power in a microprocessor

Inventors: Eric Distefano (Livermore, CA); Guy M. Therien (Beaverton, OR); Vasudevan Srinivasan (Hillsboro, OR); Tawfik Rahal-Arabi (Tigard, OR); Venkatesh Ramani (Milpitas, CA); Ryan D. Wells (Folsom, CA); Steven H. Gunther (Beaverton, OR); Jeremy Shrall (Portland, OR); James Hermerding, II (San Jose, CA)
Assignee: Intel Corporation
G06F1/206
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Quick Facts
Patent No.
US 8,984,305
App. No.
13/118,183
Granted
Mar 17, 2015
Kind
B2
Abstract

A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.

Claims (31)

1. A processor comprising:

one or more new model specific registers (MSRs) which support a configurable thermal design power (TDP) to be specified for the processor;

logic to change a configurable TDP value, including updating a runtime average power limit (RAPL) value as part of the configurable TDP change, in response to a platform facilitated user control trigger, wherein the logic uses platform software to intercept the user control trigger and convert it to a basic input/output software (BIOS) call to cause the configurable TDP change and the platform is to facilitate an Advanced Configuration and Power Interface (ACPI) notification to an operating system to evaluate a Performance Present Capabilities (PPC) object.

2. The processor of claim 1 , wherein the logic is to change the configurable TDP value in response to a power supply change from alternating current (AC) to direct current (DC) or vice versa.

3. The processor of claim 1 , wherein the logic is to change the configurable TDP value, including a turbo ratio value, in response to a docking event.

4. The processor of claim 1 , wherein the configurable TDP value is to change from an initially configured TDP value in response to the user control trigger.

5. The processor of claim 1 , wherein the configurable TDP value is to be changed in response to storing information in at least one model specific register (MSR).

6. The processor of claim 1 , wherein changing the configurable TDP value causes a corresponding change in a turbo mode target frequency.

7. The processor of claim 1 , wherein the configurable TDP value is to change in response to a change in ambient temperature.

8. A system comprising:

a processor comprising:

a plurality of logical processors, and

one or more model specific registers (MSRs) which support a configurable thermal design power (TDP) to be specified for the processor;

logic to change a configurable TDP value, including updating a runtime average power limit (RAPL) value as part of the configurable TDP change, in response to user control, wherein the logic uses platform software to intercept the user control and convert it to a basic input/output software (BIOS) call to cause the configurable TDP change, which causes a platform facilitated notification to be issued to an operating system to evaluate a Performance Present Capabilities (PPC) object under each of the plurality of logical processors; and

memory to store instructions to be performed by the processor.

9. The system of claim 8 , wherein the logic is to change the configurable TDP value in response to a power supply change from alternating current (AC) to direct current (DC) or vice versa.

10. The system of claim 8 , wherein the logic is to change the configurable TDP value, including a turbo ratio value, in response to a docking event.

11. The system of claim 8 , wherein the configurable TDP value is to change from an initially configured TDP value in response to the user control.

12. The system of claim 8 , wherein the configurable TDP value is to be changed in response to storing information in at least one model specific register (MSR).

13. The system of claim 8 , wherein changing the configurable TDP value causes a corresponding change in a turbo mode target frequency.

14. The system of claim 8 , wherein the configurable TDP value is to change in response to a change in ambient temperature, thermal, acoustic, or system environmental condition.

15. A method comprising:

changing, via one or more model specific registers (MSRs) for a processor, a configurable processor thermal design power (TDP) value, including updating a runtime average power limit (RAPL) value as part of the configurable TDP change, in response to user control;

using platform software to intercept the user control and convert it to a basic input/output software (BIOS) call to cause the configurable TDP change; and

causing an operating system, as part of the configurable TDP change, to evaluate an Advanced Configuration and Power Interface (ACPI) Performance Present Capabilities (PPC) object under each of a plurality of logical processors.

16. The method of claim 15 , further comprising changing the configurable TDP value in response to a power supply change from alternating current (AC) to direct current (DC) or vice versa.

17. The method of claim 15 , further comprising changing the configurable TDP value, including a turbo ratio value, in response to a docking event.

18. The method of claim 15 , wherein the configurable TDP value is to change from an initially configured TDP value in response to the user control.

19. The method of claim 15 , wherein the configurable TDP value is to be changed in response to storing information in at least one model specific register (MSR).

20. The method of claim 15 , wherein changing the configurable TDP value causes a corresponding change in a turbo mode target frequency.

21. The method of claim 15 , wherein the configurable TDP value is to change in response to a change in ambient temperature.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2011
From: DISTEFANO, ERIC; THERIEN, GUY M.; SRINIVASAN, VASUDEVAN; RAHAL-ARABI, TAWFIK; RAMANI, VENKATESH; WELLS, RYAN D.; GUNTHER, STEPHEN H.; SHRALL, JEREMY; HERMERDING II, JAMES G.
To: INTEL CORPORATION
Reel/Frame 026525/0812 →
Continuity (2)
Continuation In Part 12974100 · Dec 21, 2010
Related Publication 20120159201A1 · Jun 21, 2012