IP Library Granted Patent US 8,987,795
Granted Patent B2
US 8,987,795 · App. 13/961,456 · Granted Mar 24, 2015

Solid-state imaging device and imaging apparatus

Inventor: Jun Aoki (Tokyo, JP)
Assignee: Olympus Corporation
H01L27/14627H01L27/1461H01L27/14612H01L27/14629H01L27/14634H01L27/14636H01L27/14621
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Quick Facts
Patent No.
US 8,987,795
App. No.
13/961,456
Granted
Mar 24, 2015
Kind
B2
Abstract

A first substrate has a plurality of photoelectric conversion units arranged in two dimensions. A second substrate has a plurality of photoelectric conversion units arranged in two dimensions. A plurality of photoelectric conversion units are arranged in a region of the second substrate corresponding to a region of the first substrate where one photoelectric conversion unit is arranged. The imaging signals based on signal charges stored in the photoelectric conversion units and the light field signals based on signal charges stored in the photoelectric conversion units are read.

Claims (45)

1. A solid-state imaging device comprising:

a first substrate which has a plurality of first photoelectric conversion units arranged in two dimensions;

a second substrate which has a plurality of second photoelectric conversion units arranged in two dimensions and is stacked on the first substrate; and

a selector which selects the angle of a light ray that is transmitted through the first substrate and is incident on the second photoelectric conversion units,

wherein the plurality of second photoelectric conversion units are arranged in a region of the second substrate corresponding to a region of the first substrate where one first photoelectric conversion unit among the plurality of first photoelectric conversion units is arranged, and

wherein imaging signals based on signal charges stored in the first photoelectric conversion units are read and light field signals based on signal charges stored in the second photoelectric conversion units are read.

2. The solid-state imaging device according to claim 1 ,

wherein the first substrate further includes a transmission unit that transfers the signal charges to the second substrate, and

wherein the second substrate further includes:

a first reading unit that reads the imaging signals transferred by the transmission unit; and

a second reading unit that reads the light field signals.

3. The solid-state imaging device according to claim 1 , further comprising:

a third substrate,

wherein the first substrate further includes a first transmission unit that transfers the signal charges to the second substrate,

wherein the second substrate further includes:

a second transmission unit that transfers the signal charges transferred by the first transmission unit to the third substrate; and

a third transmission unit that transfers the signal charges stored in the second photoelectric conversion units to the third substrate, and

wherein the third substrate includes:

a first reading unit that reads the imaging signals based on the signal charges transferred by the second transmission unit; and

a second reading unit that reads the light field signals based on the signal charges transferred by the third transmission unit.

4. The solid-state imaging device according to claim 1 ,

wherein the selector includes:

a micro lens that is provided on the first substrate and condenses light incident on the first photoelectric conversion units; and

a light pipe that is provided at the first substrate and guides the light condensed by the micro lens to a region of the second substrate where the second photoelectric conversion units are arranged.

5. The solid-state imaging device according to claim 2 ,

wherein the selector includes:

a micro lens that is provided on the first substrate and condenses light incident on the first photoelectric conversion units; and

a light pipe that is provided at the first substrate and guides the light condensed by the micro lens to a region of the second substrate where the second photoelectric conversion units are arranged.

6. The solid-state imaging device according to claim 3 ,

wherein the selector includes:

a micro lens that is provided on the first substrate and condenses light incident on the first photoelectric conversion units; and

a light pipe that is provided at the first substrate and guides the light condensed by the micro lens to a region of the second substrate where the second photoelectric conversion units are arranged.

7. The solid-state imaging device according to claim 4 ,

wherein the light pipe is an insulator.

8. The solid-state imaging device according to claim 5 ,

wherein the light pipe is an insulator.

9. The solid-state imaging device according to claim 6 ,

wherein the light pipe is an insulator.

10. An imaging apparatus comprising:

a solid-state imaging device including:

a first substrate which has a plurality of first photoelectric conversion units arranged in two dimensions;

a second substrate which has a plurality of second photoelectric conversion units arranged in two dimensions and is stacked on the first substrate; and

a selector which selects the angle of a light ray that is transmitted through the first substrate and is incident on the second photoelectric conversion units,

wherein the plurality of second photoelectric conversion units are arranged in a region of the second substrate corresponding to a region of the first substrate where one first photoelectric conversion unit among the plurality of first photoelectric conversion units is arranged, and

wherein imaging signals based on signal charges stored in the first photoelectric conversion units are read and light field signals based on signal charges stored in the second photoelectric conversion units are read.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 27, 2016
From: OLYMPUS CORPORATION
To: OLYMPUS CORPORATION
Reel/Frame 039344/0502 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2013
From: AOKI, JUN
To: OLYMPUS CORPORATION
Reel/Frame 030963/0666 →
Priority Claims (1)
JP 2012-178741 · Aug 10, 2012 · national
Continuity (1)
Related Publication 20140042577A1 · Feb 13, 2014