Organic electroluminescent device
The invention provides an OLED device with improved light out-coupling, which can be manufactured easy and reliable at low costs, which comprises an electroluminescent layer stack ( 2, 3, 4 ) on top of a substrate ( 1 ), where the electroluminescent layer stack ( 2, 3, 4 ) comprises an organic light-emitting layer stack ( 3 ) with one or more organic layers sandwiched between a first electrode ( 2 ) facing towards the substrate ( 1 ) and a 10 second electrode ( 4 ), where the second electrode ( 4 ) comprises a layer stack of at least a transparent conductive protection layer ( 41 ) on top of the organic light-emitting layer stack ( 3 ), a transparent organic conductive buckling layer ( 42 ) on top of the protection layer ( 41 ) having a glass transition temperature lower than the lowest glass transition temperature of the organic layers within the organic light-emitting layer stack ( 3 ) and a stress inducing layer 15 ( 43 ) on top of the buckling layer ( 42 ) to introduce stress to the buckling layer ( 42 ). The invention further relates to a method to manufacture such OLED devices with heating the electroluminescent layer ( 2, 3, 4 ) stack to a temperature, which is above the glass transition temperature of the buckling layer ( 42 ) and below the lowest glass transition temperature of the organic layers within the organic light-emitting layer stack ( 3 ) for a time period sufficient 20 to obtain buckles (B) within the buckling layer ( 42 ).
1. An organic electroluminescent device comprising an electroluminescent layer stack on top of a substrate, where the electroluminescent layer stack comprises an organic light-emitting layer stack with one or more organic layers sandwiched between a first electrode facing towards the substrate and a second electrode, where the second electrode comprises a layer stack of at least a transparent conductive protection layer on top of the organic light-emitting layer stack, a transparent organic conductive buckling layer disposed on top of the transparent conductive protection layer, the transparent organic conductive buckling layer having a glass transition temperature lower than the lowest glass transition temperature of the organic layers within the organic light-emitting layer stack, and a reflective stress inducing layer on top of the buckling layer to introduce stress to the buckling layer.
2. The organic electroluminescent device as claimed in claim 1 , wherein the stress inducing layer is an aluminum layer.
3. The organic electroluminescent device as claimed in claim 2 , wherein the stress inducing layer has a thickness larger than 5 nm.
4. The organic electroluminescent device as claimed in claim 2 , wherein the protection layer comprises a metal oxide.
5. The organic electroluminescent device as claimed in claim 2 , wherein the protection layer has a thickness larger than 20 nm.
6. The organic electroluminescent device as claimed in claim 2 , wherein the buckling layer has a glass transition temperature which is at least 30° C. less than the lowest glass transition temperature of the organic layers within the organic light-emitting layer stack.
7. The organic electroluminescent device as claimed in claim 2 wherein the buckling layer comprises a suitable amount of conductive material doped to the buckling layer in order to enhance the electrical conductivity of the buckling layer.
8. The organic electroluminescent device as claimed in claim 2 wherein the buckling layer has a layer thickness of more than 20 nm.
9. The organic electroluminescent device as claimed in claim 2 , wherein the second electrode further comprises a stress enhancement layer deposited on top of the stress inducing layer having a larger internal stress than the stress inducing layer.
10. The organic electroluminescent device as claimed in claim 9 , wherein the stress enhancement layer is a metal layer made of Mn, Cu, Cr or mixtures thereof.
11. The organic electroluminescent device as claimed in claim 10 , wherein a current distribution layer is deposited on top of the second electrode, and wherein the current distribution layer comprises aluminum or copper.
12. A method to manufacture an organic electroluminescent device as claimed in claim 1 , comprising:
depositing the second electrode comprising a layer stack of at least a transparent conductive protection layer, a transparent organic conductive buckling layer and a stress inducing layer, on top of the organic light-emitting layer stack, and
heating the electroluminescent layer stack to a temperature, which is above the glass transition temperature of the buckling layer and below the lowest glass transition temperature of the organic layers within the organic light-emitting layer stack for a time period sufficient to obtain buckles within the buckling layer.
13. The method as claimed in claim 12 , further comprising the step of stamping the buckling layer with a pre-shaped buckling tool during the heating step in order to introduce buckles into the buckling layer.
14. The method as claimed in claim 12 , further comprising the step of depositing a stress enhancement layer on top of the stress inducing layer before heating the electroluminescent layer stack.
15. The method as claimed in claim 14 , further comprising the step of thickening the second electrode by depositing a current distribution layer on top of the second electrode after the heating step.
16. The organic electroluminescent device as claimed in claim 2 , wherein the stress inducing layer has a thickness between 10 nm and 25 nm.
17. The organic electroluminescent device as claimed in claim 2 , wherein the buckling layer has a layer thickness between 50 nm and 100 nm.
18. A device, comprising:
a first electrode disposed on a substrate;
an organic light-emitting layer stack disposed on the first electrode, wherein the organic light-emitting layer stack includes one or more organic layers; and
a second electrode disposed on the organic light-emitting layer stack, wherein the second electrode comprises:
a transparent conductive protection layer disposed on the organic light-emitting layer stack,
a transparent organic conductive buckling layer disposed on the protection layer, wherein the transparent organic conductive buckling layer has a plurality of buckles formed therein and has a glass transition temperature which is less than the lowest glass transition temperature of the organic layers within the organic light-emitting layer stack, and
a stress inducing layer disposed on the buckling layer.
19. The device of claim 18 , wherein the buckling layer has a glass transition temperature that is at least 30° C. less than the lowest glass transition temperature of the organic layers within the organic light-emitting layer stack.
20. The device of claim 18 , further comprising a current distribution layer disposed on the second electrode, wherein the current distribution layer comprises aluminum or copper.