Socket and electronic device test apparatus
A socket which enables occurrence of contact defects to be suppressed is provided. A socket 11 to which a test carrier 20 , which has: a base film 32 on which bumps 324 are formed for contact with electrode pads 51 of a die 50 ; and external terminals 312 which are electrically connected to the bumps 324 , is electrically connected comprises: contactors 125 which contact external terminals 312 ; and an elastic member 131 which pushes against bump-forming portions 32 a and bump-surrounding portions 32 b on the base film 32 . The elastic member 131 has: a first elastic layer 132 ; and a second elastic layer 133 which is more flexible than the first elastic layer 132 , and a second elastic layer 133 is laid over the first elastic layer 132 and contacts the base film 32.
1. A socket to which a test carrier is electrically connected, the test carrier which has: a film-shaped first member on which at least one internal terminal which contacts at least one electrode of an electronic device is formed; and at least one external terminal which is electrically connected to the internal terminal,
the socket comprising:
at least one contactor which contacts the external terminal; and
a first pusher which pushes a portion of the first member where the internal terminal is formed and a portion of the first member surrounding the internal terminal, wherein
the first pusher has:
a first elastic member; and
a second elastic member which is softer than the first elastic member, is laid over the first elastic member, and contacts the first member.
2. The socket as set forth in claim 1 , wherein the second elastic member has a front surface which has a projecting shape which gradually becomes higher with distance to a center of the projecting shape.
3. An electronic device test apparatus which tests an electronic device which is temporarily mounted to the test carrier,
the electronic device test apparatus comprising:
a socket as set forth in claim 1 ;
a contacting device which brings the external terminal and the contactor into contact; and
a second pusher which pushes the test carrier from a direction opposite to the pushing direction of the first pusher.
4. The electronic device test apparatus as set forth in claim 3 , wherein
the second pusher pushes a second member of the test carrier which holds the electronic device with a first member.
5. The electronic device test apparatus as set forth in claim 3 , wherein
the electronic device is a die which is diced from a semiconductor wafer.